Iibhodi zesekethe eziprintiweyo (PCBs) zenza isiseko esisisiseko esixhasa ngokwasemzimbeni kwaye siqhagamshele nge-elektroniki amacandelo e-elektroniki kusetyenziswa imikhondo yobhedu eqhubayo kunye neepads ezibotshelelwe kwi-non-conductive substrate. Ii-PCBs zibalulekile kwisixhobo ngasinye sombane, esenza ukuba kuphunyezwe nolona yilo luntsonkothileyo lwesekethe lube ziifomathi ezidityanisiweyo kunye nemveliso enkulu. Ngaphandle kobuchwephesha be-PCB, ishishini lombane ngekhe libekho njengoko silazi namhlanje.
Inkqubo yokwenziwa kwe-PCB iguqula imathiriyeli ekrwada njengelaphu le-fiberglass kunye nefoyile yobhedu zibe ziibhodi zobunjineli ezichanekileyo. Ibandakanya ngaphezulu kwamanyathelo antsonkothileyo angaphezulu kweshumi elinesihlanu ukusebenzisa i-automation ephucukileyo kunye nolawulo olungqongqo lwenkqubo. Ukuqukuqela kwenkqubo kuqala ngokubamba isikimu kunye noyilo loqhagamshelo lwesekethe kwisoftware ye-electronic design automation (EDA). Iimaski zomsebenzi wobugcisa zichaza iindawo zomkhondo ezibonisa ngokukhethayo iilaminayithi zobhedu ezibonayo zisebenzisa ifotolithographic imaging. I-Etching isusa ubhedu olungavezwanga ukushiya ngasemva iindlela zokuqhuba ezizimeleyo kunye neepads zoqhagamshelwano.
Iibhodi ezinomaleko amaninzi zidibanisa isandwich kunye ne-copper clad eqinileyo kunye ne-prepreg bonding sheets, ukudibanisa imikhondo phezu koxinzelelo oluphezulu kunye nobushushu. Oomatshini bokomba bathwele amawakawaka emingxuma emikroskopu edibana phakathi kweeleya, ethi emva koko igqitywe ngobhedu ukugqibezela isiseko sesekethe ye-3D. Ukugrumba okwesibini, ukucwenga, kunye nokuhambisa ezinye iibhodi zihlengahlengise de zilungele ukugquma kwesikrini sesilika. Ukuhlolwa kwe-optical ngokuzenzekelayo kunye novavanyo luqinisekisa ngokuchasene nemithetho yoyilo kunye neenkcukacha ngaphambi kokunikezelwa kwabathengi.
Iinjineli ziqhuba iinguqulelo eziqhubekayo ze-PCB ezenza ukuba i-denser, ikhawuleze, kwaye ithembeke ngakumbi kwi-elektroniki. Uqhagamshelo oluphezulu loxinaniso (HDI) kunye nabuphi na ubuchwephesha bomaleko ngoku budibanisa ngaphezulu kweeleya ezingama-20 ukuya kwindlela entsonkothileyo yenkqubo yedijithali kunye neenkqubo zerediyo zerediyo (RF). Iibhodi eziguquguqukayo eziqinileyo zidibanisa izinto eziqinileyo kunye neziguquguqukayo ukuze zihlangabezane neemfuno ezifunekayo zemilo. I-Ceramic kunye ne-insulation metal backing (IMB) substrates zixhasa iifrikhwensi eziphezulu ezigqithisileyo ukuya kuthi ga kwimillimeter-wave RF. Eli shishini likwamkele iinkqubo kunye nemathiriyeli ehambelana nokusingqongileyo ukuze uzinze.
Imveliso ye-PCB yehlabathi jikelele idlula i-75 yeebhiliyoni zeedola kubavelisi abangaphezu kwe-2,000, ikhule kwi-CAGR eyi-3.5% ngokwembali. Ukuqhekeka kwemarike kuhlala kuphezulu nangona udibaniso luqhubeka kancinci kancinci. I-China imele isiseko esikhulu semveliso enesabelo esingaphezulu kwe-55% ngelixa i-Japan, i-Korea ne-Taiwan zilandela ngaphezu kwe-25% ngokuhlangeneyo. UMntla Melika ubalelwa ngaphantsi kwe-5% yemveliso yehlabathi. Ubume beshishini butshintshela kuncedo lwase-Asiya kwisikali, iindleko, kunye nokusondela kumakhonkco obonelelo nge-elektroniki. Nangona kunjalo, amazwe agcina amandla e-PCB engingqi axhasa ukhuseleko kunye novelwano lwepropathi enomgangatho ophezulu wokuqonda.
Njengoko izinto ezitsha kwizixhobo zabathengi zikhula, usetyenziso oluvelayo kwiziseko zonxibelelwano, ukufakelwa kombane kwezothutho, i-automation, i-aerospace, kunye neenkqubo zonyango zikhuthaza ukukhula koshishino lwePCB ixesha elide. Uphuculo oluqhubekayo lwetekhnoloji lukwanceda ukwandisa i-electronics ngokubanzi ngakumbi kwiimeko zokusetyenziswa kwemizi-mveliso nezorhwebo. Ii-PCBs ziya kuqhubeka nokusebenzela uluntu lwethu lwedijithali kunye nolukrelekrele kumashumi eminyaka ezayo.