Iziseko ze-Electronics zanamhlanje: Intshayelelo yeTekhnoloji yeBhodi yeSekethe eShicileleyo

Iibhodi zesekethe eziprintiweyo (PCBs) zenza isiseko esisisiseko esixhasa ngokwasemzimbeni kwaye siqhagamshele nge-elektroniki amacandelo e-elektroniki kusetyenziswa imikhondo yobhedu eqhubayo kunye neepads ezibotshelelwe kwi-non-conductive substrate.IiPCB zibalulekile kwisixhobo ngasinye sombane, esenza ukuba kuphunyezwe nolona yilo lwesekethe luntsonkothileyo lube ziifomathi ezidityanisiweyo kunye nemveliso enkulu.Ngaphandle kobuchwephesha be-PCB, ishishini lombane ngekhe libekho njengoko silazi namhlanje.

Inkqubo yokwenziwa kwe-PCB iguqula imathiriyeli ekrwada njengelaphu le-fiberglass kunye nefoyile yobhedu zibe ziibhodi zobunjineli ezichanekileyo.Ibandakanya ngaphezulu kwamanyathelo antsonkothileyo angaphezulu kweshumi elinesihlanu ukusebenzisa i-automation ephucukileyo kunye nolawulo lwenkqubo olungqongqo.Ukuqukuqela kwenkqubo kuqala ngokubamba isikimu kunye noyilo loqhagamshelwano lwesekethe kwisoftware ye-electronic design automation (EDA).Iimaski zomsebenzi wobugcisa zichaza iindawo zomkhondo ezibonisa ngokukhethayo iilaminayithi zobhedu ezibonayo zisebenzisa ifotolithographic imaging.I-Etching isusa ubhedu olungavezwanga ukushiya ngasemva iindlela zokuqhuba ezizimeleyo kunye neepads zoqhagamshelwano.

Iibhodi ezinomaleko amaninzi zidibanisa isandwich kunye ne-copper clad eqinileyo kunye ne-prepreg bonding sheets, ukudibanisa imikhondo phezu koxinzelelo oluphezulu kunye nobushushu.Oomatshini bokomba bathwele amawakawaka emingxuma emikroskopu edibana phakathi kweeleya, ethi emva koko igqitywe ngobhedu ukugqibezela isiseko sesekethe ye-3D.Ukugrumba okwesibini, ukucwenga, kunye nokuhambisa ezinye iibhodi zihlengahlengise de zilungele ukugquma kwesikrini sesilika.Ukuhlolwa kwe-optical ngokuzenzekelayo kunye novavanyo luqinisekisa ngokuchasene nemithetho yoyilo kunye neenkcukacha ngaphambi kokunikezelwa kwabathengi.

Iinjineli ziqhuba iinguqulelo eziqhubekayo ze-PCB ezenza ukuba i-denser, ikhawuleze, kwaye ithembeke ngakumbi kwi-elektroniki.Uqhagamshelo oluphezulu loxinaniso (HDI) kunye nabuphi na ubuchwephesha bomaleko ngoku budibanisa ngaphezulu kweeleya ezingama-20 ukuya kwindlela entsonkothileyo yenkqubo yedijithali kunye neenkqubo zerediyo zerediyo (RF).Iibhodi eziguquguqukayo eziqinileyo zidibanisa izinto eziqinileyo kunye neziguquguqukayo ukuze zihlangabezane neemfuno ezifunekayo zemilo.I-Ceramic kunye ne-insulation metal backing (IMB) substrates zixhasa iifrikhwensi eziphezulu ezigqithisileyo ukuya kuthi ga kwimillimeter-wave RF.Eli shishini likwamkele iinkqubo kunye nemathiriyeli ehambelana nokusingqongileyo ukuze uzinze.

Imveliso ye-PCB yehlabathi jikelele idlula i-75 yeebhiliyoni zeedola kubavelisi abangaphezu kwe-2,000, ikhule kwi-CAGR eyi-3.5% ngokwembali.Ukuqhekeka kwemarike kuhlala kuphezulu nangona udibaniso luqhubeka kancinci kancinci.I-China imele isiseko esikhulu semveliso enesabelo esingaphezulu kwe-55% ngelixa i-Japan, i-Korea ne-Taiwan zilandela ngaphezu kwe-25% ngokuhlangeneyo.UMntla Melika ubalelwa ngaphantsi kwe-5% yemveliso yehlabathi.Ubume beshishini butshintshela kuncedo lwase-Asiya kwisikali, iindleko, kunye nokusondela kumakhonkco obonelelo nge-elektroniki.Nangona kunjalo, amazwe agcina amandla e-PCB engingqi axhasa ukhuseleko kunye novelwano lwepropathi enomgangatho ophezulu wokuqonda.

Njengoko izinto ezitsha kwizixhobo zabathengi zikhula, usetyenziso oluvelayo kwiziseko zonxibelelwano, ukufakelwa kombane kwezothutho, i-automation, i-aerospace, kunye neenkqubo zonyango zikhuthaza ukukhula koshishino lwePCB ixesha elide.Uphuculo oluqhubekayo lwetekhnoloji lukwanceda ukwandisa i-electronics ngokubanzi ngakumbi kwiimeko zokusetyenziswa kwemizi-mveliso nezorhwebo.Ii-PCBs ziya kuqhubeka nokusebenzela uluntu lwethu lwedijithali kunye nolukrelekrele kumashumi eminyaka ezayo.