uvavanyo lwebhodi PCBAlinyathelo eliphambili lokuqinisekisa ukuba umgangatho ophezulu, uzinzo oluphezulu, kunye nokuthembeka okuphezulu kweemveliso zePCBA zisiwa kubathengi, ukunciphisa iziphene ezandleni zabathengi, kwaye uphephe emva kokuthengisa. Ezi zilandelayo ziindlela ezininzi zovavanyo lwebhodi yePCBA:

1. Uhlolo olubonakalayo ，Ukuhlola okubonwayo kukujonga ngesandla. Ukuhlolwa okubonwayo kwendibano yePCBA yeyona ndlela yakudala ekuhlolweni komgangatho wePCBA. Sebenzisa nje amehlo kunye neglasi yokukhulisa ukujonga isiphaluka sebhodi ye-PCBA kunye ne-soldering ye-electronic components ukuze ubone ukuba kukho ilitye lengcwaba. , Nkqu iibhulorho, itoti ngakumbi, nokuba amalungu solder ibhulorho, nokuba kukho i-solder encinci kunye ne-soldering engaphelelanga. Kwaye usebenzisane neglasi yokukhulisa ukubona i-PCBA
2. I-In-Circuit Tester (ICT) ICT inokuchonga i-soldering kunye neengxaki zecandelo kwi-PCBA. Inesantya esiphezulu, ukuzinza okuphezulu, khangela isiphaluka esifutshane, isiphaluka esivulekileyo, ukuchasana, amandla.
3. Ukuhlola okuzenzekelayo okubonwayo (AOI) ukubhaqwa kobudlelwane ngokuzenzekelayo kunonxibelelwano ne-intanethi, kwaye kunomahluko phakathi kwe-2D kunye ne-3D. Okwangoku, i-AOI idume kakhulu kumzi-mveliso wokuphekela. I-AOI isebenzisa isixokelelwano sokunakana kweefoto ukuskena yonke ibhodi yePCBA kwaye iphinde iyisebenzise. Uhlalutyo lwedatha lomatshini lusetyenziselwa ukumisela umgangatho webhodi yebhodi yePCBA. Ikhamera iskena ngokuzenzekelayo iziphene umgangatho webhodi PCBA phantsi kovavanyo. Ngaphambi kokuvavanya, kuyimfuneko ukumisela ibhodi ye-OK, kwaye ugcine idatha yebhodi ye-OK kwi-AOI. Imveliso yobuninzi elandelayo isekelwe kule bhodi ye-OK. Yenza imodeli esisiseko ukugqiba ukuba ezinye iibhodi zilungile.
4. Umatshini we-X-ray (i-X-RAY) Kwizinto ze-elektroniki ezifana ne-BGA/QFP, i-ICT kunye ne-AOI ayikwazi ukubona umgangatho wokubethelwa kwezikhonkwane zabo zangaphakathi. I-X-RAY ifana nomatshini we-X-ray wesifuba, onokudlula Khangela indawo ye-PCB ukuze ubone ukuba i-soldering yezikhonkwane zangaphakathi zithengiswa, nokuba ukubekwa endaweni, njl. I-X-RAY isebenzisa i-X-rays ukungena. ibhodi PCB ukujonga ngaphakathi. I-X-RAY isetyenziswa kakhulu kwiimveliso ezineemfuno zokuthembeka okuphezulu, ezifana ne-aviation Electronics, i-automotive electronics.
5. Ukuhlolwa kwesampuli Ngaphambi kokuveliswa kobuninzi kunye nendibano, ukuhlolwa kwesampuli yokuqala ngokuqhelekileyo kuqhutyelwa, ukwenzela ukuba ingxaki yeziphene ezigxininisiweyo inokuphetshwa kwimveliso yobuninzi, ekhokelela kwiingxaki ekuveliseni iibhodi ze-PCBA, ezibizwa ngokuba luhlolo lokuqala.
6. I-flying probe ye-flying probe tester ilungele ukuhlolwa kwe-PCBs enobunzima obuphezulu obufuna iindleko zokuhlola ezibizayo. Uyilo kunye nokuhlolwa kwe-flying probe kunokugqitywa ngosuku olunye, kwaye iindleko zendibano zincinci. Iyakwazi ukujonga ukuvulwa, iibhulukhwe ezimfutshane kunye noqhelaniso lwamacandelo afakwe kwi-PCB. Kwakhona, isebenza kakuhle ekuchongeni uyilo lwecandelo kunye nolungelelwaniso.
7. I-Manufacturing Defect Analyzer (MDA) Injongo ye-MDA kukuvavanya nje ngokubonakalayo ibhodi ukuveza iziphene zokuvelisa. Kuba uninzi lweziphene zokwenziwa ziyimiba yoqhagamshelo olulula, i-MDA ilinganiselwe kumlinganiselo wokuqhubekeka. Ngokuqhelekileyo, umhloli uya kukwazi ukubona ubukho be-resistors, capacitors, kunye ne-transistors. Ukufunyanwa kweesekethe ezidibeneyo kunokufezekiswa kwakhona ngokusebenzisa i-diodes yokukhusela ukubonisa ukubekwa kwecandelo elifanelekileyo.
8. Uvavanyo lokuguga. Emva kokuba i-PCBA iqhutywe kunye ne-DIP post-soldering, i-sub-board trimming, ukuhlolwa kwendawo kunye novavanyo lokuqala, emva kokuba ukuveliswa kobuninzi kugqityiwe, ibhodi ye-PCBA iya kufakwa kuvavanyo lokuguga ukuvavanya ukuba umsebenzi ngamnye uyinto eqhelekileyo, izinto ze-elektroniki ziqhelekileyo, njl.