Uvavanyo lweBhodi yePCBAlinyathelo eliphambili lokuqinisekisa ukuba umgangatho ophezulu, uzinzo oluphezulu, kunye neemveliso ze-PCBA eziphezulu zinikezelwa kubathengi, zinciphise iziphene ezandleni zabathengi, kwaye zithintele intengiso. Oku kulandelayo ziindlela ezininzi zovavanyo lweBhodi yePCBA:

1. Uvavanyo olubonakalayo, uhlolo olubonakalayo kukujonga ngesandla. Uvavanyo olubonakalayo lweNdibano yePCBA yeyona ndlela iphambili kuhlolo lwePCBA lomgangatho we-PCBA. Sebenzisa nje amehlo kunye neglasi yokukhulisa ukukhangela iBhodi yePCBA kunye nokuthengiswa kwezinto ze-elektroniki ukubona ukuba kukho ilitye lengcwangu. , Nkqu ne-bridges, i-tidges, nokuba i-jodi amalungu ahlanganayo ayabhayisiwe, nokuba akukho mthethweni, nokuba kuthengiswa okungaphelelanga. Kwaye isebenzisane neglasi eyomeleleyo ukufumana i-PCBA
2. I-Tester yeTenter (ICT) I-ICT inokuchonga iingxaki ezingekho phantsi kunye nezixhobo kwi-PCBA. Inesantya esiphezulu, uzinzo oluphezulu, jonga isekethe emfutshane, isiphaluka esivulelekileyo, ukumelana nokunganyangeki, ukuxhotyiswa.
3. Ukuhlolwa kwe-IAPOCATICATICAL OKANYANYANA Okwangoku, i-AOI ithandwa kakhulu kumzi-mveliso wepatch. I-AOI isebenzisa inkqubo yokuqonda impile ukushenxisa iBhodi yonke yePCBA kwaye iphinde isebenzise kwakhona. Uhlalutyo lwedatha yomatshini isetyenziselwa ukumisela umgangatho weBhodi yeBhodi yePCBA. Ikhamera ibeka ngokuzenzekelayo isiphene sebhodi yePCBA phantsi kovavanyo. Ngaphambi kovavanyo, kufuneka ukufumanisa iBhodi yeBhodi, kwaye ugcine idatha yeBhodi ye-Ok kwi-AOI. Ukuveliswa kwesininzi emva kokusekwe kule bhodi iyo. Yenza imodeli esisiseko ukufumanisa ukuba ezinye iiplanga zilungile.
4. Umatshini we-X-Ray (i-X-ray) yezinto ze-elektroniki ezinjenge-BGA / QFP, I-ICT kunye ne-AOI ayinakufumana umgangatho wokurhweba kwangaphakathi. I-X-ray ifana nomatshini we-x-ray ray, onokuthi adlulisele kwindawo yePCB ukuze abone ukuba i-Pins yangaphakathi ithengiswa, nokuba indawo ye-X-Ray isebenzisa iBhodi ye-PCB ukujonga iBhodi yePCB ukuba ingene ngaphakathi. I-X-ray isetyenziswa ngokubanzi kwiimveliso ezineemfuno zokuthembeka eziphezulu, ezifanayo ne-elektroniki, i-elektroniki
5. Ukuhlolwa kwesampulu ngaphambi kwemveliso yobuninzi kunye nendibano, uvavanyo lokuqala lwesampulu luhlala lwenziwa, ukuze ingxaki yeziphene ezigxiliweyo inokupheliswa kwimveliso yobuninzi, ebizwa ngokuba luhlolo lokuqala.
6. I-PlyIng Probe yePhepha lePhepha lePhambili lilungele ukuhlolwa kwee-PCBs ezinzima ezifuna iindleko zokuhlola amaxabiso. Uyilo kunye nokuhlolwa kwenkqubo yokubhabha kunokugqitywa ngamini-nye, kwaye iindleko zendibano ziphantsi. Kuyakwazi ukukhangela ukuvula, iifutshane kunye nokuqhelaniswa kwamacandelo aphakanyisiweyo kwi-PCB. Kwakhona, isebenza kakuhle ekuchongeni ubume becandelo kunye nolungelelwaniso.
7. Imveliso yokufumana i-Denderyer (MDA) Injongo ye-MDA kukuvavanya iBhodi ukuba ityhile iziphene. Kuba uninzi lweziphene zemveliso yimiba elula yonxibelelwano, i-MDA inqunyelwe kukulinganisa ukuqhubeka. Ngokwesiqhelo, i-tester iya kuba nakho ukufumanisa ubukho babaqeqesha, amachaphaza, kunye nokuzichubela. Ukufumanisa iisekethe ezihlanganisiweyo kunokufezekiswa ukusebenzisa indawo yokhuseleko ukubonisa indawo efanelekileyo.
8. Uvavanyo lokuguga. Emva kokuba i-PCBA iphakanyisiwe kwaye ithengiswe emva kwe-DIP, iBarding ePhepha, ihlonitshwe ngaphezulu kunye nokuvavanywa kokuqala, emva kokuba i-PCBA isetyenziswe ukuba umsebenzi ogudileyo uviwe ukuba ngaba umsebenzi ngamnye yinto eqhelekileyo, njl njl.