Intshayelelo kwiSolder Mask
I-pad resistance pad is soldermask, ebhekisela kwinxalenye yebhodi yesekethe ukuba ifakwe ngeoli eluhlaza. Ngapha koko, le maski ye-solder isebenzisa imveliso engalunganga, ke emva kokuba imilo yemaski ye-solder ifakwe kwibhodi, imaski ye-solder ayipeyintwanga ngeoli eluhlaza, kodwa ulusu lobhedu luveziwe. Ngokuqhelekileyo ukwenzela ukwandisa ubukhulu besikhumba sobhedu, imaski ye-solder isetyenziselwa ukubhala imigca yokususa ioli eluhlaza, kwaye i-tin yongezwa ukwandisa ubukhulu bocingo lobhedu.
Iimfuno zemaski solder
Imaski ye-solder ibaluleke kakhulu ekulawuleni iziphene ze-soldering kwi-reflow soldering. Abayili bePCB kufuneka banciphise izithuba okanye izithuba zomoya ezijikeleze iipads.
Nangona iinjineli ezininzi zenkqubo zinokukhetha ukwahlula zonke izinto zepadi ebhodini ngemaski yesolder, isithuba sepin kunye nobungakanani bepadi yezinto ezinobumba obucolekileyo ziya kufuna ingqalelo ekhethekileyo. Nangona i-solder imaski evulekileyo okanye iifestile ezingacandwanga kumacala amane e-qfp inokwamkeleka, kunokuba nzima kakhulu ukulawula iibhulorho ze-solder phakathi kwezikhonkwane zecandelo. Kwimaski ye-solder ye-bga, iinkampani ezininzi zibonelela ngemaski ye-solder engazichukumisi iipads, kodwa igubungela naziphi na iimpawu phakathi kweepads ukukhusela iibhulorho ze-solder. Uninzi lwe-PCBs ezixhonywe ngomphezulu zigqunywe ngemaski yesolder, kodwa ukuba ubukhulu bemaski ye-solder bukhulu kuno-0.04mm, kunokuchaphazela usetyenziso lwe-solder paste. IiPCBs zokunyuka komphezulu, ngakumbi ezo zisebenzisa izinto ezinobumba obucokisekileyo, zifuna imaski ephantsi ye-photosensitive solder.
Imveliso yomsebenzi
Izixhobo zemaski zeSolder kufuneka zisetyenziswe ngenkqubo yolwelo olumanzi okanye ifilimu eyomileyo yokucoca. Izixhobo zemaski ezomileyo zefilimu zibonelelwa kubunzima obuyi-0.07-0.1mm, enokulungela ezinye iimveliso zokukhwela umphezulu, kodwa le mathiriyeli ayikhuthazwa kwizicelo ezisondele. Zimbalwa iinkampani ezibonelela ngeefilimu ezomileyo ezibhityileyo ngokwaneleyo ukuba zikwazi ukuhlangabezana nemigangatho yepitch entle, kodwa kukho iinkampani ezimbalwa ezinokubonelela ngemathiriyeli yemaski ye-photosensitive solder engamanzi. Ngokubanzi, ukuvulwa kwemaski ye-solder kufuneka ibe yi-0.15mm enkulu kune-pad. Oku kuvumela umsantsa we-0.07mm kumda wepad. Ulwelo olukwiprofayili ephantsi ye-photosensitive solder imaski yezixhobo zinoqoqosho kwaye ziqhele ukukhankanywa kwizicelo zokunyuka komphezulu ukubonelela ngobungakanani obuchanekileyo kunye nezikhewu.
Intshayelelo kwi-soldering layer
I-soldering layer isetyenziselwa ukupakishwa kwe-SMD kwaye ihambelana neepads zamacandelo e-SMD. Kwinkqubo ye-SMT, i-plate yensimbi idla ngokusetyenziswa, kwaye i-PCB ehambelana necandelo le-pads ibethelwa, kwaye i-solder paste ifakwe kwi-plate yensimbi. Xa i-PCB iphantsi kwepleyiti yentsimbi, i-solder paste iyavuza, kwaye ikwiphedi nganye Inokungcoliswa nge-solder, ngoko ke ngokuqhelekileyo imaski ye-solder ayifanele ibe nkulu kunobukhulu bepad, ngokufanelekileyo ngaphantsi okanye ilingane ubungakanani bokwenyani iphedi.
Umgangatho ofunekayo uphantse ufane naleyo yezixhobo zokunyuka komphezulu, kwaye izinto eziphambili zimi ngolu hlobo lulandelayo:
1. I-BeginLayer: I-ThermalRelief kunye ne-AnTIPad zinkulu nge-0.5mm kunobungakanani beyona pad eqhelekileyo.
2. I-EndLayer: I-ThermalRelief kunye ne-AntiPad zinkulu nge-0.5mm kunobungakanani beyona pad eqhelekileyo.
3. OKUNGENAMALI: umaleko ophakathi
Indima ye-mask ye-solder kunye ne-flux layer
Umaleko we-mask we-solder ukhusela ikakhulu i-foil yobhedu yebhodi yesekethe ukuba ibonakale ngokuthe ngqo emoyeni kwaye idlala indima yokukhusela.
Uluhlu lwe-soldering lusetyenziselwa ukwenza i-mesh yensimbi ye-mesh ye-steel mesh, kwaye i-mesh yensimbi inokubeka ngokuchanekileyo i-solder pads kwi-patch pads efuna ukuthengiswa xa i-tinning.
Umahluko phakathi kwe-PCB yokuthengisela umaleko kunye ne-solder mask
Zombini iileya zisetyenziselwa ukuthambisa. Akuthethi ukuba enye iyathengiswa kwaye enye ioli eluhlaza; kodwa:
1. Umaleko we-mask we-solder uthetha ukuvula ifestile kwioli eluhlaza ye-mask ye-solder yonke, injongo kukuvumela i-welding;
2. Ngokungagqibekanga, indawo ngaphandle kwemaski ye-solder kufuneka ifakwe ngeoli eluhlaza;
3. I-soldering layer isetyenziselwa ukupakishwa kwe-SMD.