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Ixesha lokuhanjiswa kwebhodi yokuthwala kunzima ukusombulula, kwaye i-OSAT factory iphakamisa ukuba utshintshe ifom yokupakisha.

Ishishini lokupakishwa kwe-IC kunye nokuvavanya lisebenza ngesantya esipheleleyo.Amagosa aphezulu e-outsourcing packaging and test (OSAT) athi ngokunyanisekileyo kwi-2021 kuqikelelwa ukuba isakhelo esikhokelayo sokudibanisa ucingo, i-substrate yokupakisha, kunye ne-epoxy resin yokupakisha (Epoxy) kulindeleke ukuba isetyenziswe kwi-2021. Ubonelelo kunye nemfuno yezinto ezifana ne-Molding Compund ziqinile, kwaye kuqikelelwa ukuba iya kuba yinto eqhelekileyo ngo-2021.

Phakathi kwabo, umzekelo, ii-chips ze-computing eziphezulu (i-HPC) ezisetyenziswa kwiiphakheji ze-FC-BGA, kunye nokunqongophala kwe-ABF substrates kubangele abavelisi be-chip bamazwe ngamazwe ukuba baqhubeke nokusebenzisa indlela yomthamo wepakethi ukuqinisekisa umthombo wezinto.Ngokubhekiselele koku, inxalenye yokugqibela yoshishino lokupakisha kunye nokuvavanya lubonise ukuba azifuni kakhulu iimveliso ze-IC, ezifana nememori yokulawula iichips (uMlawuli IC).

Ekuqaleni ngohlobo lwe-BGA yokupakisha, ukupakisha kunye nokuvavanya izityalo ziyaqhubeka nokucebisa abathengi be-chip ukuba batshintshe izinto kwaye bamkele ukupakishwa kwe-CSP ngokusekelwe kwii-substrates ze-BT, kwaye zizame ukulwa nokusebenza kwe-NB / PC / console yomdlalo we-CPU, i-GPU, i-server ye-Netcom chips. , etc. , Kusafuneka wamkele ibhodi yomthwali we-ABF.

Ngapha koko, ixesha lokuhanjiswa kwebhodi yabathwali liye landiswa ukusuka kwiminyaka emibini edlulileyo.Ngenxa yokunyuka kwakutshanje kumaxabiso obhedu e-LME, isakhelo esikhokelayo se-IC kunye neemodyuli zamandla ziye zanda ekuphenduleni kwisakhiwo seendleko.Ngokubhekiselele kwindandatho yezixhobo ezifana ne-oxygen resin, imboni yokupakisha kunye nokuvavanya nayo yalumkisa kwasekuqaleni kwe-2021, kunye nokubonelela okuqinileyo kunye nemfuno yemeko emva komnyaka omtsha wenyanga kuya kubonakala ngakumbi.

Isaqhwithi sangaphambili somkhenkce eTexas eUnited States sibe nefuthe ekunikezelweni kwezixhobo zokupakisha ezifana neresin kunye nezinye izixhobo zekhemikhali eziphuma phezulu.Uninzi lwabavelisi bemathiriyeli baseJapan abaliqela, kuquka iShowa Denko (edityaniswe neHitachi Chemical), basaza kuba neepesenti ezingama-50 kuphela zobonelelo lwemathiriyeli yokuqala ukusuka ngoMeyi ukuya kuJuni., Kwaye inkqubo ye-Sumitomo ibike ukuba ngenxa yomthamo ogqithiseleyo wokuvelisa okhoyo eJapan, i-ASE Investment Holdings kunye neemveliso zayo ze-XX, ezithenga izinto zokupakisha ezivela kwi-Sumitomo Group, aziyi kuchaphazeleka kakhulu okwangoku.

Emva kokuba umthamo wemveliso we-upstream uqinile kwaye uqinisekiswe lishishini, ishishini le-chip liqikelela ukuba nangona isicwangciso somthamo esicwangcisiweyo sele siphantse safikelela kulo nyaka uzayo, ulwabiwo luqingqwa ngokungqongqo.Owona mqobo ucacileyo kwisithintelo sokuthunyelwa kwetshiphu sikwinqanaba lamva.Ukupakishwa kunye novavanyo.

Umthamo wemveliso oqinileyo wokupakishwa kwe-wire-bonding (WB) kuya kuba nzima ukusombulula yonke indlela ukuya ekupheleni konyaka.I-Flip-chip packaging (FC) nayo igcine izinga layo lokusetyenziswa kwinqanaba eliphezulu ngenxa yemfuno ye-HPC kunye neechips zemigodi, kunye nokupakishwa kwe-FC kufuneka kukhule ngakumbi.Unikezelo oluqhelekileyo lwee-substrates zokulinganisa lunamandla.Nangona uninzi lunqongophele iibhodi ze-ABF, kunye neebhodi ze-BT zisamkelekile, imboni yokupakisha kunye nokuvavanya ilindele ukuba ukuqina kwe-BT substrates kuya kuza kwakhona kwixesha elizayo.

Ukongeza kwinto yokuba iitshiphusi ze-elektroniki zemoto zasikwa emgceni, iplanti yokupakisha kunye nokuvavanya ilandele inkokelo yeshishini le-Foundry.Ekupheleni kwekota yokuqala kunye nokuqala kwekota yesibini, iqale yafumana umyalelo wee-wafers ezivela kubathengisi be-chip bamazwe ngamazwe ngo-2020, kwaye ezintsha zongezwa ngo-2021. Umthamo wokuvelisa i-wafer uncedo lwase-Austrian nalo luqikelelwa ukuba luqalise. kwikota yesibini.Kuba ukupakishwa kunye nenkqubo yovavanyo malunga ne-1 ukuya kwiinyanga ezi-2 emva kwexesha ukusuka kwi-Foundry, ii-odolo ezinkulu zovavanyo ziya kubiliswa phakathi enyakeni.

Ukujonga phambili, nangona ishishini lilindele ukuba ukupakishwa okuqinileyo kunye novavanyo lovavanyo aluyi kuba lula ukusombulula ngo-2021, kwangaxeshanye, ukwandisa imveliso, kuyimfuneko ukuwela umatshini wokubopha ucingo, umatshini wokusika, umatshini wokubeka kunye nokunye ukupakisha. izixhobo ezifunekayo ukupakishwa.Ixesha lokuhambisa nalo landiswe phantse ukuya kutsho kwisinye.Iminyaka kunye neminye imingeni.Nangona kunjalo, ishishini lokupakisha kunye nokuvavanya lisagxininisa ukuba ukunyuka kweendleko zokupakisha kunye nokuvavanya isiseko "kuseyiprojekthi enobuchule" ekufuneka ithathele ingqalelo ubudlelwane babathengi bexesha eliphakathi kunye nexesha elide.Ngoko ke, sinokubuqonda ubunzima obukhoyo boyilo lwabathengi be-IC ukuqinisekisa amandla aphezulu emveliso, kwaye sinikeze iingcebiso kubathengi ezifana nokutshintsha kwezinto, utshintsho lwepakethi, kunye nothethathethwano lwexabiso, olusekelwe kwisiseko sentsebenziswano ezuzisayo yexesha elide. nabathengi.

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I-boom yemigodi iye yaqinisa ngokuphindaphindiweyo amandla okuvelisa i-BT substrates
I-boom yemigodi yehlabathi ilawulekile, kwaye iitshiphusi zemigodi ziphinde zaba yindawo eshushu kwimarike.Amandla e-kinetic ee-odolo zekhonkco lokubonelela aye anda.Abavelisi be-IC substrate baye bachaza ngokubanzi ukuba amandla okuvelisa i-ABF substrates ehlala isetyenziselwa ukuyila i-chip yemigodi kwixesha elidlulileyo sele iphelile.I-Changlong, ngaphandle kwemali eyaneleyo, ayikwazi ukufumana unikezelo olwaneleyo.Abathengi ngokubanzi batshintshela kubuninzi beebhodi zokuthwala i-BT, eyenze kwakhona i-BT yebhodi yebhodi yokuvelisa imigca yabavelisi abahlukeneyo iye yaqina ukusuka kuNyaka omtsha weLunar ukuza kuthi ga ngoku.

Umzi-mveliso ofanelekileyo udize ukuba ngokwenene zininzi iintlobo zeetshiphusi ezinokusetyenziswa emigodini.Ukusuka kwii-GPU zokuqala eziphezulu ukuya kwii-ASIC zezemigodi ezikhethekileyo kamva, ikwajongwa njengesisombululo soyilo esisekwe kakuhle.Uninzi lweebhodi ze-BT carrier zisetyenziselwa olu hlobo loyilo.Iimveliso ze-ASIC.Isizathu sokuba iibhodi ze-BT ze-Carrier zingasetyenziswa kwii-ASIC ze-minings ikakhulu kuba ezi mveliso zisusa imisebenzi engafunekiyo, zishiya kuphela imisebenzi efunekayo kwimigodi.Ngaphandle koko, iimveliso ezifuna amandla aphezulu ekhompyuter kusafuneka zisebenzise iibhodi zokuthwala i-ABF.

Ngoko ke, ngeli nqanaba, ngaphandle kwe-chip ye-mining kunye nememori, ehlengahlengisa uyilo lwebhodi lomphathi, kukho indawo encinci yokutshintshwa kwezinye izicelo.Abantu bangaphandle bakholelwa ukuba ngenxa yokutshatyalaliswa ngokukhawuleza kwezicelo zemigodi, kuya kuba nzima kakhulu ukukhuphisana nabanye abavelisi abakhulu be-CPU kunye ne-GPU abaye bafola ixesha elide kwi-ABF yebhodi yokuthwala i-ABF.

Singasathethi ke ukuba uninzi lwemizila emitsha yemveliso eyandisiweyo ziinkampani ezahlukeneyo sele zikhontrakthi ngabavelisi baphambili.Xa i-boom yezimayini ingazi ukuba iya kunyamalala nini ngequbuliso, iinkampani zetshiphu zemigodi azinalo ixesha lokujoyina.Ngomgca omde wokulinda weebhodi ze-ABF ze-carrier, ukuthenga iibhodi ze-BT carrier kwizinga elikhulu yeyona ndlela isebenzayo.

Ukujonga imfuno yezicelo ezahlukeneyo zeebhodi zokuthwala i-BT kwisiqingatha sokuqala sika-2021, nangona ukukhula okunyuka ngokubanzi, izinga lokukhula kweetshiphusi zemigodi liyothusa kakhulu.Ukuqwalasela imeko yee-odolo zabathengi akuyiyo imfuno yexesha elifutshane.Ukuba iqhubeka kwisiqingatha sesibini sonyaka, faka i-BT carrier.Kwixesha eliphakamileyo lebhodi lebhodi, kwimeko yemfuno ephezulu yeefowuni ze-AP, i-SiP, i-AiP, njl.

Ihlabathi langaphandle likholelwa ukuba akuthintelwanga ukuba imeko iya kuvela kwimeko apho iinkampani ze-chips zemigodi zisebenzisa ukunyuka kwamaxabiso ukuze zibambe umthamo wemveliso.Emva kwayo yonke loo nto, izicelo zemigodi okwangoku zibekwe njengeeprojekthi zentsebenziswano zexesha elifutshane kubenzi bebhodi abakhoyo be-BT.Kunokuba ibe yimveliso yexesha elide efunekayo kwixa elizayo njengeemodyuli ze-AiP, ukubaluleka kunye nokubaluleka kweenkonzo kuseluncedo lweeselfowuni zemveli, ii-electronics zabathengi kunye nabavelisi beetshiphu zonxibelelwano.

Ishishini lokuthwala livume ukuba amava aqokelelweyo ukususela ekuveleni kokuqala kwemfuno yemigodi ibonisa ukuba iimeko zemarike yeemveliso zemigodi ziguquguqukayo, kwaye akulindelekanga ukuba imfuno iya kugcinwa ixesha elide.Ukuba amandla okuvelisa amabhodi e-BT carrier ngokwenene kufuneka kwandiswe kwixesha elizayo, kufuneka kwakhona kuxhomekeke kuyo.Ubume bophuhliso lwezinye izicelo aluyi kwandisa utyalo-mali ngokulula ngenxa yemfuno ephezulu kweli nqanaba.