Uxinaniso lwendibano luphezulu, iimveliso ze-elektroniki zincinci ngobukhulu kwaye zikhaphukhaphu ubunzima, kwaye umthamo kunye nenxalenye yamacandelo e-patch kuphela malunga ne-1/10 yezinto zeplagi zemveli.
Emva kokukhethwa ngokubanzi kwe-SMT, umthamo weemveliso ze-elektroniki uyancipha nge-40% ukuya kwi-60%, kwaye ubunzima buncitshiswe nge-60% ukuya kwi-80%.
Ukuthembeka okuphezulu kunye nokumelana nokungcangcazela okunamandla.Isantya esisezantsi sesiphene sokudibanisa i-solder.
Iimpawu ezilungileyo zefrikhwensi ephezulu.Ukuncitshiswa kwe-electromagnetic kunye nokuphazamiseka kweRF.
Kulula ukufezekisa ukuzenzekelayo, ukuphucula ukusebenza kakuhle kwemveliso.Ukunciphisa iindleko ngama-30% ~ 50%.Gcina idatha, amandla, izixhobo, abasebenzi, ixesha, njl.
Kutheni usebenzisa iZakhono zokuMount Surface (SMT)?
Iimveliso ze-elektroniki zifuna i-miniaturization, kunye ne-perforated plug-in components ezisetyenzisiweyo azikwazi ukuncitshiswa.
Umsebenzi weemveliso ze-elektroniki ugqibelele ngakumbi, kwaye isekethe edibeneyo (IC) ekhethiweyo ayinazo iinxalenye ezinemingxuma, ngakumbi ubungakanani obukhulu, ii-ics ezidityanisiweyo kakhulu, kunye neenxalenye zepetshi yomphezulu kufuneka zikhethwe.
Ubunzima bemveliso, imveliso ezenzekelayo, umzi-mveliso ukuya kwixabiso eliphantsi eliphezulu, ukuvelisa iimveliso ezisemgangathweni ukuhlangabezana neemfuno zabathengi kunye nokomeleza ukhuphiswano lwemarike.
Ukuphuhliswa kwamacandelo e-elektroniki, ukuphuhliswa kweesekethe ezidibeneyo (ics), ukusetyenziswa okuphindaphindiweyo kwedatha ye-semiconductor
Uguqulo lwetekhnoloji ye-elektroniki luyafuneka, ukusukela imeko yehlabathi
Kutheni usebenzisa inkqubo engacocekanga kwizakhono zokunyuka komphezulu?
Kwinkqubo yokuvelisa, amanzi amdaka emva kokucoca imveliso kuzisa ukungcoliseka komgangatho wamanzi, umhlaba kunye nezilwanyana kunye nezityalo.
Ukongeza ekucoceni amanzi, sebenzisa izinyibilikisi eziphilayo ezine-chlorofluorocarbons (CFC&HCFC)Ukucoca kukwadala ungcoliseko kunye nomonakalo emoyeni nakwiatmosfera.Intsalela yearhente yokucoca iya kubangela ukubola kwibhodi yomatshini kwaye ichaphazele ngokunzulu umgangatho wemveliso.
Ukunciphisa umsebenzi wokucoca kunye neendleko zokugcina umatshini.
Akukho kucoca kunokunciphisa umonakalo obangelwa yi-PCBA ngexesha lokunyakaza kunye nokucoca.Kusekho amanye amacandelo angenako ukucocwa.
I-residu ye-flux ilawulwa kwaye ingasetyenziselwa ngokuhambelana neemfuno zokubonakala kwemveliso ukukhusela ukuhlolwa okubonakalayo kweemeko zokucoca.
I-flux eseleyo iye yaphuculwa ngokuqhubekayo kumsebenzi wayo wombane ukukhusela imveliso egqityiweyo ekuvuzeni umbane, okubangelwa nayiphi na ingozi.
Zeziphi iindlela zokubona isiqwengana se-SMT somzi-mveliso wokusetyenzwa kwe-SMT?
Ukufunyanwa ekusetyenzweni kwe-SMT yindlela ebaluleke kakhulu yokuqinisekisa umgangatho we-PCBA, iindlela eziphambili zokubona zibandakanya ukubhaqwa okubonakalayo kwezandla, ukubhaqwa kwegeyiji ye-solder paste, ubhaqo oluzenzekelayo, ubhaqo lwe-X-ray, uvavanyo lwe-intanethi, uvavanyo lwenaliti ebhabhayo, njl. ngenxa yomxholo ohlukeneyo wokufumanisa kunye neempawu zenkqubo nganye, iindlela zokufumanisa ezisetyenziswa kwinkqubo nganye nazo zihlukile.Kwindlela yokufumanisa i-smt patch processing plant, ukufumanisa okubonakalayo okubonakalayo kunye nokuhlolwa kwe-Optical ngokuzenzekelayo kunye nokuhlolwa kwe-X-ray zezona ndlela zintathu zisetyenziswa ngokuqhelekileyo ekuhloleni inkqubo yokudibanisa umphezulu.Uvavanyo lwe-Intanethi lunokuba luvavanyo oluzinzileyo kunye novavanyo oluguqukayo.
I-Global Wei Technology ikunika intshayelelo emfutshane kwezinye iindlela zokubona:
Okokuqala, indlela yokubona ngokubonakalayo ngesandla.
Le ndlela inegalelo elincinci kwaye ayifuni kuphuhlisa iinkqubo zovavanyo, kodwa iyacotha kwaye ixhomekeke kwaye kufuneka ijonge ngokubonakalayo indawo elinganisiweyo.Ngenxa yokungabikho kokuhlolwa okubonakalayo, kunqabile ukuba kusetyenziswe njengendlela yokuhlola umgangatho we-welding oyintloko kumgca wokucutshungulwa kwe-SMT yangoku, kwaye ininzi isetyenziselwa ukuvuselela njalo njalo.
Okwesibini, indlela yokubona optical.
Ngokuncitshiswa kobungakanani bepakethi ye-PCBA chip kunye nokwanda koxinzelelo lwebhodi yesekethe, ukuhlolwa kwe-SMA kuya kuba nzima ngakumbi, ukuhlolwa kwamehlo ngesandla akunamandla, ukuzinza nokuthembeka kwayo kunzima ukuhlangabezana neemfuno zemveliso kunye nokulawula umgangatho, ngoko ke ukusetyenziswa ubhaqo oluguquguqukayo kuba ngakumbi kwaye kubaluleke ngakumbi.
Sebenzisa i-automated optical inspection (AO1) njengesixhobo sokunciphisa iziphene.
Ingasetyenziselwa ukufumana kunye nokuphelisa iimpazamo ekuqaleni kwenkqubo yokupakisha ukufezekisa ulawulo lwenkqubo elungileyo.I-AOI isebenzisa iisistim zombono eziphucukileyo, iindlela ezintsha zokondla ukukhanya, ukwandiswa okuphezulu kunye neendlela ezintsonkothileyo zokusetyenzwa ukuphumeza amazinga aphezulu wokubamba iziphene kwizantya zovavanyo oluphezulu.
Isikhundla se-AOl kumgca wemveliso we-SMT.Ngokuqhelekileyo kukho iintlobo ezi-3 zezixhobo ze-AOI kumgca wemveliso we-SMT, eyokuqala yi-AOI ebekwe kwiscreen sokuprinta ukubona impazamo yokuncamathisela ye-solder, ebizwa ngokuba yi-post-screen printing AOl.
Eyesibini yi-AOI ebekwe emva kwepetshi ukubona iziphene zokuxhoma isixhobo, esibizwa ngokuba yi-post-patch AOl.
Uhlobo lwesithathu lwe-AOI lufakwa emva kokuqukuqela kwakhona ukuze kubonwe ukuxhonywa kwesixhobo kunye neempazamo ze-welding ngaxeshanye, okubizwa ngokuba yi-post-reflow AOI.
