IiMfuno zesithuba kuYilo pcb

  Umgama wokhuseleko lombane

 

1. Isithuba phakathi kweengcingo
Ngokomthamo wemveliso yabavelisi bePCB, umgama phakathi komkhondo kunye neetrayisi akufanele ube ngaphantsi kwe-4 mil. Esona sithuba sincinci somgca sikwangumgca ukuya kumgca kunye nesithuba somgca ukuya kwiphedi. Ewe, ngokwembono yethu yokuvelisa, ngokuqinisekileyo, inkulu ingcono phantsi kweemeko. I-10 mil ngokubanzi ixhaphake kakhulu.

2. Isikhala sephedi kunye nobubanzi bephedi:
Ngokomvelisi we-PCB, ubuncinci bomngxuma wepad awukho ngaphantsi kwe-0.2 mm ukuba igrunjwe ngoomatshini, kwaye ayikho ngaphantsi kwe-4 mil ukuba i-laser igrunjwe. Ukunyamezela ukuvuleka kuhluke kancinane kuxhomekeke kwipleyiti. Ngokuqhelekileyo inokulawulwa ngaphakathi kwe-0.05 mm. Ubuncinci ububanzi bepadi abuyi kuba ngaphantsi kwe-0.2 mm.

3. Umgama phakathi kwepadi kunye nephedi:
Ngokwamandla okucubungula abavelisi bePCB, umgama phakathi kweepads kunye neepads akufanele ube ngaphantsi kwe-0.2 mm.

 

4. Umgama phakathi kwesikhumba sobhedu kunye nomphetho webhodi:
Umgama phakathi kwesikhumba sobhedu esihlawuliweyo kunye nomda webhodi ye-PCB ngokukhethekileyo ungabi ngaphantsi kwe-0.3 mm. Ukuba ubhedu lubekwe kwindawo enkulu, ngokuqhelekileyo kuyimfuneko ukuba ube nomgama we-shrinkage ukusuka kumda webhodi, obekwe ngokubanzi kwi-20 mil. Ngokubanzi, ngenxa yoqwalaselo lomatshini lwebhodi yesekethe egqityiweyo, okanye ukuthintela ukubakho kokugoqa okanye ukujikeleza okufutshane kombane okubangelwa ngumtya wobhedu oveziweyo kumda webhodi, iinjineli zihlala zicutha iibhloko zobhedu ezikwindawo enkulu nge-20 mil ngokubhekiselele emphethweni webhodi. Ulusu lobhedu alusoloko lusasazeka kumda webhodi. Kukho iindlela ezininzi zokujongana nale shrinkage yobhedu. Umzekelo, zoba umaleko wokugcina kumda webhodi, uze usete umgama phakathi kobhedu kunye nokugcina.

Umgama wokhuseleko ongekho ngombane

 

1. Ububanzi bomlinganiswa kunye nobude kunye nesithuba:
Ngokumalunga neempawu zesikrini sesilika, sisebenzisa amaxabiso aqhelekileyo afana ne-5/30 6/36 MIL, njl.

2. Umgama ukusuka kwisikrini sesilika ukuya kwiphedi:
Ushicilelo lwekhusi aluvumeli iipads. Ukuba isikrini sesilika sihlanganiswe ngeepads, i-tin ayiyi kufakwa kwi-tinned xa i-soldering, eya kuchaphazela ukubekwa kwamacandelo. Abavelisi bebhodi ngokubanzi bafuna izithuba ezi-8 mil zigcinwe. Ukuba kungenxa yokuba indawo yezinye iibhodi zePCB isondele kakhulu, isithuba se-4MIL akwamkelekanga. Ke, ukuba isikrini sesilika sigubungela ngempazamo ipad ngexesha loyilo, umenzi webhodi uya kuphelisa ngokuzenzekelayo isahlulo sesikrini sesilika esishiywe kwipadi ngexesha lokwenziwa kokwenza i-tin kwi-pad. Ngoko kufuneka sinikele ingqalelo.

3. Ubude be-3D kunye nesithuba esithe tye kwisakhiwo soomatshini:
Xa ufaka izixhobo kwi-PCB, kuyimfuneko ukuqwalasela ukuba ulwalathiso oluthe tye kunye nokuphakama kwendawo kuya kungqubuzana nezinye izakhiwo zoomatshini. Ngoko ke, xa kuyilwa, kuyimfuneko ukuqwalasela ngokupheleleyo ukulungelelaniswa kwesakhiwo sesithuba phakathi kwamacandelo, kunye naphakathi kwemveliso ye-PCB kunye neqokobhe lemveliso, kwaye ugcine umgama okhuselekileyo kwinto nganye ekujoliswe kuyo.