1. Inkqubo eyongezelelweyo
Uluhlu lweekhemikhali zethusi lusetyenziselwa ukukhula ngokuthe ngqo kwemigca ye-conductor yendawo kwi-non-conductor substrate surface ngoncedo lwe-inhibitor eyongezelelweyo.
Iindlela zokongezwa kwibhodi yesekethe zingahlulwa zibe zongezwa ngokupheleleyo, ukongezwa kwesiqingatha kunye nokongeza inxalenye kunye nezinye iindlela ezahlukeneyo.
2. Iipaneli zomqolo, ii-Backplanes
Yibhodi yesekethe engqingqwa (efana ne-0.093 ″,0.125″), esetyenziselwa ngokukodwa ukuplaga kunye nokudibanisa ezinye iibhodi. Oku kwenziwa ngokufaka i-multi-pin Connector emngxunyeni oqinileyo, kodwa kungekhona ngokuthengisa, kwaye emva koko i-wiring enye enye kwintambo apho i-Connector idlula ebhodini. Umdibaniso unokufakwa ngokwahlukileyo kwibhodi yesiphaluka jikelele. Ngenxa yale bhodi ikhethekileyo, 'umngxuma' wayo awukwazi solder, kodwa vumela udonga lomngxuma kunye nocingo lwesikhokelo lusetyenziswe ngokungqongqo, ngoko umgangatho walo kunye neemfuno zokuvula zingqongqo, ubungakanani bomyalelo abuninzi, umzi-mveliso webhodi yesekethe ngokubanzi. ayifuni yaye akukho lula ukwamkela olu hlobo locwangco, kodwa sele iphantse yaba linqanaba eliphezulu kushishino olukhethekileyo eUnited States.
3. Inkqubo yokwakha
Le yintsimi entsha yokwenza i-multilayer ebhityileyo, ukukhanya kwangaphambili kuthathwe kwinkqubo ye-IBM SLC, kwimveliso yovavanyo lwesityalo saseJapan yaseYasu yaqala ngo-1989, indlela isekelwe kwiphaneli yesiqhelo ephindwe kabini, ekubeni iipaneli ezimbini zangaphandle ziqala umgangatho obanzi. ezifana Probmer52 phambi kokuba ukutyabeka ulwelo photosensitive, emva kwesiqingatha isisombululo lukhuni kunye novakalelo njengokwenza imigodi kunye umaleko elandelayo yefomu enzulu "uluvo umngxuma optical" (Ifoto - Via), kwaye emva koko ukuya kwikhemikhali ebanzi yokwandisa umqhubi wobhedu kunye nesitya sobhedu. umaleko, kwaye emva komfanekiso womgca kunye ne-etching, unako ukufumana ucingo olutsha kunye noqhagamshelo olusezantsi olungcwatywe umngxuma okanye umngxuma oyimfama. Ukuphinda-phinda umaleko kuya kuvelisa inani elifunekayo leleya. Le ndlela ayikwazi kuphela ukuphepha iindleko ezibiza kakhulu zokugaya oomatshini, kodwa kwakhona ukunciphisa ububanzi bomngxuma ukuya ngaphantsi kwe-10mil. Kule minyaka i-5 ~ 6 idlulileyo, zonke iintlobo zokwaphula umaleko wemveli zamkele iteknoloji ye-multilayer elandelelanayo, kushishino lwaseYurophu phantsi kwe-push, yenza inkqubo yoBuildUp enjalo, iimveliso ezikhoyo zidweliswe ngaphezu kweentlobo ze-10. Ngaphandle kwe "photosensitive pores"; Emva kokususa isigqubuthelo sobhedu kunye nemingxuma, iindlela ezahlukeneyo "zokwakhiwa kwemingxuma" ezifana ne-alkaline chemical Etching, i-Laser Ablation, kunye ne-Plasma Etching yamkelwa kwiiplate ze-organic. Ukongeza, i-Resin Coated Copper Foil entsha (i-Resin Coated Copper Foil) eqatywe nge-semi-hardened resin nayo ingasetyenziselwa ukwenza ipleyiti encinci, encinci kunye nencinci ye-multi-layer ene-Sequential Lamination. Kwixesha elizayo, iimveliso zomntu ezahlukeneyo ze-elektroniki ziya kuba lolu hlobo lwebhodi yebhodi yebhodi enemigangatho emininzi ngokwenene.
4. Cermet
Umgubo weCeramic kunye nomgubo wesinyithi zixutywe, kwaye i-adhesive yongezwa njengohlobo lokutyabeka, olunokuthi luprintwe kumphezulu webhodi yesekethe (okanye umaleko wangaphakathi) ngefilimu eshinyeneyo okanye ifilimu ebhityileyo, njengokubekwa "kokuchasana", endaweni yoko. i-resistor yangaphandle ngexesha lokuhlanganisa.
5. Co-Firing
Yinkqubo yebhodi yesekethe ye-porcelain Hybrid. Imigca yesekethe yeThick Film Paste yeentsimbi ezahlukeneyo ezixabisekileyo eziprintwe kumphezulu webhodi encinci zigxothwa kubushushu obuphezulu. Izinto ezahlukeneyo ezithwala izinto eziphilayo kwincama yefilimu eshinyeneyo ziyatshiswa, zishiya imigca yesiqhubi sentsimbi exabisekileyo ukuba isetyenziswe njengeingcingo zokudityaniswa.
6. Crossover
Ukunqumla kwe-three-dimensional of two wires on the board surface kunye nokuzaliswa kwe-insulating medium phakathi kweendawo zokulahla zibizwa. Ngokubanzi, indawo enye yepeyinti eluhlaza kunye ne-jumper yefilimu yekhabhoni, okanye indlela yomaleko ngaphezulu nangaphantsi kwee-wiring zinjalo "Crossover".
7. Ibhodi ye-Discreate-Wiring Board
Elinye igama lebhodi le-multi-wiring , lenziwe ngocingo olujikelezileyo lwe-enameled olufakwe ebhodini kunye ne-perforated ngemingxuma. Ukusebenza kolu hlobo lwebhodi ye-multiplex kumgca wothumelo oluhamba rhoqo lungcono kunomgca osikwere owenziwe yi-PCB eqhelekileyo.
8. Isicwangciso se-DYCO
Yinkampani yaseSwitzerland iDyconex ephuhlise iBuildup of the Process eZurich. Yindlela enelungelo elilodwa lomenzi wokususa ifoyile yobhedu kwindawo yemingxuma kumphezulu wepleyiti kuqala, emva koko uyibeke kwindawo evaliweyo yevacuum, emva koko uyigcwalise ngeCF4, N2, O2 ukuze ionize kumbane ophezulu ukwenza iPlasma esebenza kakhulu. , engasetyenziselwa ukugqwala izinto ezisisiseko zezikhundla ezinemingxuma kunye nokuvelisa imingxuma emincinci yesikhokelo (ngaphantsi kwe-10mil). Inkqubo yorhwebo ibizwa ngokuba yi-DYCOstrate.
9. Electro-Deposited Photoresist
I-photoresistance yombane, i-electrophoretic photoresistance yindlela entsha yokwakha "i-photosensitive resistance", eyayisetyenziselwa ukubonakala kwezinto eziyinkimbinkimbi zetsimbi "ipeyinti yombane", esandul 'ukufakwa kwisicelo "sokumelana nefoto". Ngokusebenzisa i-electroplating, i-colloidal particles ehlawulweyo ye-photosensitive charged resin ifakwe ngokufanayo kumhlaba wobhedu webhodi yesekethe njenge-inhibitor ngokuchasene ne-etching. Okwangoku, isetyenziswe kwimveliso yobuninzi kwinkqubo yobhedu oluthe ngqo lwe-laminate yangaphakathi. Olu hlobo lwe-ED photoresist lunokufakwa kwi-anode okanye i-cathode ngokulandelanayo ngokweendlela ezahlukeneyo zokusebenza, ezibizwa ngokuba yi-"anode photoresist" kunye ne "cathode photoresist". Ngokomgaqo-nkqubo we-photosensitive, kukho "i-photosensitive polymerization" (i-Negative Working) kunye "ne-photosensitive decomposition" (i-Positive Working) kunye nezinye iindidi ezimbini. Okwangoku, uhlobo olubi lwe-photoresistance ye-ED luye lwathengiswa, kodwa lunokusetyenziswa kuphela njenge-arhente yokumelana neplani. Ngenxa yobunzima be-photosensitive kumngxuma odlulayo, ayinakusetyenziselwa ukuhanjiswa komfanekiso wepleyiti yangaphandle. Ngokubhekiselele kwi-"positive ED", enokusetyenziswa njenge-agent ye-photoresist kwi-plate yangaphandle (ngenxa ye-photosensitive inwebu, ukungabikho kwempembelelo ye-photosensitive eludongeni lomngxuma aluchaphazeleki), imboni yaseJapan isaqhubela phambili imizamo thengisa ukusetyenziswa kwemveliso yobuninzi, ukwenzela ukuba ukuveliswa kwemigca ebhityileyo kufikeleleke ngokulula. Eli gama likwabizwa ngokuba yi-Electrothoretic Photoresist.
10. I-Flush Conductor
Yibhodi yesekethe ekhethekileyo ethe tyaba ngokupheleleyo ngenkangeleko kwaye icinezela yonke imigca yomqhubi kwipleyiti. Isenzo sephaneli yayo enye kukusebenzisa indlela yokudlulisa umfanekiso ukukrola inxalenye yefoyile yobhedu kumphezulu webhodi kwibhodi yezinto ezisisiseko eqina kancinci. Ubushushu obuphezulu kunye noxinzelelo oluphezulu indlela iya kuba umgca webhodi ibe ipleyiti semi-lukhuni, kwangaxeshanye ukugqiba ipleyiti resin umsebenzi lukhuni, kumgca kumphezulu kwaye yonke ibhodi yesekethe flat. Ngokwesiqhelo, umaleko wobhedu obhityileyo ucandwa kumphezulu wesekethe enokurhoxa ukuze umaleko wenickel oyi-0.3mil, umaleko we-rhodium we-intshi ezingama-20, okanye umaleko wegolide we-intshi ezili-10 unokubekwa ukuze unike ukuchasana okuncinci kunye nokutyibilika lula ngexesha lokunxibelelana ngokutyibilika. . Nangona kunjalo, le ndlela kufuneka ingasetyenziselwa i-PTH, ukwenzela ukukhusela umngxuma ekugqabhukeni xa ucinezela. Akulula ukufikelela kwindawo egudileyo ngokupheleleyo yebhodi, kwaye akufanele isetyenziswe kwiqondo lokushisa eliphezulu, xa kwenzeka ukuba i-resin ikhule kwaye iqhube umgca ngaphandle kwendawo. Ikwabizwa ngokuba yi-Etchand-Push, iBhodi egqityiweyo ibizwa ngokuba yi-Flush-Bonded Board kwaye ingasetyenziselwa iinjongo ezikhethekileyo ezifana ne-Rotary Switch kunye noKusula ooNxibelelwano.
11. Frit
Kwi-Poly Thick Film (PTF) yokuprinta intlama, ukongeza kwiikhemikhali zentsimbi ezixabisekileyo, umgubo weglasi usafuneka ukuba wongezwe ukuze udlale isiphumo socondensation kunye nokubambelela kwiqondo eliphezulu lokunyibilika, ukuze intlama yokuprinta iqhubeke. i-substrate ye-ceramic engenanto inokwenza inkqubo yesekethe yentsimbi exabisekileyo.
12. Inkqubo eyongezelelweyo ngokupheleleyo
Kuphezu kwephepha le-insulation epheleleyo, ngaphandle kwe-electrodeposition yendlela yensimbi (uninzi oluninzi luyi-chemical copper), ukukhula kwenkqubo yesekethe ekhethiweyo, enye inkcazo engachanekanga ncam yi "Electroless Full".
13. I-Hybrid Integrated Circuit
Yinto encinci porcelain substrate obhityileyo, kwindlela yoshicilelo ukusebenzisa umgca we-inki ehloniphekileyo yesinyithi, kwaye emva koko nge-inki ephezulu yobushushu be-organic yatshiswa, ishiya umgca womqhubi phezu komphezulu, kwaye inokuqhuba iindawo zokubopha umphezulu we-welding. Luhlobo lomthwali wesekethe yetekhnoloji yefilimu eshinyeneyo phakathi kwebhodi yesekethe eprintiweyo kunye nesixhobo sesekethe esidibeneyo sesemiconductor. Ngaphambili isetyenziselwa umkhosi okanye usetyenziso lwe-frequency ephezulu, iHybrid ikhule kancinci ngokukhawuleza kwiminyaka yakutshanje ngenxa yeendleko zayo eziphezulu, ukuhla kwamandla omkhosi, kunye nobunzima kwimveliso ezenzekelayo, kunye nokunyuka kwe-miniaturization kunye nobugocigoci beebhodi zesekethe.
14. Umchazeli
I-Interposer ibhekisa kuwo nawaphi na amaleko amabini eekhondakta ezithwalwa ngumzimba okhuselayo oqhutywayo ngokongeza isigcwalisi esiqhubayo kwindawo eza kuqhutywa kuyo. Ngokomzekelo, kumngxuma ongenanto wepleyiti ye-multilayer, izinto ezifana nokuzalisa intlama yesilivere okanye intlama yobhedu ukuze ithathe indawo yodonga lobhedu lwe-orthodox, okanye izinto ezifana ne-vertical unidirectional conductive rubber layer, zonke zi-interposers zolu hlobo.
15. I-Laser Direct imaging (LDI)
Kukucofa ipleyiti encanyathiselwe kwifilimu eyomileyo, ungasasebenzisi ukuvezwa okungalunganga kugqithiso lomfanekiso, kodwa endaweni yomyalelo wekhompyuter welaser beam, ngokuthe ngqo kwifilimu eyomileyo yokuskena ngokukhawuleza kwemifanekiso eshukumayo. Udonga olusecaleni lwefilimu eyomileyo emva komfanekiso luthe nkqo ngakumbi kuba ukukhanya okukhutshiweyo kuhambelana nomqadi wamandla ogxininisiweyo omnye. Nangona kunjalo, indlela inokusebenza kuphela kwibhodi nganye ngabanye, ngoko ke isantya sokuvelisa ubuninzi sikhawuleza kakhulu kunokusebenzisa ifilimu kunye nokuvezwa kwendabuko. I-LDI inokuvelisa kuphela iibhodi ezingama-30 zobukhulu obuphakathi ngeyure, ngoko inokuvela ngamaxesha athile kuphela kudidi lobungqina bephepha okanye ixabiso eliphezulu leyunithi. Ngenxa yeendleko eziphezulu zokuzalwa, kunzima ukukhuthaza kwishishini
16.Laser Maching
Kwishishini le-elektroniki, zininzi iinkqubo ezichanekileyo, ezinje ngokusika, ukugrumba, ukuwelda, njl. I-LASER ibhekiselele "kwi-Light Amplification Stimulated Emission of Radiation" izifinyezo, eziguqulelwe njenge-"LASER" ngoshishino lwelizwe ngokubanzi ngokuguqulelwa kwayo simahla, ngakumbi kwinqanaba. I-Laser yadalwa ngo-1959 yi-American physicist th moser, eyasebenzisa umtha omnye wokukhanya ukuvelisa ukukhanya kweLaser kwiirubhi. Iminyaka yophando yenze indlela entsha yokucubungula. Ngaphandle kweshishini lombane, linokusetyenziswa nakwiindawo zonyango kunye nezomkhosi
17. Ibhodi yeMicro Wire
Ibhodi yesekethe ekhethekileyo ene-PTH interlayer interconnection iyaziwa ngokuba yi-MultiwireBoard. Xa ukuxinana kweengcingo kuphezulu kakhulu (160 ~ 250in/in2), kodwa i-wire diameter incinci kakhulu (ngaphantsi kwe-25mil), ikwabizwa ngokuba yibhodi yesekethe etywiniweyo.
18. ISekethe eBunjiweyo
Isebenzisa ukungunda okumacala-ntathu, yenza isitofu sokubumba okanye indlela yokuguqula ukugqiba inkqubo yebhodi yesekethe yestereo, ebizwa ngokuba yisekethe eMolded okanye iMolded system connection circuit circuit.
19 . Muliwiring Board ( Discrete Wiring Board)
Isebenzisa ucingo olucekeceke kakhulu olunameleli, ngokuthe ngqo kumphezulu ngaphandle kwepleyiti yobhedu yocingo olunamacala amathathu anqamlezayo, emva koko ngokutyabeka okusisigxina kunye nokugrumba kunye nomngxuma wokutyabeka, ibhodi yesekethe yoqhagamshelo lwamaleyi amaninzi, eyaziwa ngokuba “yibhodi yeentambo ezininzi. ”. Oku kuphuhliswa yi-PCK, inkampani yaseMelika, kwaye isaveliswa nguHitachi kunye nenkampani yaseJapan. Le MWB inokonga ixesha kuyilo kwaye ifanelekile kwinani elincinci loomatshini abaneesekethe ezintsonkothileyo.
20. Noble Metal Paste
Yintlama eqhubayo yoshicilelo lwefilim eshinyeneyo. Xa ishicilelwe kwi-substrate ye-ceramic ngokuprintwa kwesikrini, kwaye emva koko umthuthi wezinto eziphilayo utshiswe kude nobushushu obuphezulu, isekethe yentsimbi esisigxina ibonakala. I-powder conductive metal eyongeziweyo kwi-paste kufuneka ibe yintsimbi ehloniphekileyo ukuphepha ukubunjwa kwee-oxides kumaqondo aphezulu. Abasebenzisi bezinto ezithengiswayo banegolide, iplatinam, irhodium, ipalladium okanye ezinye iintsimbi ezixabisekileyo.
21. Ibhodi yeePads Kuphela
Kwiintsuku zokuqala ze-instrumentation yomngxuma, ezinye iibhodi ezinokuthembeka okuphezulu kwe-multilayer zivele zashiya umngxuma wokutyhutyha kunye neringi ye-weld ngaphandle kwepleyiti kwaye yafihla imigca edibanisayo kumaleko angaphakathi asezantsi ukuqinisekisa isakhono esithengisiweyo kunye nokhuseleko lomgca. Olu hlobo olongezelelweyo lweeleya ezimbini zebhodi aziyi kuprintwa ukuwelda ipeyinti eluhlaza, ngokubonakala kwengqwalasela ekhethekileyo, ukuhlolwa komgangatho kungqongqo kakhulu.
Okwangoku ngenxa yokwanda koxinaniso lweentambo, iimveliso ezininzi ze-elektroniki eziphathwayo (ezifana neselfowuni), ubuso bebhodi yesekethe bushiya kuphela i-SMT soldering pad okanye imigca embalwa, kunye nokudityaniswa kwemigca eshinyeneyo kumaleko angaphakathi, i-interlayer nayo inzima. ukuya kumphakamo wemigodi yaphukile umngxuma oyimfama okanye umngxuma oyimfama "isigqubuthelo" (IiPads-On-Hole), njengoko uqhagamshelo ukuze kuncitshiswe umngxuma wonke udityaniswe nomonakalo omkhulu womphezulu wobhedu, ipleyiti ye-SMT nayo iiPads Kuphela iBhodi.
22. iPolymer Thick Film (PTF)
Yeyona intlama yoshicilelo yentsimbi exabisekileyo esetyenziswa ekwenziweni kweesekethe, okanye intlama yoshicilelo eyenza ifilim eprintiweyo yokumelana, kwi-substrate yeceramic, enoshicilelo lwescreen kunye nokutshiswa kobushushu obuphezulu obulandelayo. Xa i-organic carrier itshiswa kude, inkqubo yeesekethe ezinamathele ngokuqinileyo yenziwa. Iipleyiti ezinjalo zibizwa ngokuba ziisekethe ezixubileyo.
23. Inkqubo yeSemi-Additive
Kukukhomba kwizinto ezisisiseko zokugquma, ukukhulisa isiphaluka esifuna kuqala ngokuthe ngqo ngobhedu lwekhemikhali, sitshintshe kwakhona i-electroplate yobhedu ithetha ukuqhubeka nokujiya ngokulandelayo, biza inkqubo ethi "Semi-Additive".
Ukuba indlela yobhedu yeekhemikhali isetyenziselwa ubuninzi bomgca, inkqubo ibizwa ngokuba "ukudibanisa okupheleleyo". Qaphela ukuba le nkcazo ingentla isuka kwi-* specication ipc-t-50e epapashwe ngoJulayi 1992, eyahlukileyo kwi-ipc-t-50d yokuqala (Novemba 1988). I-"D version" yokuqala, njengoko yaziwa ngokuqhelekileyo kushishino, ibhekisela kwi-substrate engenanto, engaqhubekiyo, okanye i-foil yobhedu ebhityileyo (efana ne-1/4oz okanye i-1/8oz). Ukutshintshwa komfanekiso we-agent echasayo engalunganga ilungiselelwe kwaye isiphaluka esifunekayo sigxininiswe ngekhemikhali yobhedu okanye i-plating yobhedu. I-50E entsha ayithethi igama elithi "ubhedu oluncinci". Umsantsa phakathi kwezi nkcazo zimbini mkhulu, kwaye izimvo zabafundi zibonakala ngathi zivele ngeThe Times.
24.Inkqubo ye-Substractive
Yindawo ye-substrate yokususwa kwefoyile yobhedu engenamsebenzi yendawo, indlela yebhodi yesekethe eyaziwa ngokuba "indlela yokunciphisa", yeyona nto iphambili yebhodi yesekethe iminyaka emininzi. Oku kuchasene nendlela "yokongezwa" yokongeza imigca yomqhubi wobhedu ngokuthe ngqo kwi-substrate engenakho ubhedu.
25. ISekethe yeFilimu eThick
I-PTF (i-Polymer Thick Film Paste), equlethe iintsimbi ezixabisekileyo, iprintwa kwi-substrate ye-ceramic (efana ne-aluminium trioxide) kwaye ikhutshwe kwiqondo lokushisa eliphezulu ukwenza inkqubo yesekethe kunye ne-conductor yesinyithi, ebizwa ngokuba "yi-circuit film circuit". Luhlobo lweSekethe encinci yeHybrid. I-Silver Paste Jumper kwi-PCBS enecala elinye ikwaprinta ifilimu eshinyeneyo kodwa ayifuni kugxothwa kumaqondo obushushu aphezulu. Imigca eprintiweyo kumphezulu we-substrates eyahlukeneyo ibizwa ngokuba yimigca "yefilimu engqingqwa" kuphela xa ubukhulu bungaphezulu kwe-0.1mm [4mil], kwaye iteknoloji yokuvelisa "inkqubo yesekethe" ibizwa ngokuba "iteknoloji yefilimu engqingqwa".
26. Thin Film Technology
Ngumqhubi kunye nesekethe edityanisiweyo encanyathiselwe kwi-substrate, apho ubukhulu bungaphantsi kwe-0.1mm[4mil], yenziwe nguMphunga weVacuum, iPyrolytic Coating, Cathodic Sputtering, Chemical Vapor Deposition, electroplating, anodizing, njl., ebizwa ngokuba “ncinci itekhnoloji yefilimu". Iimveliso ezisebenzayo zineSekethe ye-Thin Film Hybrid kunye neSekethe eDityanisiweyo yeFilimu encinci, njl.
27. Ukudluliselwa kweSekethe yeLaminatied
Yindlela entsha yokuvelisa ibhodi yesekethe, kusetyenziswa i-93mil engqindilili iye yacutshungulwa ipleyiti yentsimbi egudileyo, kuqala wenze ugqithiso lwemizobo yefilim eyomileyo, kwaye emva koko umgca wokucwenga wobhedu onesantya esiphezulu. Emva kokuhlutha ifilimu eyomileyo, indawo yeplate yensimbi engenasici ingacinezelwa kwiqondo lokushisa eliphezulu kwifilimu enzima. Emva koko susa ipleyiti yensimbi engenasici, ungafumana umphezulu webhodi yesekethe ethe tyaba. Inokulandelwa kukugrumba kunye nemingxuma yokubeka ukuze ufumane unxibelelwano lwe-interlayer.
I-CC - 4 coppercomplexer4; I-photoresist ye-Edelectro-deposited iyonke yindlela yokongeza eyenziwe yinkampani yaseMelika ye-PCK kwi-substrate ekhethekileyo yobhedu (jonga inqaku elikhethekileyo malunga nephepha le-47 lephepha lebhodi yesiphaluka ngolwazi lweenkcukacha) Ukumelana nokukhanya kombane IVH (I-Interstitial Via Hole); I-MLC (I-Multilayer Ceramic) (i-inter laminar yangaphakathi emngxunyeni); Ipleyiti encinci ye-PID (Ifoto ecingelwayo yeDielectric) iibhodi zesekhethi zeceramic zolwakhiwo oluninzi; I-PTF (imidiya ye-photosensitive) Isekhethi yefilimu eshinyeneyo yePolymer (eneshiti elishinyeneyo lokuncamathelisa ifilimu yebhodi yesekethe eprintiweyo) SLC (IiSekethe zeLaminar ezingaphezulu); Umgca wokugquma ubuso bubuchwephesha obutsha obupapashwe yi-IBM Yasu laboratory, eJapan ngoJuni 1993. Ingumgca odibanisayo we-multi-layer kunye ne-Curtain Coating yepeyinti eluhlaza kunye ne-electroplating copper ngaphandle kwepleyiti ephindwe kabini, ephelisa isidingo ukugrumba kunye nokufaka imingxuma kwipleyiti.