Ezinye iinkqubo ezizodwa zokuvelisa i-PCB (i)

I-1. Inkqubo eyongezelelweyo

Umaleko wekhemikhali usetyenziselwa ukukhula ngokuthe ngqo kwemigca yokuqhutywa komqhubi kumgangatho wokuqhutywa kunye noncedo olongezelelekileyo.

Iindlela zokudibanisa kwiBhodi yeSiphaluka zinokwahlulwa zibe zizongezwe ngokupheleleyo, zivele kwaye zizongeze kunye nezinye iindlela ezahlukeneyo.

 

I-2. I-Backnenels, i-backplanes

Kuyinto emdaka (efana ne-0.093, 0.125 ") Ibhodi yesekethe, isetyenziselwa ngokukodwa kwiplagi kwaye uqhagamshele ezinye iibhodi. Oku kwenziwa ngokufaka isinxibelelanisi sePunsi-pire kwimngxunya eqinileyo, kodwa kungathengisi, kwaye emva koko i-wiring nganye nganye idlula apho isinxibelelanisi sidlula khona ebhodini. Isinxibelelanisi sinokufakwa ngokwahlukeneyo kwiBhodi yeSekethi Jikelele. Ngenxa yeBhodi ekhethekileyo, yawo 'ngomngxunya engenaluthengisi, kodwa vumela i-Hole Wall ingqongqo kwaye ingabi samkela le mpahla ingqongqo, kodwa iphantse ibe linqanaba eliphezulu le-United States.

 

I-3. Inkqubo yokwakha

Le yintsimi entsha yokwenza ukuba umntu oqaqambileyo, ukuqaqamba okutsha kufumaneka kwinkqubo ye-IBM ye-Ibm, kwiPaneli yayo yeSina yeSoftware, emva kokuba i-piner ifowni yendlela enamanzi amdaka " Via), emva koko kumqhubi obanzi wekhemikhali wobhedu kunye nobhedu ukubekwa komgca, kwaye emva kokucingisisa ngomgca kunye nokufumana i-wire entsha kunye nomngxunya ongaboniyo. Ukuncamathela okuphindiweyo kuya kuvelisa inani elifunekayo leendawo. Le ndlela ayinakuphepha kuphela iindleko ezixabisa kakhulu zokuqhuba ngoomatshini, kodwa inciphisa i-hole idayimeti engaphantsi kwe-10. Kule minyaka ingama-5 ~ idlulileyo, zonke iintlobo zokwaphula iteknoloji yendabuko yamkela itekhnoloji yolandelelaniso, kumzi-mveliso waseYurophu phantsi kwe-push, yenza inkqubo ekhoyo idweliswe ngaphezulu kweentlobo ezingaphezu kwe-10. Ngaphandle "kweporestoritive"; Emva kokususa ikhava yobhedu kunye nemingxunya, ukwenziwa kweengcango ezahlukeneyo "ezinje nge-Alkaline Chemicking, i-Laser Abuting, kunye ne-epking yePlasma yamkelwe kwiipleyiti zezinto eziphilayo. In addition, the new Resin Coated Copper Foil (Resin Coated Copper Foil) coated with semi-hardened resin can also be used to make a thinner, smaller and thinner multi-layer plate with Sequential Lamination. Kwixa elizayo, iimveliso ze-elektroniki ezahlukeneyo ziya kuba luhlobo lwehlabathi elicekeceke kwaye lifutshane leBhodi yeBhodi yeBhodi.

 

I-4. Cermet

I-ceramic powder kunye nomgubo wesinyithi uxutywe, kwaye ukunamathela kongezwa njengohlobo lokudibana, olunokuprintwa kweBhodi yeSiphalo (okanye ifilimu engaphakathi) ye "Destirtor", endaweni yomthi wendibano.

 

5. Ukudubula

Yinkqubo yeBhodi yeParadi yePorcelain Hybrid. Imigca yesekethe ye-paste yefilimu eprintayo eprintwe kumphezulu weBhodi encinci igxothiwe kubushushu obuphezulu. Abathwali abaninzi bezinto eziphilayo kwi-paste yefilimu itshisiwe, beshiya imigca yomqhubi wesinyithi exabisekileyo ukuba isetyenziswe njengeingcingo zonxibelelwano

 

I-6. I-CrossOver

Ukuwela imigangatho emithathu yeengcingo ezimbini kwiBhodi yeBhodi kunye nokuzaliswa kwendawo yokufaka ifayilithi phakathi kweendawo zokuhla zibizwa. Ngokubanzi, i-Paint enye yepeyinti yepeyinti ye-carbon dibanisa ifilimu ye-carbon, okanye indlela yokubeka ngasentla nangaphantsi kwe-wiring yeyoku "cross"

 

7. Ibhodi ye-odiring ye-odiring

Elinye igama kwiBhodi yee-Wiring ezahlukeneyo, yenziwa nge-wire ejikelezayo eqhotyoshelwe kwiBhodi kwaye ifakwe kwimingxunya. Ukusebenza kolu hlobo lwebhodi yee-amaninzi kwilayini ephezulu yothungelwano lungcono kune-square square tekt ikhutshiwe yi-PCB eqhelekileyo.

 

I-8. I-Dyco Lous

Inkampani ye-Switzerland Dyconex iphuhlise ukwakhiwa kwenkqubo e-Zurich. Yindlela yelungelo elilodwa lomenzi ukuze isuse i-foil yendawo yokuhamba kwemingxunya kwindawo evaliweyo yokuqala, kwaye emva koko isetyenziselwe i-cf4, i-N2, i-IO2 kwi-CFOIC kwi-CEBS ASTE SPICS kwaye ivelise imingxunya yezikhokelo ezincinci (ngaphantsi kwe-10mil). Inkqubo yentengiso ibizwa ngokuba yidcostrate.

 

I-9. I-electro-iffered

Ifoto yombane, i-elektrophoretic yefoto yindlela yokwakha entsha "yokwakha ifoto", kwasekuqaleni esetyenziselwa ukubonakala kwezinto zentsimbi ezintsonkothileyo ", ipeyinti yombane", isandula ukwenziwa kwisicelo se "FotResistical". Ngokusebenzisa i-elektroplating, amasuntswana afudukayo ye-colloidal offsonsition arestein ahlawuliswe i-resin ifakwe ngendlela efanayo kwindawo yobhedu kwiBhodi yeSiphako njenge-inhibitor. Okwangoku, isetyenzisiwe kwimveliso enkulu kwinkqubo ye-etching yobhedu. Olu hlobo lwefoto ngo-Ed lunokubekwa kwi-anode okanye i-thehode ngokuhambelana neendlela ezahlukeneyo zokusebenza, ezibizwa ngokuba "yifoto" kunye "nefoto". Ngokutsho komgaqo ophambili wefoto, kukho "i-polymeriting Polymerization" (i-Polysensing) kunye "neNdawo eyiFotopotive" (iyasebenza) kunye nezinye iintlobo ezimbini. Okwangoku, uhlobo olungalunganga lwefoto ifotreyini sele lithengisiwe, kodwa inokusetyenziswa kuphela njengearhente yokunganyangeki yeplani. Ngenxa yobunzima bokufotokopisha kwi-thes-the-hole, ayinakusetyenziselwa ukudluliselwa kwemifanekiso yeplate yangaphandle. Ngokuphathelele "i-ED", enokusetyenziswa njenge-arhente yefoto kwiplate yangaphandle (ngenxa yemfumba ye-fotosi, ishishini laseJapan lingachaphazeleki), ukuvelisa imigca yaseJapan kungachaphazelekanga ngokulula. ILizwi likwabizwa ngokuba yiFortrothoretic umfanekiso.

 

10. Umqhubi we-flish

Ibhodi yesekethe ekhethekileyo engagungqiyo ngokupheleleyo ngenkangeleko kwaye icinezela yonke imigca yoqhubi kwiplate. Inkqubo yephaneli yayo enye kukusebenzisa indlela yokudluliselwa kwemifanekiso kwinxalenye ye-foil ye-foil yebhodi yeBhodi kwiBhodi yeBhodi esekwe. Ubushushu obuphezulu kunye nendlela ephezulu yoxinzelelo iya kuba ngumgca webhodi kwipleyiti ye-semi-olt, ngaxeshanye ukugqiba umsebenzi wokuphumla, kumgca webhodi yesekethe. Ngokwesiqhelo, umaleko ocekeceke ocofe umphezulu wesekethe ukuze ube ngumgangatho we-0.3mil wickel, i-20-intshi ye-20 ye-Intshi yase-Inch Rhodium, okanye i-intshi ye-intshi ye-Intshi ye-10, okanye i-intshi ye-Intshi ye-10 ye-intshi inokubekwa ukubonelela ngokudibana noqhawulo-mtshato. Nangona kunjalo, le ndlela ayifanele isetyenziselwe i-PT, ukwenzela ukuthintela umngxunya ukuba ungaqhubeki xa ucinezela. Akulula ukufezekisa indawo egudileyo yeBhodi, kwaye ayifanele isetyenziswe kwiqondo lokushisa eliphezulu, ukuba i-resin iyanda kwaye emva koko ityhalele umgca ngaphandle komhlaba. Kwabizwa ngokuba yi-etchand-tycung, ibhodi egqityiweyo ibizwa ngokuba yiBhodi eDlush-Bodd-Bodd-Bodd kwaye inokusetyenziselwa iinjongo ezizodwa ezinje ngotshintsho olujikelezayo kunye nokutshiza abafowunelwa.

 

11. Frit

Kwi-poly multing upction pile, ukongeza kwiikhemikhali zentsimbi ezixabisekileyo, i-gubler isafunwa ukuba idlale isiphumo sobushushu be-ceramic sinokwenza inkqubo yesekethe eqinileyo yentsimbi.

 

I-12. Inkqubo eyongeziweyo

Ikwindawo yokufakelwa kwephepha lokufakelwa okupheleleyo, ngaphandle kokufakwa kwendlela yensimbi (uninzi lobhedu), ukukhula kokukhetha ikhefu lokuziqhelanisa, elinye intetho engeyonto ichanekileyo 'ngombane othembekileyo'.

 

Isekethe elihlanganisiweyo le-Hybrid

Yinto encinci ye-porcelain incinci, kwindlela yokuprinta yokufaka i-inki yensimbi ye-inki, emva koko i-Inki yobushushu i-Inki itshiswe, ishiya i-uqhubekisa kumphezulu, kwaye inokuqhuba umda we-welding. Luhlobo lokuthwala isekethe yeTekhnoloji yeFilimu phakathi kweBhodi yeSekethi eprintiweyo kunye neSemiconductor isixhobo sesekethe. Ngaphambili isetyenziselwa izicelo zomkhosi okanye eziphezulu zerediyo, i-hybrid ikhule kancinci ngokukhawuleza kwiminyaka yakutshanje ngenxa yexabiso layo, kunye nobunzima beebhodi zesekethe.

 

14. I-Interposer

I-interreser ibhekisa kuzo naziphi na iindawo ezimbini zabaqhubi abathweswe ngumzimba okhuselayo obandakanyekayo ngokongeza abanye abaqhubayo. Umzekelo, kumngxunya ongenanto yeplate ye-multilayer, izixhobo ezinje nge-paste yokugcwalisa isilivere okanye i-copper ye-orper ye-Orthodox Couper, okanye izixhobo ezifana nerabha yerabha, bonke bangabaphambukeli bohlobo.

 

I-15. I-Laser ngokuthe ngqo (ldi)

Kukucinezela iplate iqhotyoshelwe kwifilimu eyomileyo, engasasebenziyo ukuvezwa okungalunganga kokudluliselwa kwemifanekiso, kodwa endaweni yecomputer i-leser beam, ngqo kwifilimu eyomileyo yokujonga i-picken scanfonsonfenscial ingcinga yokucinga. Udonga lwecala lefilimu eyomileyo emva kokucingelwa lithe tye ngenxa yokuba ukukhanya kukhutshiwe kuyahambelana nomthi odibeneyo wamandla ohlanganisiweyo. Nangona kunjalo, le ndlela inokusebenza kwiBhodi nganye ngokukodwa, ngoko ke isantya semveliso eninzi sikhawuleza kakhulu kunokusebenzisa ifilimu kunye nokuvezwa kwemveli. I-LDI inokuvelisa kuphela iibhodi ezingama-30 zobukhulu obuphakathi ngeyure, ukuze iphinde ivele ngamaxesha athile kudidi lwephepha lokudinwa kwephepha okanye ixabiso eliphezulu. Ngenxa yendleko eziphezulu zengukumkani, kunzima ukukhuthaza kwishishini

 

16.I-Laser Maching

Kwishishini le-elektroniki, zininzi iindlela zokulungisa izinto ezichanekileyo, ezinjengokusika, ukunxila, i-welding, njl njl. I-Laser ibhekisa kwi "Amphation eKhanyayo ekhutshiwe ngemisebe", iguqulwe njenge "mberg" ngumzi-mveliso omkhulu wasimahla wenguqulo yasimahla, ngakumbi ukuya kwinqanaba. I-Laser yadalwa ngo-1959 ngugqirha waseMelika th moser, osebenzisa umbane omnye wokukhanya ukuvelisa ukukhanya kwe-larser. Iminyaka yophando yenze indlela entsha yokulungisa. Ngaphandle kweShishini le-elektroniki, inokusetyenziswa nakwiindawo zonyango kunye nomkhosi

 

17. Ibhodi encinci yoWire

Ibhodi yesekethe ekhethekileyo enonxibelelwano lwe-PTAyer iqhelekile njengebhodi yeebhodi ezininzi. Xa uxinzelelo lwe-wiring luphezulu kakhulu (i-160 ~ 250in / i-In2), kodwa i-Wire incinci kakhulu (ngaphantsi kwe-25ml), ikwabizwa ngokuba yiBhodi yesekethe eMicro.

 

I-18. Ibumba i-cirxupit

Kusebenzisa ubumba obunemilinganiselo emithathu, yenza indlela yokutsala okanye indlela yenguqu ukugqibezela inkqubo yeBhodi yeSekethe yeStereo, ebizwa ngokuba yiSekethe yeSekethe yeSekethe okanye eMbundunqwayo

 

19. Ibhodi ye-Mulidi
Isebenzisa icingo elicekeceke elicekeceke kakhulu, ngokuthe ngqo kumphezulu ngaphandle kweplate yobhedu i-wiriment ye-wirimenting, kwaye emva koko ngokudibana kwesephesheni kunye nokuntywila kunye nokubetha umngxunya, i-Multi-Forcoct ye-Multiment, yaziwa ngokuba yi "hirli yocingo oluninzi". Oku kuphuhliswa yi-Pck, inkampani yaseMelika, kwaye isaveliswa yi-hitchi ngenkampani yaseJapan. Le MWB inokugcina ixesha kuyilo kwaye ilungele inani elincinci loomatshini abanephakethe ezinzima.

 

I-20. I-nobledy yensimbi yensimbi

Yipasika eqhubayo kwi-ficture yokuprinta yefilimu. Xa iprintwe kwi-ceramic subrate ngumshicileli wesikrini, kwaye emva koko umphathi wezinto eziphilayo utshisiwe kwiqondo lokushisa eliphezulu, isiphaluka esizinzileyo sentsimbi sivela. Umgubo wesinyithi osebenzayo oye wongezwa kwi-paste kufuneka abe sisinyithi esihle ukuthintela ukwenziwa kwee-oxides kubushushu obuphezulu. Abasebenzisi beempahla banegolide, iplatinam, i-rhodium, ipalladium okanye ezinye izinyithi ezixabisekileyo.

 

21. Iipads zebhodi kuphela

Kwiintsuku zokuqala zesixhobo se-Hole, iibhodi eziphakamileyo zokuthenjwa zishiyle nje ngokuhamba-hamba kunye ne-WED ngaphandle kweplate kwaye zifihla imigca edibeneyo yokuqinisekisa ubuchule obukhethiweyo kunye nokhuseleko olusezantsi. Olu hlobo lwezinto ezimbini zeBhodi aluyi kuprinta ipeyinti eluhlaza, ngembonakalo yoqwalaselo olukhethekileyo, uhlolo olusemgangathweni lungqongqo kakhulu.

Okwangoku ngenxa yokunyuka koxinzelelo lwe-wiring, njengeyona fowuni iphambili), iBhodi yeSekethi ishiya i-PADS engathengiswanga okanye i-Part-On-Colect " Umonakalo, iplate ye-SMT ikwayi-pads ibhodi kuphela

 

I-22. Ifilimu ye-Polymer mfutshane (PTF)

Ngumdlalo wokushicilela oxabisekileyo wesinyithi osetyenzisiweyo kwisekethe, okanye usukelo lokuprinta oshicilelweyo, kwi-subramic subrate, kunye nokuprinta okuphezulu kunye nobushushu obulandelayo. Xa umphathi we-organic utshisiwe, inkqubo yesekethe esekhotshwe ngokuqinileyo yenziwa. Iiplate ezinjalo zibizwa ngokuba ziziphaluka ze-hybrid.

 

23. Inkqubo eyongeziweyo

Kuya kuthi ga ngokusisiseko sezinto ezisisiseko zokufakwa, khulisa isekethe efuna kuqala ngobheduzo lwekhemikhali, ukutshintsha kwakhona i-elektropplaist kuthetha ukuqhubeka nokuqhubeka nenkqubo, tsalela umnxeba ".

Ukuba indlela yobhedu yekhemikhali isetyenziselwa wonke umda, inkqubo ibizwa ngokuba "ukongeza". Qaphela ukuba le nkcazo ingentla ivela kwi * IPC-T-50E epapashwe ngo-1992, eyahlukileyo kwi-IPC-T-50D (Novemba 1988). Inguqulelo yokuqala "D", njengoko iqhele ukuba ibhaliwe kwishishini, ibhekisa kwindawo engenanto yayo, engasebenzi, okanye i-foil yocwangco (i-1 / 8OZ okanye i-1 / 8Oz okanye i-1 / 8OZ okanye i-1 / 8Oz okanye i-1 / 8Oz okanye i-1 / 8oz). Ukudluliselwa kwemifanekiso yearhente engalunganga yokuxhathisa ilungiselelwe kwaye isekethe elifunekayo litshitshiwe ngumbhedu okanye ukubekwa kobhedu. I-50E 50A ayithethi igama elithi "ubhedu olucekeceke". Umsantsa phakathi kweengxelo ezimbini ubukhulu, kwaye izimvo zabafundi zibonakala ngathi ziye zavela ngamaxesha.

 

Inkqubo ye-24.Substrive

Ngummandla omkhulu wokususwa kwe-foil ye-foil ye-foil ye-foil yendawo yokuhlala, indlela yebhodi yesekethe eyaziwa ngokuba yi "ndlela yokunciphisa", yibhodi ephambili yeBhodi yeSiphaluka iminyaka emininzi. Oku kuthelekiswa "ukongeza" indlela yokongeza imiphetho yoshicilelo yobhedu ngokuthe ngqo kumgca wokuchasana.

 

25. Isekethe i-filipt yefilimu

I-PTF (i-Polymer yeFilikhi), enezinyithi ezixabisekileyo, iprintwe kwi-suminam ye-ceramic (efana ne-aluminium trioxide) kwaye igxothiwe kwiqondo lokuqhuba lentsimbi, elibizwa ngokuba yi-Fick Wiker Soker ". Luhlobo lwesekethe elincinci le-hybrid. I-Contiper yeSilivere kwi-PCURS enamacala odwa ikwandishicilela ngefilimu kwaye ayidingi ukuba igxothwe kumaqondo obushushu aphezulu. Imigca eprintwe kumphezulu weendawo ezahlukeneyo zibizwa ngokuba "yifilimu" kuphela xa ubukhulu bungaphezulu kwe-0.1mm [4mm], kwaye itekhnoloji yemveliso 'ibizwa ngokuba yi "teknoloji yeFidey".

 

26. Itekhnoloji yefilimu encinci
NguMqhubi kunye nokunxibelelana kwisekethe eqhotyoshelwe umhlaba, apho ubukhulu bungaphantsi kwe-0.1MM [4mm], ukubhalwa kwe-vapolyting, i-piclytic ye-vaporation, i-anchroplay, ebizwa ngokuba yiTekhnoloji yeFayile "njl. Iimveliso ezisebenzayo zine-coker yesekethe enqabileyo kunye nesekethe edibeneyo yefikheji, njl

 

 

27. Dlulisa isekethe ye-laminati

Yindlela entsha yeBhodi yeBhodi yeBhodi yeSiphaluka, isebenzisa i-93mil cerick igqityiwe iplate yentsimbi engenasimo, okokuqala yenza ugqithiso lweefilimu ezizomileyo zefilimu, kwaye emva koko umgca wesantya esiphezulu. Emva kokutsala ifilimu eyomileyo, umphezulu we-Wire Staill Plain unokucinezelwa kubushushu obuphezulu kwifilimu enzima. Emva koko susa ipleyiti yentsimbi engenasimo, ungawufumana umphezulu webhodi yesekethe esekwe kwinqanawa. Ingalandelwa ngokuqhuba kwaye ibeka imingxunya yokufumana i-interconction.

Cc - 4 coppecocleclexier4; I-Edelectro-ifoto ifakwe umphosili yindlela epheleleyo yoosongelwe yinkampani yaseMelika ye-PARD-Free STARTE kwi-Instare yeBhodi yeBhodi yeBhodi ye-47 .electric ukukhanya I-MLC (i-ceralayer ye-ceramic) (i-laminare yendawo ephakathi komngxunya); iplate encinci (ifoto encinci (ifoto eqingqiweyo (ifoto eqingqiweyo) ye-ceramic ye-ceramic ye-ceramic; I-PTF (imithombo yeendaba etyhidiweyo) i-polymer filmer filmer filmer (enephepha le-paste yefilimu eprintiweyo yeBhodi yeSiphaluka) Umgca wokuphela kothintelo yitekhnoloji entsha epapashwe yi-IBM YM YM YM, eJapan ngo-Junewari 1993. I-June-1993. I-Windows-queling Right Liness Peper, ephelisa ikhowudi yokuqhuba kunye nokubeka imingxunya yeplate.


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