I-1: Isiseko sokukhetha ububanzi bocingo oluprintiweyo: ububanzi obuncinane bocingo oluprintiweyo luhambelana nokuhamba kwangoku ngocingo: ububanzi bomgca buncinci kakhulu, ukuchasana kocingo oluprintiweyo kukhulu, kunye nokuhla kwamandla ombane. kumgca mkhulu, ochaphazela ukusebenza kwesekethe. Ububanzi bomgca bubanzi kakhulu, ubuninzi be-wiring abukho phezulu, indawo yebhodi iyanda, ngaphezu kokunyuka kweendleko, ayihambisani ne-miniaturization. Ukuba umthwalo wangoku ubalwa njenge-20A / mm2, xa ubukhulu be-foil ye-copper clad yi-0.5 MM, (ngokuqhelekileyo ininzi), umthwalo wangoku we-1MM (malunga ne-40 MIL) ububanzi bomgca yi-1 A, ngoko ububanzi bomgca kuthathwa njenge-1-2.54 MM (40-100 MIL) inokuhlangabezana neemfuno zesicelo ngokubanzi. Ucingo lomhlaba kunye nonikezelo lwamandla kwibhodi yezixhobo eziphezulu zamandla zinokunyuswa ngokufanelekileyo ngokobungakanani bamandla. Kwiisekethe zedijithali zamandla aphantsi, ukwenzela ukuba kuphuculwe ubuninzi be-wiring, ubuncinci Ububanzi bomgca bunokwaneliswa ngokuthatha i-0.254-1.27MM (10-15MIL). Kwibhodi yesekethe efanayo, intambo yamandla. Ucingo oluphantsi lujiyile kunocingo lomqondiso.

2: Isithuba somgca: Xa i-1.5MM (malunga ne-60 MIL), ukuchasana kwe-insulation phakathi kwemigca kukhulu kune-20 M ohms, kwaye umbane ophezulu phakathi kwemigca ungafikelela kwi-300 V. Xa umgca we-1MM (40 MIL) ), i-voltage ephezulu phakathi kwemigca yi-200V Ngoko ke, kwibhodi yesekethe ye-voltage ephakathi kunye nephantsi (i-voltage phakathi kwemigca ayikho ngaphezu kwe-200V), i-spacing yomgca ithathwa njenge-1.0-1.5 MM (40-60 MIL) . Kwimijikelezo yombane ophantsi, njengeenkqubo zesekethe yedijithali, akuyimfuneko ukuqwalasela i-voltage yokuphuka, njengoko inkqubo yoMveliso ende ivumela, inokuba yincinci kakhulu.

I-3: I-Pad: Kwi-resistor ye-1 / 8W, i-pad lead diameter yi-28MIL yanele, kwaye kwi-1 / 2 W, ububanzi yi-32 MIL, umngxuma okhokelayo mkhulu kakhulu, kunye nobubanzi beringi yobhedu buncitshisiwe. Okubangela ukuncipha kokubambelela kwipadi. Kulula ukuwa, umngxuma okhokelayo uncinci kakhulu, kwaye ukubekwa kwecandelo kunzima.

I-4: Dweba umda wesiphaluka: Umgama omfutshane phakathi komgca womda kunye ne-pin pin pad ayikwazi ukuba ngaphantsi kwe-2MM, (ngokubanzi i-5MM inengqiqo ngakumbi) ngaphandle koko, kunzima ukusika izinto eziphathekayo.

5: Umgaqo woyilo lwecandelo: A: Umgaqo jikelele: Kuyilo lwePCB, ukuba kukho zombini iisekethe zedijithali kunye neesekethe ze-analog kwinkqubo yesekethe. Kanye kunye neesekethe eziphezulu zangoku, kufuneka zibekwe ngokwahlukileyo ukuze kuncitshiswe ukudibanisa phakathi kweenkqubo. Kuhlobo olufanayo lwesekethe, amacandelo abekwe kwiibhloko kunye nezahlulo ngokwendlela yomqondiso kunye nomsebenzi.

I-6: Iyunithi yokucwangcisa i-input, i-output signal drive element kufuneka ibe kufuphi necala lebhodi yesekethe, yenza igalelo kunye nomgca wesignali yemveliso ibe mfutshane kangangoko kunokwenzeka, ukwenzela ukunciphisa ukuphazamiseka kwegalelo kunye nemveliso.

I-7: Isalathiso sokubekwa kwecandelo: Izixhobo zinokucwangciswa kuphela kwiindlela ezimbini, ezithe tye kunye nezithe nkqo. Ngaphandle koko, ii-plug-ins azivumelekanga.

8: Izithuba zento. Kwiibhodi zoxinaniso oluphakathi, isithuba phakathi kwezinto ezincinci ezifana nezixhasi zamandla aphantsi, ii-capacitors, ii-diode, kunye nezinye izinto ezidityanisiweyo zinxulumene ne-plug-in kunye nenkqubo ye-welding. Ngexesha le-wave soldering, i-spacing yecandelo ingaba yi-50-100MIL (1.27-2.54MM). Enkulu, njengokuthatha i-100MIL, i-chip yesekethe edibeneyo, isithuba secandelo ngokuqhelekileyo yi-100-150MIL.

I-9: Xa umahluko onokwenzeka phakathi kwamacandelo mkhulu, isithuba phakathi kwamacandelo kufuneka sibe sikhulu ngokwaneleyo ukukhusela ukukhutshwa.

I-10: Kwi-IC, i-capacitor ye-decoupling kufuneka ibe kufuphi nepini yomhlaba wokubonelela ngamandla we-chip. Ngaphandle koko, umphumo wokucoca uya kuba mbi ngakumbi. Kwiisekethe zedijithali, ukwenzela ukuba kuqinisekiswe ukusebenza okuthembekileyo kweenkqubo zesekethe yedijithali, i-IC decoupling capacitors ibekwe phakathi kokunikezelwa kwamandla kunye nomhlaba we-digital digital integrated circuit chip. I-Decoupling capacitors ngokubanzi zisebenzisa i-ceramic chip capacitors enomthamo we-0.01 ~ 0.1 UF. Ukukhethwa komthamo we-decoupling capacitor ngokuqhelekileyo kusekelwe kwi-reciprocal ye-frequency yokusebenza kwenkqubo F. Ukongeza, i-capacitor ye-10UF kunye ne-0.01 UF i-ceramic capacitor nayo iyafuneka phakathi komgca wamandla kunye nomhlaba ekungeneni kombane wesiphaluka.

I-11: Icandelo lesekhethi yesandla seyure kufuneka lisondele ngokusemandleni kwiphini yesignali yewotshi ye-chip eyodwa ye-microcomputer chip ukunciphisa ubude bokudibanisa kwisiphaluka sewashi. Kwaye kungcono ukuba ungaqhubeki ucingo olungezantsi.