Kuyilo pcb, sihlala sizibuza ukuba umphezulu pcb kufuneka igqunywe ngobhedu? Oku ngokwenene kuxhomekeke kwimeko, okokuqala kufuneka siqonde iingenelo kunye nokungalunganga kobhedu olungaphezulu.

Okokuqala makhe sijonge izibonelelo zokugquma ubhedu:

1. Umphezulu wobhedu unokubonelela ngokhuseleko olongezelelweyo lokukhusela kunye nokunciphisa ingxolo yesignali yangaphakathi;
2. Inokuphucula amandla okutshatyalaliswa kobushushu bepcb
3. Kwinkqubo yokuvelisa iPCB, gcina isixa se-ejenti eyonakalisayo;
4. Kuphephe i-PCB warping deformation ebangelwa yi-PCB phezu koxinzelelo lokubuyela kwakhona olubangelwa kukungalingani kwefoyile yobhedu.

Ukwaleka komphezulu ohambelanayo wobhedu nako kunento engalunganga ehambelana nayo:

I-1, indiza yangaphandle egqunywe ngobhedu iya kwahlulwa ngamacandelo omphezulu kunye nemigca yesiginali yahlulwe, ukuba kukho i-foil yobhedu esekelwe kakubi (ingakumbi loo bhedu olucekeceke olude oluqhekekileyo), iya kuba yi-eriyali, ekhokelela kwiingxaki ze-EMI;

Ngolu hlobo lwesikhumba sobhedu sinokugrumba ngomsebenzi wesoftware

2.Ukuba isikhonkwane secandelo sigqunywe ngobhedu kwaye siqhagamshelwe ngokupheleleyo, siya kubangela ukulahleka kobushushu ngokukhawuleza, okukhokelela kubunzima kwi-welding kunye nokulungiswa kwe-welding, ngoko ngokuqhelekileyo sisebenzisa indlela yokubeka ubhedu yoxhulumaniso olunqamlekileyo kumacandelo e-patch.

Ke ngoko, uhlalutyo lokuba umphezulu ugqunywe ngobhedu unezi zigqibo zilandelayo:

I-1, uyilo lwe-PCB yemigangatho emibini yebhodi, iingubo zobhedu ziyimfuneko kakhulu, ngokubanzi kumgangatho ophantsi, umaleko ophezulu wesixhobo esiphambili kunye nokuhamba umgca wamandla kunye nomgca wesignali.
I-2, i-high impedance circuit, i-analog circuit (i-analog-to-digital conversion circuit, i-mode switching mode power converting circuit), i-copper copper iyindlela efanelekileyo.
3.Kwiibhodi ezininzi ze-high-speed ze-digital circuits kunye nokunikezelwa kwamandla apheleleyo kunye nenqwelomoya yomhlaba, qaphela ukuba oku kubhekiselele kwiisekethe zedijithali ze-high-speed, kunye nokugquma kobhedu kwinqanaba elingaphandle akuyi kuzisa inzuzo enkulu.
I-4.Ukusetyenziswa kwebhodi ye-multi-layer yesekethe yedijithali, uluhlu lwangaphakathi lunombane opheleleyo, i-plane yomhlaba, i-copper coating in the surface ayikwazi ukunciphisa kakhulu i-crosstalk, kodwa isondele kakhulu kwi-copper iya kutshintsha i-impedance ye-microstrip transmission line, i-copper engapheliyo iya kubangela impembelelo embi kwi-impedance line yokuhambisa.
5.Kwiibhodi ezininzi, apho umgama phakathi komgca we-microstrip kunye nendiza yereferensi yi-<10mil, indlela yokubuya yomqondiso ikhethwe ngokuthe ngqo kwindiza yesalathisi ebekwe ngaphantsi komgca wesignali, kunokuba ishidi lobhedu elijikelezileyo, ngenxa ye-impedance ephantsi. Kwiipleyiti eziphindwe kabini ezinomgama we-60mil phakathi komgca wesignali kunye nenqwelomoya yereferensi, i-wrapper epheleleyo yobhedu ecaleni kwendlela yonke yomgca wesignali inokunciphisa kakhulu ingxolo.
6.Kwiibhodi ezininzi, ukuba kukho izixhobo ezingaphezulu kunye ne-wiring, musa ukusebenzisa ubhedu ukuze ugweme ubhedu olugqithisileyo. Ukuba amacandelo umphezulu kunye nemiqondiso-ngesantya esiphezulu zingaphantsi, ibhodi ngokwentelekiso engenanto, ukwenzela ukuba iimfuno processing PCB, ungakhetha ukubeka ubhedu phezu komhlaba, kodwa ingqalelo uyilo PCB phakathi kobhedu kunye nesantya esiphezulu umgca uphawu ubuncinane 4W okanye ngaphezulu, ukunqanda ukutshintsha i impedance uphawu umgca wophawu.