Umngxuma ohambisa i-Via yaziwa ngokuba ngomngxuma. Ukuze kuhlangatyezwane neemfuno zabathengi, ibhodi yesekethe ngomngxuma kufuneka iplagwe. Emva kokuziqhelanisa okuninzi, inkqubo ye-aluminiyam yesiqhelo yokuplaga iyatshintshwa, kwaye imaski yebhodi yesekethe yomphezulu we-solder kunye neplagi igqitywe nge-mesh emhlophe. umngxuma. Imveliso ezinzileyo kunye nomgangatho othembekileyo.
I-Via hole idlala indima yoqhagamshelo kunye nokuqhuba imigca. Uphuhliso lweshishini lombane lukwakhuthaza uphuhliso lwePCB, kwaye lukwabeka phambili iimfuno eziphezulu kwinkqubo yokwenziwa kwebhodi eprintiweyo kunye nobuchwepheshe bokunyusa umgangatho. Itekhnoloji yokuplaga ngomngxuma ibekho, kwaye kufuneka ihlangabezane nezi mfuno zilandelayo:
(1) Kukho ubhedu kumngxuma odlulayo, kwaye isigqubuthelo sobuso sinokuxhunywa okanye singaxhunywanga;
(2) Kufuneka kubekho ilothe yetoti kumngxuma odlulayo, kunye nemfuno ethile yobukhulu (ii-microns ezi-4), kwaye akukho inki ye-solder yemaski kufuneka ingene emngxunyeni, ebangela ukuba amaso e-tin afihlwe emngxunyeni;
(3) Imingxuma ephumela kwimingxuma kufuneka ibenemingxuma ye-inki yesigqubuthelo semaski ye-solder, i-opaque, kwaye mayingabi nezangqa zenkcenkce, amaso enkcenkce kunye neemfuno zokucaca.
Ngokuphuhliswa kweemveliso ze-elektroniki kwicala "lokukhanya, elibhityileyo, elifutshane kunye nelincinci", ii-PCBs nazo ziphuhliselwe ukuxinana okuphezulu kunye nobunzima obukhulu. Ke ngoko, kuye kwavela inani elikhulu le-SMT kunye ne-BGA PCBs, kwaye abathengi bafuna ukuplaga xa kunyuswa izinto, ngakumbi kubandakanya imisebenzi emihlanu:
(1) Thintela isiphaluka esifutshane esibangelwa yitoti edlula kumphezulu wecandelo ukusuka kumngxuma xa i-PCB ithengiswa ngamaza; ingakumbi xa sibeka via emngxunyeni kwi pad BGA, kufuneka siqale senze umngxuma iplagi emva koko ngegolide-atyatyekwe lula ukujolisa BGA.
(2) Ziphephe iintsalela eziguquguqukayo kwimingxuma edlulayo;
(3) Emva kokuba ukunyuswa komphezulu kunye nokudityaniswa kwecandelo lomzi-mveliso we-elektroniki kugqityiwe, iPCB kufuneka icocwe ukuze yenze uxinzelelo olubi kumatshini wovavanyo ukuba igqibezele:
(4) Thintela intlama yesolder engaphezulu ekungeneni emngxunyeni, ibangele ukusoda okungeyonyani kwaye kuchaphazele nokubekwa;
(5) Thintela iibhola zenkcenkce ukuba zingaphumi ngexesha le-wave soldering, ebangela iisekethe ezimfutshane.
Ukufezekiswa kwenkqubo yokuplaga umngxuma conductive
Kwiibhodi zokuxhoma umphezulu, ngakumbi ukunyuswa kwe-BGA kunye ne-IC, iplagi edlula umngxuma mayibe sicaba, iconvex kwaye ibe concave dibanisa okanye thabatha 1mil, kwaye akufuneki kubekho toti ebomvu kwincam yomngxuma odlulayo; Umngxuma ufihla ibhola yetoti, ukuze ufikelele kubathengi ngokweemfuno, inkqubo yokuplaga ngomngxuma iya kuchazwa njengeyahlukeneyo, inkqubo inde kakhulu, inkqubo kunzima ukuyilawula, kwaye ioyile idla ngokuwa ngexesha umgangatho womoya oshushu kunye novavanyo lokumelana ne-oyile eluhlaza; iingxaki ezifana nokuqhuma kweoli emva kokunyanga. Ngokweemeko zokwenyani zemveliso, iinkqubo ezahlukeneyo zokuplaga zePCB zishwankathelwa, kwaye ezinye uthelekiso kunye neenkcazo zenziwa kwinkqubo kunye nezibonelelo kunye nokungalunganga:
Qaphela: Umgaqo osebenzayo wokulinganisa umoya oshushu kukusebenzisa umoya oshushu ukususa i-solder engaphezulu kumphezulu kunye nemingxuma yebhodi yesekethe eprintiweyo. I-solder eseleyo ifakwe ngokulinganayo kwiipads, imigca ye-solder engathintekiyo kunye namanqaku okupakisha angaphezulu, eyona ndlela yonyango lomphezulu webhodi yesekethe eprintiweyo enye.
1. Inkqubo yokuplaga emva komgangatho womoya oshushu
Ukuqukuqela kwenkqubo yile: imaski yesoda yomphezulu webhodi→HAL→umngxuma weplagi→ukunyanga. Inkqubo engeyiyo iplagi yamkelwe kwimveliso. Emva kokuba umoya oshushu ulinganisiwe, isikrini sephepha le-aluminiyam okanye isikrini sokuthintela i-inki sisetyenziselwa ukugqibezela ukuplaga ngomngxuma ofunwa ngumthengi kuzo zonke iinqaba. I-inki yokuplaga ingaba yi-inki ye-photosensitive okanye i-inki ye-thermosetting. Ngaphantsi kwemeko yokuba umbala wefilimu emanzi uhambelana, i-inki yokufaka iplagi ikulungele ukusebenzisa inki efanayo kunye nebhodi yebhodi. Le nkqubo inokuqinisekisa ukuba imingxuma yokutyhutyha ayiyi kuphulukana neoyile emva kokuba umoya oshushu ulinganiswe, kodwa kulula ukubangela ukuba i-inki yomngxuma weplagi ingcolise umphezulu webhodi kwaye ingalingani. Abathengi baxhomekeke kwi-soldering yobuxoki (ingakumbi kwi-BGA) ngexesha lokunyuka. Ke abathengi abaninzi abayamkeli le ndlela.
2. Umgangatho womoya oshushu kunye neteknoloji yeplagi yomngxuma
2.1 Sebenzisa i-aluminiyam sheet ukuplaga umngxuma, ukuqinisa, kunye nokupolisha ibhodi ukuze kudluliselwe imizobo
Le nkqubo isebenzisa umatshini wokulawula amanani ukukhupha iphepha le-aluminiyam ekufuneka iplagwe ukwenza isikrini, kwaye uvale umngxuma ukuqinisekisa ukuba umngxuma odlulayo ugcwele. I-inki yomngxuma weplagi ingasetyenziswa nge-inki ye-thermosetting, kwaye iimpawu zayo kufuneka zomelele. , I-shrinkage ye-resin incinci, kwaye amandla okudibanisa kunye nodonga lomngxuma lulungile. Inkqubo yokuhamba yile: unyango lwangaphambili → umngxuma weplagi → ipleyiti yokusila → ugqithiso lwepateni → ukudibanisa → isigqubuthelo sobuso
Le ndlela inokuqinisekisa ukuba umngxuma weplagi womngxuma odlulayo usicaba, kwaye akusayi kubakho zingxaki zobulunga ezifana nogqabhuko-dubulo lwe-oyile kunye nokuwa kwe-oyile ekupheleni komngxuma xa ulinganisa ngomoya oshushu. Nangona kunjalo, le nkqubo idinga ukuqina kwexesha elinye lobhedu ukwenza ubukhulu bobhedu bodonga lomngxuma buhlangabezane nomgangatho womthengi. Ngoko ke, iimfuno zokubethelwa kobhedu kwiplate yonke ziphezulu kakhulu, kwaye ukusebenza komatshini wokugaya ipleyiti nako kuphezulu kakhulu, ukuqinisekisa ukuba i-resin phezu kobhedu isuswe ngokupheleleyo, kwaye ubuso bobhedu bucocekile kwaye alungcoliswanga. . Iifektri ezininzi ze-PCB azinayo inkqubo yobhedu yokutyebisa okwexesha elinye, kwaye ukusebenza kwezixhobo akuhlangabezani neemfuno, kubangele ukusetyenziswa kakhulu kwale nkqubo kwiifektri zePCB.
1. Inkqubo yokuplaga emva kweNqanaba loMoya oHotyo
Ukuqukuqela kwenkqubo yile: imaski yesoda yomphezulu webhodi→HAL→umngxuma weplagi→ukunyanga. Inkqubo engeyiyo iplagi yamkelwe kwimveliso. Emva kokuba umoya oshushu ulinganisiwe, isikrini sephepha le-aluminiyam okanye isikrini sokuthintela i-inki sisetyenziselwa ukugqibezela ukuplaga ngomngxuma ofunwa ngumthengi kuzo zonke iinqaba. I-inki yokuplaga ingaba yi-inki ye-photosensitive okanye i-inki ye-thermosetting. Ngaphantsi kwemeko yokuba umbala wefilimu emanzi uhambelana, i-inki yokufaka iplagi ikulungele ukusebenzisa inki efanayo kunye nebhodi yebhodi. Le nkqubo inokuqinisekisa ukuba imingxuma yokutyhutyha ayiyi kuphulukana neoyile emva kokuba umoya oshushu ulinganiswe, kodwa kulula ukubangela ukuba i-inki yomngxuma weplagi ingcolise umphezulu webhodi kwaye ingalingani. Abathengi baxhomekeke kwi-soldering yobuxoki (ingakumbi kwi-BGA) ngexesha lokunyuka. Ke abathengi abaninzi abayamkeli le ndlela.
2. Umgangatho womoya oshushu kunye neteknoloji yeplagi yomngxuma
2.1 Sebenzisa i-aluminiyam sheet ukuplaga umngxuma, ukuqinisa, kunye nokupolisha ibhodi ukuze kudluliselwe imizobo
Le nkqubo isebenzisa umatshini wokulawula amanani ukukhupha iphepha le-aluminiyam ekufuneka iplagwe ukwenza isikrini, kwaye uvale umngxuma ukuqinisekisa ukuba umngxuma odlulayo ugcwele. I-inki yomngxuma weplagi ingasetyenziswa kunye ne-inki ye-thermosetting, kwaye iimpawu zayo kufuneka zomelele., Ukucutheka kwe-resin kuncinci, kwaye amandla okudibanisa kunye nodonga lomngxuma lulungile. Inkqubo yokuhamba yile: unyango lwangaphambili → umngxuma weplagi → ipleyiti yokusila → ugqithiso lwepateni → ukudibanisa → isigqubuthelo sobuso
Le ndlela inokuqinisekisa ukuba umngxuma weplagi womngxuma odlulayo usicaba, kwaye akusayi kubakho zingxaki zobulunga ezifana nogqabhuko-dubulo lwe-oyile kunye nokuwa kwe-oyile ekupheleni komngxuma xa ulinganisa ngomoya oshushu. Nangona kunjalo, le nkqubo idinga ukuqina kwexesha elinye lobhedu ukwenza ubukhulu bobhedu bodonga lomngxuma buhlangabezane nomgangatho womthengi. Ngoko ke, iimfuno zokubethelwa kobhedu kwiplate yonke ziphezulu kakhulu, kwaye ukusebenza komatshini wokugaya ipleyiti nako kuphezulu kakhulu, ukuqinisekisa ukuba i-resin phezu kobhedu isuswe ngokupheleleyo, kwaye ubuso bobhedu bucocekile kwaye alungcoliswanga. . Iifektri ezininzi ze-PCB azinayo inkqubo yobhedu yokutyebisa okwexesha elinye, kwaye ukusebenza kwezixhobo akuhlangabezani neemfuno, kubangele ukusetyenziswa kakhulu kwale nkqubo kwiifektri zePCB.
2.2 Emva kokuplaga umngxuma ngephepha le-aluminium, ngqo kwisikrini-printa imaski ye-solder yebhodi
Le nkqubo isebenzisa umatshini wokomba we-CNC ukukhupha iphepha le-aluminiyam ekufuneka iplagwe ukwenza isikrini, uyifake kumatshini wokushicilela wesikrini ukuze uvale umngxuma, kwaye upake ungadlulanga imizuzu engama-30 emva kokugqiba ukuplaga, kwaye sebenzisa isikrini se-36T ukukhangela ngokuthe ngqo umphezulu webhodi. Inkqubo yokuqukuqela yile: pretreatment-plug hole-silk screen-pre-baking-exposure-development-curing
Le nkqubo inokuqinisekisa ukuba umngxuma odlulayo ugqunywe kakuhle ngeoyile, umngxuma weplagi usicaba, kwaye umbala wefilimu omanzi uyahambelana. Emva kokuba umoya oshushu uhlanjululwe, unokuqinisekisa ukuba i-via hole ayifakwanga kwaye i-bead ye-tin ayifihlwa emngxunyeni, kodwa kulula ukubangela inki emngxunyeni emva kokunyanga Iipads zibangela ukuba i-solderability embi; emva kokuba umoya oshushu ulinganiswe, imida ye-vias bubbling kunye neoli iyasuswa. Kunzima ukulawula imveliso ngale ndlela yenkqubo, kwaye iinjineli zenkqubo kufuneka zisebenzise iinkqubo ezikhethekileyo kunye neeparitha zokuqinisekisa umgangatho wemingxuma yeplagi.
2.2 Emva kokuplaga umngxuma ngephepha le-aluminium, ngqo kwisikrini-printa imaski ye-solder yebhodi
Le nkqubo isebenzisa umatshini wokomba we-CNC ukukhupha iphepha le-aluminiyam ekufuneka iplagwe ukwenza isikrini, uyifake kumatshini wokushicilela wesikrini ukuze uvale umngxuma, kwaye upake ungadlulanga imizuzu engama-30 emva kokugqiba ukuplaga, kwaye sebenzisa isikrini se-36T ukukhangela ngokuthe ngqo umphezulu webhodi. Inkqubo yokuqukuqela yile: pretreatment-plug hole-silk screen-pre-baking-exposure-development-curing
Le nkqubo inokuqinisekisa ukuba umngxuma odlulayo ugqunywe kakuhle ngeoyile, umngxuma weplagi usicaba, kwaye umbala wefilimu omanzi uyahambelana. Emva kokuba umoya oshushu uhlanjululwe, unokuqinisekisa ukuba i-via hole ayifakwanga kwaye i-bead ye-tin ayifihlwanga emngxunyeni, kodwa kulula ukubangela ukuba i-inki emngxunyeni emva kokunyanga Iipads zibangela ukuba i-solder ingabikho; emva kokuba umoya oshushu ulinganiswe, imida ye-vias bubbling kunye neoli iyasuswa. Kunzima ukulawula imveliso ngale ndlela yenkqubo, kwaye iinjineli zenkqubo kufuneka zisebenzise iinkqubo ezikhethekileyo kunye neeparitha zokuqinisekisa umgangatho wemingxuma yeplagi.