1. Umgangatho womoya oshushu usetyenziswa kumphezulu we-PCB etyhidiweyo yesoda yetoti etyhidiweyo kunye nenkqubo yomgangatho womoya ofudumeleyo (ukuvuthela tyaba). Ukwenza ukuba yenze i-oxidation resistant coating inokubonelela nge-weldability elungileyo. I-solder yomoya oshushu kunye nobhedu zenza i-copper-sikkim ikhompawundi ekudibaneni, kunye nobunzima obumalunga ne-1 ukuya kwi-2mil.
2. I-Organic Solderability Preservative (OSP) ngokukhulisa i-organic coating kwi-copper engenanto ecocekileyo. Le filimu ye-PCB ye-multilayer inamandla okuxhathisa i-oxidation, ukutshitshiswa kobushushu, kunye nokufuma ukukhusela umphezulu wobhedu kwi-rust (i-oxidation okanye i-sulfurization, njl.) phantsi kweemeko eziqhelekileyo. Ngexesha elifanayo, kwiqondo lokushisa elilandelayo le-welding, i-welding flux isuswa ngokukhawuleza ngokukhawuleza.

3. Umphezulu we-Ni-au wekhemikhali wobhedu onesingqimba sombane esityebileyo, esilungileyo sokukhusela ibhodi ye-PCB ye-multilayer. Ixesha elide, ngokungafaniyo ne-OSP, esetyenziswa kuphela njengomaleko we-rustproof, ingasetyenziselwa ukusetyenziswa kwexesha elide le-PCB kwaye ufumane amandla amahle. Ukongezelela, inokunyamezela kokusingqongileyo ukuba ezinye iinkqubo zonyango ezingaphezulu azikho.

4. I-electroless silver deposit phakathi kwe-OSP kunye ne-electroless nickel / plating yegolide, inkqubo ye-PCB ye-multilayer ilula kwaye iyakhawuleza.

Ukuvezwa kwindawo ezishushu, ezifumileyo nezingcolisekileyo kusabonelela ngokusebenza kakuhle kombane kunye nokushisela okuhle, kodwa konakala. Ngenxa yokuba akukho nickel phantsi komgangatho wesilivere, isilivere encitshisiweyo ayinawo onke amandla afanelekileyo e-electroless nickel plating / ukuntywiliselwa kwegolide.

5.I-conductor kumphezulu we-PCB ibhodi ye-multilayer ifakwe ngegolide ye-nickel, kuqala kunye ne-nickel ye-nickel kunye ne-maleko yegolide. Injongo ephambili ye-nickel plating kukuthintela ukusasazwa phakathi kwegolide kunye nobhedu. Kukho iintlobo ezimbini zegolide efakwe kwi-nickel: igolide ethambileyo (igolide esulungekileyo, oku kuthetha ukuba ayibonakali iqaqambile) kunye negolide eqinile (egudileyo, eqinile, engagugi, i-cobalt kunye nezinye izinto ezibonakala ziqaqambile). Igolide ethambileyo isetyenziselwa ikakhulu ukupakishwa kwetshiphu kumgca wegolide; Igolide elukhuni isetyenziswa ikakhulu kuqhagamshelo lombane olungadityaniswanga.

6. Itekhnoloji yePCB exubeneyo yonyango lomphezulu khetha iindlela ezimbini nangaphezulu zonyango lwangaphezulu, iindlela eziqhelekileyo zezi: nickel gold anti-oxidation, nickel plating gold precipitation nickel gold, nickel plateing gold leveling air hot, nickel heavy and gold hot air leveling. Nangona utshintsho kwi-PCB inkqubo yonyango lwe-multilayer surface ayibalulekanga kwaye ibonakala ikude, kufuneka kuqatshelwe ukuba ixesha elide lokutshintsha okucothayo kuya kukhokelela kutshintsho olukhulu. Ngokunyuka kwemfuno yokhuselo lokusingqongileyo, itekhnoloji yonyango lomphezulu we-PCB ibopheleleke ukuba itshintshe kakhulu kwixesha elizayo.