Inkqubo yokuqonda yobugcisa yebhodi yekopi yePCB kukuskena nje ibhodi yesekethe ukuba ikhutshelwe, ukurekhoda indawo yecandelo elineenkcukacha, emva koko ususe amacandelo ukwenza ibhili yezixhobo (BOM) kwaye ulungiselele ukuthengwa kwezinto, ibhodi engenanto ngumfanekiso oskeniweyo. kusetyenzwe yi-software yebhodi ikopi kwaye ibuyiselwe kwifayile umzobo ibhodi pcb, kwaye ke ifayile PCB ithunyelwe kwipleyiti yokwenza umzi-mveliso ukwenza ibhodi. Emva kokuba ibhodi yenziwe, amacandelo athengiweyo athengiswa kwibhodi yePCB eyenziwe, kwaye ke ibhodi yesekethe ivavanywa Kwaye ilungiswa.
Amanyathelo athile ebhodi yokukhuphela yePCB:
Inyathelo lokuqala kukufumana PCB. Okokuqala, bhala imodeli, iiparamitha, kunye nezikhundla zazo zonke iindawo ezibalulekileyo ephepheni, ngakumbi isalathiso se-diode, ityhubhu ephakamileyo, kunye nolwalathiso lwe-IC gap. Kungcono ukusebenzisa ikhamera yedijithali ukuthatha iifoto ezimbini zendawo yamalungu abalulekileyo. Iibhodi zesekethe ze-pcb zangoku ziya phambili ngakumbi. Ezinye ze-diode transistors aziqatshelwa kwaphela.
Isinyathelo sesibini kukususa zonke iibhodi ze-multi-layer kwaye ukopishe iibhodi, kwaye ususe i-tin kwi-PAD emngxunyeni. Coca i-PCB ngotywala kwaye uyibeke kwiskena. Xa iskena siskena, kufuneka unyuse ipixels eskeniweyo kancinci ukuze ufumane umfanekiso ocacileyo. Emva koko usasaze ngokukhawuleza iileya eziphezulu kunye nezantsi kunye nephepha le-gauze lamanzi kuze kube yilapho ifilimu yethusi icwebezela, yibeke kwi-scanner, qalisa i-PHOTOSHOP, kwaye uhlolisise iileya ezimbini ngokwahlukileyo ngombala. Qaphela ukuba iPCB mayibekwe ngokuthe tye nangokuthe nkqo kwiskena, kungenjalo umfanekiso oskeniweyo awunakusetyenziswa.
Isinyathelo sesithathu kukulungelelanisa ukungafani kunye nokukhanya kwe-canvas ukwenzela ukuba inxalenye enefilimu yobhedu kunye nenxalenye ngaphandle kwefilimu yobhedu ibe nokwahlukana okunamandla, kwaye emva koko uguqule umfanekiso wesibini ube ngumnyama nomhlophe, kwaye ukhangele ukuba imigca icacile. Ukuba akunjalo, phinda eli nyathelo. Ukuba icacile, gcina umfanekiso njengefayile ye-BMP emnyama namhlophe TOP.BMP kunye ne-BOT.BMP. Ukuba ufumana naziphi na iingxaki kwimizobo, ungasebenzisa kwakhona i-PHOTOSHOP ukuyilungisa nokuzilungisa.
Isinyathelo sesine kukuguqula iifayile ezimbini zefomati ye-BMP kwiifayile zefomethi ye-PROTEL, kwaye udlulise iileya ezimbini kwi-PROTEL. Ngokomzekelo, izikhundla ze-PAD kunye ne-VIA eziye zadlula kwiindawo ezimbini zihambelana ngokusisiseko, ezibonisa ukuba amanyathelo angaphambili ayenziwe kakuhle. Ukuba kukho ukutenxa, phinda inyathelo lesithathu. Ke ngoko, ukukopa kwePCB ngumsebenzi ofuna umonde, kuba ingxaki encinci iya kuchaphazela umgangatho kunye nenqanaba lokumatanisa emva kokukopa.
Isinyathelo sesihlanu kukuguqula i-BMP yoluhlu lwe-TOP kwi-TOP.PCB, nikela ingqalelo ekuguquleni kuluhlu lwe-SILK, oluyi-yellow layer, kwaye emva koko unako ukulandelela umgca kwi-TOP layer, kwaye ubeke isixhobo ngokutsho. kumzobo kwinyathelo lesibini. Cima umaleko we-SILK emva kokuzoba. Qhubeka uphinda-phinda de kube zonke iileya zizotywa.
Isinyathelo sesithandathu kukungenisa i-TOP.PCB kunye ne-BOT.PCB kwi-PROTEL, kwaye kulungile ukudibanisa kumfanekiso omnye.
Inyathelo lesixhenxe, sebenzisa umshicileli welaser ukuprinta ULENKO OLUPHAKAMILEYO kunye ne-BOTTOM LAYER kwifilimu esobala (1:1 ratio), ubeke ifilimu kwiPCB, uze uthelekise ukuba kukho nayiphi na impazamo. Ukuba ichanekile, ugqibile. .
Ibhodi yokukopisha efana nebhodi yokuqala yazalwa, kodwa oku kwenziwa nje ngesiqingatha. Kwakhona kuyimfuneko ukuvavanya ukuba i-electronic technical performance yebhodi yekopi iyafana nebhodi yokuqala. Ukuba kuyafana, kwenziwa ngokwenene.
Qaphela: Ukuba ibhodi ye-multi-layer, kufuneka upholise ngokucophelela i-layer yangaphakathi, kwaye uphinde ulandele amanyathelo okukopisha ukusuka kwisinyathelo sesithathu ukuya kwesesihlanu. Ngokuqinisekileyo, ukubizwa kwegrafiki kwahlukile. Kuxhomekeke kwinani leeleya. Ngokubanzi, ukhuphelo olunamacala amabini lufuna Kulula kakhulu kunebhodi enamaleko amaninzi, kwaye ibhodi yekopi yamaleko amaninzi ithande ukungahambi kakuhle, ngoko ke ibhodi yokukhuphela ibhodi yebhodi kufuneka ilumke ngakumbi kwaye ilumke (apho i-vias yangaphakathi kunye nebhodi ekhutshelweyo ilungelelaniswe). non-vias bathanda iingxaki).
Indlela yebhodi yokukhuphela emacaleni amabini:
1. Skena umaleko ophezulu nangaphantsi webhodi yesekethe kwaye ugcine imifanekiso emibini ye-BMP.
2. Vula ibhodi yekopi software Quickpcb2005, cofa "Ifayile" "Vula Base Map" ukuvula umfanekiso iskeni. Sebenzisa iPAGEUP ukusondeza isikrini, ubone iphedi, cinezela PP ukubeka iphedi, bona umgca kwaye ulandele umgca we-PT...njengomzobo womntwana, uyizobe kule software, cofa "Gcina" ukuvelisa ifayile yeB2P. .
3. Cofa "Ifayile" kunye "Vula uMfanekiso weSiseko" ukuvula omnye umaleko womfanekiso wombala oskeniweyo;
4. Cofa "Ifayile" kunye "Vula" kwakhona ukuze uvule ifayile ye-B2P egcinwe ngaphambili. Sibona ibhodi esanda kukotshwa, ibekwe phezu kwalo mfanekiso-ibhodi yePCB efanayo, imingxuma ikwindawo efanayo, kodwa udibaniso lwee-wiring luhlukile. Ngoko sicinezela "Ukhetho"-"Izicwangciso zeLayer", cima umgca wezinga eliphezulu kunye nesikrini sesilika apha, ushiye kuphela i-multi-layer vias.
5. I-vias kwi-maleko ephezulu ikwindawo efanayo njenge-vias kumfanekiso ongezantsi. Ngoku siyakwazi ukulandelela imigca kumaleko asezantsi njengoko sasisenza ebuntwaneni. Cofa u-"Gcina" kwakhona-ifayile ye-B2P ngoku ineengqimba ezimbini zolwazi phezulu nasezantsi.
6. Cofa "Ifayile" kunye "Thumela ngaphandle njengeFayile yePCB", kwaye ungafumana ifayile yePCB enamaleko amabini edatha. Ungayitshintsha ibhodi okanye ukhuphe umzobo weskim okanye uwuthumele ngokuthe ngqo kumzi-mveliso we-PCB wepleyiti yokuvelisa
Indlela yokukhuphela ibhodi yemultilayer:
Enyanisweni, ibhodi yokukopa ibhodi enemigangatho emine kukukhuphela iibhodi ezimbini ezinamacala amabini ngokuphindaphindiweyo, kwaye umaleko wesithandathu kukukhuphela ngokuphindaphindiweyo iibhodi ezintathu ezinamacala amabini ... iingcingo zangaphakathi. Siwubona njani umaleko wangaphakathi webhodi echanekileyo yolwaya oluninzi? -Ulwahlulo.
Zininzi iindlela zokubeka, ezifana ne-potion corrosion, ukuchithwa kwesixhobo, njl., kodwa kulula ukwahlula iileya kunye nokulahlekelwa idatha. Amava asixelela ukuba isanti yeyona ichanekileyo.
Xa sigqiba ukukopa iileya eziphezulu kunye nezantsi ze-PCB, ngokuqhelekileyo sisebenzisa i-sandpaper ukugulisa umaleko ongaphezulu ukubonisa umaleko wangaphakathi; I-sandpaper yi-sandpaper eqhelekileyo ethengiswa kwiivenkile ze-hardware, ngokuqhelekileyo i-PCB ecaba, kwaye emva koko ubambe i-sandpaper kwaye uyihlikihle ngokulinganayo kwi-PCB (Ukuba ibhodi incinci, unako ukubeka i-sandpaper flat, cinezela i-PCB ngomnwe omnye kwaye uhlikihle kwi-sandpaper. ). Eyona nto iphambili kukuyigalela ibe mcaba ukuze ikwazi ukungqutywa ngokulinganayo.
Isikrini sesilika kunye neoli eluhlaza zicinywa ngokubanzi, kwaye ucingo lobhedu kunye nesikhumba sobhedu kufuneka sosulwe amaxesha ambalwa. Ngokuqhelekileyo, ibhodi yeBluetooth inokusulwa kwimizuzu embalwa, kwaye imemori yememori iya kuthatha malunga nemizuzu elishumi; kunjalo, ukuba unamandla amaninzi, kuya kuthatha ixesha elincinci; ukuba unamandla amancinci, kuya kuthatha ixesha elide.
Ibhodi yokusila okwangoku sesona sisombululo sixhaphakileyo sisetyenziselwa ukwaleka, kwaye sesona sinoqoqosho kakhulu. Singafumana iPCB elahliweyo kwaye siyizame. Enyanisweni, ukugaya ibhodi akunzima ngokobuchwepheshe. Iyadika nje kancinci. Kuthatha umgudu omncinci kwaye akukho mfuneko yokukhathazeka malunga nokugaya ibhodi kwiminwe.
PCB isiphumo umzobo wophononongo
Ngexesha lenkqubo yoyilo lwe-PCB, emva kokugqitywa koyilo lwesistim, umzobo we-PCB kufuneka uqwalaselwe kwakhona ukuze kubonwe ukuba ubume benkqubo bunengqiqo nokuba isiphumo esisiso sinokufezekiswa. Idla ngokuphandwa kule miba ilandelayo:
1. Ingaba i-system layout iqinisekisa i-wiring efanelekileyo okanye efanelekileyo, ingaba i-wiring inokwenziwa ngokuthembekileyo, kunye nokuba ukuthembeka komsebenzi wesekethe kunokuqinisekiswa. Kwi-layout, kuyimfuneko ukuba ube nokuqonda ngokubanzi kunye nokucwangciswa kwesalathiso somqondiso kunye namandla kunye nenethiwekhi yocingo lomhlaba.
2. Ingaba ubungakanani bebhodi eprintiweyo buhambelana nobukhulu bomzobo wokucubungula, ingaba inokuhlangabezana neemfuno zenkqubo yokuvelisa i-PCB, nokuba kukho uphawu lokuziphatha. Le ngongoma ifuna ingqalelo ekhethekileyo. Uyilo lwesekethe kunye neengcingo zeebhodi ezininzi zePCB ziyilwe kakuhle kakhulu kwaye ngokufanelekileyo, kodwa indawo echanekileyo yokubekwa kwesidibanisi sokumisa ayihoywa, okukhokelela kuyilo lwesekethe ayinakubanjwa kunye nezinye iisekethe.
3. Ingaba iikhomponenti ziyangqubana kwisithuba esine-dimensional ne-three-dimensional. Nika ingqalelo kubukhulu bokwenene besixhobo, ngakumbi ubude besixhobo. Xa amacandelo e-welding ngaphandle koyilo, ukuphakama akufanele kudlule ngokubanzi kwi-3mm.
4. Ingaba ukwakheka kwamacandelo kuxinene kwaye kucwangciswe kakuhle, kucwangciswe kakuhle, nokuba zonke zibekwe phandle. Kuyilo lwamacandelo, hayi kuphela isalathiso somqondiso, uhlobo lomqondiso, kunye neendawo ezifuna ingqwalasela okanye ukhuseleko kufuneka ziqwalaselwe, kodwa ukuxinana ngokubanzi koyilo lwesixhobo kufuneka kuqwalaselwe ukufikelela ukuxinana okufanayo.
5. Ingaba iikhomponenti ezifuna ukutshintshwa rhoqo zinokuthi zitshintshwe lula, kwaye ingaba ibhodi yokufaka iplagi inokufakwa ngokulula kwisixhobo. Ukulungeleka kunye nokuthembeka kokutshintshwa kunye nokudibanisa kwamacandelo ahlala etshintshwa rhoqo kufuneka kuqinisekiswe.