(1) Umgca
Ngokubanzi, ububanzi bomgca wesignali yi-0.3mm (12mil), ububanzi bomgca wamandla ngu-0.77mm (30mil) okanye 1.27mm (50mil); umgama phakathi komgca kunye nomgca kunye nephedi inkulu okanye ilingana ne-0.33mm (13mil) ). Kwizicelo ezibonakalayo, ukwandisa umgama xa iimeko zivuma;
Xa ubuninzi be-wiring buphezulu, imigca emibini inokuqwalaselwa (kodwa ayikhuthazwa) ukusebenzisa izikhonkwane ze-IC. Ububanzi bomgca yi-0.254mm (10mil), kwaye isithuba somgca singekho ngaphantsi kwe-0.254mm (10mil). Ngaphantsi kweemeko ezikhethekileyo, xa izikhonkwane zesixhobo zixinene kwaye ububanzi buncinci, ububanzi bomgca kunye nesithuba somgca sinokuncitshiswa ngokufanelekileyo.
(2) Iphedi (PAD)
Iimfuno ezisisiseko zeepads (PAD) kunye nemingxuma yenguqu (VIA) yile: ububanzi bediski bukhulu kunobubanzi bomngxuma ngo-0.6mm; umzekelo, i-resistors ye-pin-purpose-purpose, i-capacitors, kunye neesekethe ezidibeneyo, njl., sebenzisa i-disk / ubungakanani bomgodi we-1.6mm / 0.8 mm (63mil / 32mil), i-sockets, izikhonkwane kunye ne-diode 1N4007, njl., Yamkela i-1.8mm / 1.0mm (71mil/39mil). Kwizicelo ezizizo, kufuneka zimiselwe ngokobungakanani beyona nxalenye yokwenene. Ukuba iimeko zivuma, ubungakanani bepadi bunokwandiswa ngokufanelekileyo;
Indawo yokungena eyilwe kwi-PCB kufuneka ibe malunga ne-0.2～0.4mm (8-16mil) ibe nkulu kunobona bukhulu bepini yecandelo.
(3) Nge-(VIA)
Ngokubanzi 1.27mm/0.7mm (50mil/28mil);
Xa uxinaniso lwee-wiring luphezulu, ubungakanani obudlulayo bunokuncitshiswa ngokufanelekileyo, kodwa akufuneki bube buncinci kakhulu. Cinga ukusebenzisa i-1.0mm/0.6mm (40mil/24mil).

(4) Iimfuno zepitch yeepads, imigca, kunye ne-vias
I-PAD kunye ne-VIA: ≥ 0.3mm (12mil)
I-PAD kunye ne-PAD: ≥ 0.3mm (12mil)
I-PAD kunye ne-TRACK: ≥ 0.3mm (12mil)
TRACK kunye TRACK: ≥ 0.3mm (12mil)
Kuxinaniso oluphezulu:
I-PAD kunye ne-VIA: ≥ 0.254mm (10mil)
I-PAD kunye ne-PAD: ≥ 0.254mm (10mil)
I-PAD kunye ne-TRACK: ≥ 0.254mm (10mil)
TRACK kunye TRACK: ≥ 0.254mm (10mil)