I-cografition nge-elektroplating kwimingxunya okanye kwimingxunya kumda wePCB. Sika umda weBhodi ukuze wenze uthotho lwemingxunya yesiqingatha. Le mingxunya yemingxunya yile nto siyibiza ngokuba yi-Stamp Hids.

I-1. Ukungalunganga kwimingxunya ye-Stampp

①: Emva kokuba iBhodi yahlulwe, inemilo-efanayo. Abanye abantu bayibiza ngokuba yimo yenja. Kulula ukungena kwiqokobhe kwaye ngamanye amaxesha kufuneka inqunyulwe ngesikere. Ke ngoko, kwinkqubo yoyilo, indawo kufuneka igcinwe, kwaye iBhodi incitshisiwe ngokubanzi.

②: Yonyusa iindleko. Elona qhina lisezantsi leStamp ngu-1.0mm Hole, emva koko ubungakanani be-1mm ubalwe kwiBhodi.

2. Indima yemingxunya yesitampu eqhelekileyo

Ngokubanzi, i-PCB i-V-Sike. Ukuba udibana neBhodi ekhethekileyo okanye ejikelezileyo, kunokwenzeka ukuba usebenzise umngxunya wesitampu. IBhodi kunye nebhodi (okanye ibhodi engenanto) zidityaniswe ngemingxunya ye-Stampp, edlala indima yokuxhasa, kwaye iBhodi ayizukusasazeka. Ukuba ukubumba kuvuliwe, ubumba abuyi kuwa. . Eyona nto ixhaphakileyo, isetyenziselwa ukwenza iimodyuli zodwa ze-PCB, ezinje nge-Wi-Fi, iBluetooth, okanye iimodyuli zeBluetooth, ezisetyenziswa njengezinye zeBhodi ukuba zifakwe kwenye iBhodi yeNdibano yePCB.

I-3. Ukuhamba ngokubanzi kwemingxunya ye-Stampp

I-0.55mm ~ ~ 3.0mm (kuxhomekeke kwimeko, isetyenziswa i-1.0mm, 1.27mm)

Zeziphi iintlobo eziphambili zemingxunya yesitampu?

1. Isiqingatha somngxunya

1. Umngxunya omncinci onesiqingatha HOH

1. Imingxunya ejonge emphethweni weBhodi

I-4. Iimfuno zeHisp Hole

Kuxhomekeka kwiimfuno nokuphela kweBhodi, kukho ezinye iimpawu zoyilo ekufuneka zifezekisiwe. Umz:

①ize: Kucetyiswa ukusebenzisa ubukhulu obukhulu.

Unyango lwe-②surface: luxhomekeke ekuphelisweni kweBhodi, kodwa kuyacetyiswa i-enig.

I-Olli Pad uyilo: Kucetyiswa ukusebenzisa elona phepha likhulu le-Ol ephezulu nangaphantsi.

Inani lemingxunya: ixhomekeke kuyilo; Nangona kunjalo, kuyaziwa ukuba elincinci inani lemingxunya, kokukhona ubunzima bendibano yePCB.

I-rate-holes enesiqingatha ifumaneka kwimigangatho yemigangatho kunye ne-PCB ephambili. Ngoyilo olusemgangathweni we-PCB, ubuncinci bendawo yomngxunya we-C-omile yi-1.2 mm. Ukuba ufuna imingxunya emincinci emincinci ye-c, ubuncinci phakathi kwemingxunya emibini enesiqingatha se-0.55 mm.

Inkqubo yeNdawo yokuHamba yeStamp:

Okokuqala, yenza konke okubekwe ngomngxunya njengesiqhelo kumphetho weBhodi. Emva koko sebenzisa isixhobo sokugaya ukusika umngxunya kwisiqingatha kunye nobhedu. Kuba ubhedu kunzima kakhulu ukugaya kwaye kunokubangela ukuba idrill iphule, sebenzisa i-gesing yomsebenzi onzima kwizantya eziphezulu. Oku kuphumela kumphezulu oshukumayo. Isiqingatha secala ngalinye sihlolwe kwisikhululo esinikezelweyo kwaye sinyamekele ukuba kukho imfuneko. Oku kuyakwenza umngxunya wesitampu esisifunayo.