Ukucwenga kwePCB kuneendlela ezininzi

Kukho iindlela ezine eziphambili ze-electroplating kwiibhodi zesekethe: i-electroplating yomgca weminwe, i-electroplating ye-hole, i-reel-linked selective plating, kunye ne-brush plating.

 

 

 

Nantsi intshayelelo emfutshane:

01
Ukufakwa kumqolo weminwe
Iintsimbi ezinqabileyo kufuneka zifakwe kwibhodi yebhodi izihlanganisi, ibhodi edge edge abafowunelwa ophumayo okanye iminwe yegolide ukubonelela ukuchasana okuphantsi kunye nokumelana nokunxiba okuphezulu. Le teknoloji ibizwa ngokuba yi-electroplating yeminwe okanye inxalenye ephumayo ye-electroplating. Igolide idla ngokutyatyekwa kuqhagamshelo oluphumayo lwebhodi yesidibanisi somphetho kunye nomaleko wangaphakathi we-nickel. Iminwe yegolide okanye iindawo eziphumayo zomphetho webhodi zifakwe ngesandla okanye ngokuzenzekelayo. Okwangoku, ukufakwa kwegolide kwiplagi yoqhagamshelo okanye umnwe wegolide uqatywe okanye ukhokelwe. , Endaweni yamaqhosha acwengisiweyo.

Inkqubo ye-electroplating yomqolo weminwe imi ngolu hlobo lulandelayo:

Ukuhlubula i-coat yokususa i-tin okanye i-tin-lead i-lead kwimibhobho ephumayo
Pula ngamanzi okuhlamba
Khuhla nge-abrasive
Ukusebenza kuxutywe kwi-10% ye-asidi ye-sulfuric
Ubunzima be-nickel plating kuqhagamshelwano oluphumayo luyi-4-5μm
Coca kwaye ukhuphe amanzi emanzini
Unyango lwesisombululo sokungena kwegolide
Ndiphilisiwe
Ukucoca
ukomisa

02
Ngokufakwa komngxuma
Kukho iindlela ezininzi zokwakha umaleko we-electroplating layer kudonga lomngxuma we-substrate egrunjwe umngxuma. Oku kubizwa ngokuba kusebenze udonga lomngxuma kwizicelo zamashishini. Inkqubo yokuvelisa intengiso yesekethe yayo eprintiweyo idinga iitanki ezininzi zokugcina eziphakathi. Itanki ineemfuno zayo zokulawula kunye nokugcinwa. Ngokufakwa kwemingxuma yinkqubo eyimfuneko yokulandelela inkqubo yokomba. Xa intwana yokomba igqobhoza ifoyile yobhedu kunye nesubstrate engaphantsi, ubushushu obuveliswayo bunyibilikisa iresin ekhuselayo eyenziweyo eyenza uninzi lwe substrate matrix, intlaka etyhidiweyo kunye nobunye ubugoxo bokomba Iqokelelwa malunga nomngxuma kwaye igqunywe kumngxunya osandula ukuvezwa. udonga kwifoyile yobhedu. Enyanisweni, oku kuyingozi kwi-electroplating surface elandelayo. I-resin etyhidiweyo iya kushiya umaleko we-shaft eshushu kudonga lomngxuma we-substrate, ebonisa ukubambelela kakubi kwii-activators ezininzi. Oku kufuna uphuhliso lweklasi efanayo de-staining kunye etch-back ubugcisa imichiza.

Indlela efanelekileyo ngakumbi yeprototyping yeebhodi zesekethe eziprintiweyo kukusebenzisa i-inki eyilwe ngokukodwa ene-viscosity ephantsi ukwenza ifilimu encamathelayo kakhulu kunye ne-conductive ephezulu kudonga lwangaphakathi lomngxuma ngamnye. Ngale ndlela, akukho mfuneko yokusebenzisa iinkqubo ezininzi zonyango lweekhemikhali, inyathelo elilodwa kuphela lesicelo kunye nokunyanga kwe-thermal elandelayo kunokwenza ifilimu eqhubekayo ngaphakathi kuzo zonke iindonga zomngxuma, ezinokuthi zifakwe ngokuthe ngqo kwi-electroplated ngaphandle konyango olongezelelweyo. Le inki yinto esekelwe kwi-resin ene-adhesion eyomeleleyo kwaye inokubambelela ngokulula kwiindonga zemingxuma eninzi epholileyo, ngaloo ndlela isusa inyathelo le-etch back.

03
Uhlobo lonxibelelwano lweReel olukhethiweyo lweplating
Izikhonkwane kunye nezikhonkwane zezixhobo ze-elektroniki, ezifana nezihlanganisi, iisekethe ezidibeneyo, ii-transistors kunye neesekethe eziprintiweyo eziguquguqukayo, sebenzisa i-plating ekhethiweyo yokufumana ukuchasana okulungileyo kunye nokuxhathisa ukubola. Le ndlela ye-electroplating ingaba yincwadana okanye ngokuzenzekelayo. Kubiza kakhulu ukukhetha ipleyiti nganye ngokuzimeleyo, ngoko ke kufuneka kusetyenziswe i-batch welding. Ngokuqhelekileyo, iziphelo ezibini zefoyile yesinyithi eqengqelekayo ukuya kubunzima obufunekayo zibethelwa, zicocwe ngeendlela zeekhemikhali okanye ngoomatshini, emva koko zisetyenziswe ngokukhethiweyo njenge-nickel, igolide, isilivere, irhodium, iqhosha okanye i-tin-nickel alloy, ialloy yobhedu-nickel. , i-alloy ye-nickel-lead, njl. ukwenzela i-electroplating eqhubekayo. Kwindlela ye-electroplating ye-plating ekhethiweyo, okokuqala gcoba umaleko wefilimu yokumelana necala lebhodi yensimbi yobhedu engadingeki ukuba i-electroplated, kunye ne-electroplating kuphela kwindawo ekhethiweyo yobhedu.

04
Ukufakwa kwebrashi
"I-Brush plating" yindlela yokwenza i-electrodeposition, apho ingekho zonke iindawo ezifakwe kwi-electrolyte. Kolu hlobo lwetekhnoloji ye-electroplating, yindawo elinganiselweyo kuphela i-electroplated, kwaye akukho siphumo kwezinye. Ngokuqhelekileyo, iintsimbi ezinqabileyo zifakwe kwiindawo ezikhethiweyo zebhodi yesekethe eprintiweyo, njengeendawo ezifana nezixhumi zomphetho webhodi. I-brush plating isetyenziswa ngakumbi xa kulungiswa iibhodi zesiphaluka ezilahliweyo kwiivenkile zendibano ze-elektroniki. Gquba i-anode ekhethekileyo (i-anode engasebenziyo yeekhemikhali, njengegraphite) kwizinto ezithathayo (cotton swab), kwaye uyisebenzise ukuzisa isisombululo se-electroplating kwindawo apho kufuneka khona i-electroplating.

 

5. Ukufakwa kweengcingo ngesandla kunye nokulungiswa kweempawu eziphambili

Ukufakwa kweentambo ngesandla yinkqubo ebalulekileyo yoyilo lwebhodi yesekethe eprintiweyo ngoku nakwixesha elizayo. Ukusebenzisa i-wiring ye-manual kunceda izixhobo zocingo ezizenzekelayo ukugqiba umsebenzi wocingo. Ngokwenza umzila ngesandla kunye nokulungisa inethiwekhi ekhethiweyo (umnatha), indlela enokuthi isetyenziswe kumzila ozenzekelayo inokwenziwa.

Iimpawu eziphambili zifakwe kuqala, mhlawumbi ngesandla okanye zidibaniswe nezixhobo zocingo ezizenzekelayo. Emva kokuba i-wiring igqityiwe, ubunjineli obufanelekileyo kunye nabasebenzi bezobugcisa baya kujonga i-wiring yesignali. Emva kokuba ukuhlolwa kudluliselwe, iingcingo ziya kulungiswa, kwaye ke iimpawu eziseleyo ziya kufakwa ngokuzenzekelayo. Ngenxa yobukho be-impedance kwintambo yomhlaba, iya kuzisa ukuphazamiseka okuqhelekileyo kwe-impedance kwisekethe.

Ngoko ke, musa ukudibanisa ngokungenamkhethe naziphi na iisimboli zokumisa ngexesha le-wiring, enokuvelisa ukudibanisa okuyingozi kunye nokuchaphazela ukusebenza kwesekethe. Kwii-frequencies eziphezulu, i-inductance yocingo iya kuba yimiyalelo emininzi yobukhulu kunokumelana nocingo ngokwalo. Ngeli xesha, nokuba umbane omncinci we-high-frequency wangoku uhamba ngocingo, ukuhla kwe-voltage ephezulu kuya kwenzeka.

Ngoko ke, kwiisekethe eziphezulu ze-frequency, i-layout ye-PCB kufuneka icwangciswe ngokucokisekileyo kangangoko kwaye iingcingo eziprintiweyo mazibe mfutshane kangangoko. Kukho i-inductance kunye ne-capacitance phakathi kweengcingo eziprintiweyo. Xa i-frequency yokusebenza inkulu, iya kubangela ukuphazamiseka kwamanye amalungu, okubizwa ngokuba yi-parasitic coupling interference.

Iindlela zokunciphisa ezinokuthi zithathwe:
① Zama ukwenza mfutshane iingcingo zomqondiso phakathi kwawo onke amanqanaba;
②Lungisa onke amanqanaba eesekethe ngolandelelwano lwemiqondiso ukuphepha ukuwela kwinqanaba ngalinye lemigca yomqondiso;
③Iingcingo zeepaneli ezimbini ezimeleneyo kufuneka zibe perpendicular okanye zinqumle, zingahambelani;
④ Xa iingcingo zomqondiso kufuneka zibekwe ngokunxuseneyo ebhodini, ezi ngcingo kufuneka zohlulwe ngomgama othile kangangoko kunokwenzeka, okanye zahlulwe ngeengcingo zomhlaba kunye neengcingo zamandla ukuphumeza injongo yokukhusela.
6. Iingcingo ezizenzekelayo

Kwi-wiring yeempawu eziphambili, kufuneka ucinge ngokulawula ezinye iiparameters zombane ngexesha locingo, njengokunciphisa i-inductance esasazwayo, njl njl. Emva kokuqonda ukuba zeziphi iiparitha zokufakelwa kwesixhobo socingo oluzenzekelayo kunye nempembelelo yeeparitha zokufaka kwi-wiring, umgangatho we-wiring. i-wiring ezenzekelayo inokufumaneka kwinqanaba elithile Isiqinisekiso. Imithetho jikelele kufuneka isetyenziswe xa imiqondiso yomzila ngokuzenzekelayo.

Ngokumisela iimeko zothintelo kunye nokuthintela iindawo zocingo ukukhawulela iileyile ezisetyenziswa ngumqondiso onikiweyo kunye nenani le-vias esetyenzisiweyo, isixhobo socingo sinokuhambisa ngokuzenzekelayo iingcingo ngokweengcamango zoyilo lwenjineli. Emva kokumisela izithintelo kunye nokusebenzisa imigaqo eyenziwe, umzila ozenzekelayo uya kufezekisa iziphumo ezifana neziphumo ezilindelekileyo. Emva kokuba inxalenye yoyilo igqityiwe, iya kulungiswa ukuze ithintele ukuba ingachatshazelwa yinkqubo elandelayo yomzila.

Inani le-wiring lixhomekeke kubunzima besekethe kunye nenani lemithetho jikelele echazwe. Izixhobo zocingo ezizenzekelayo zanamhlanje zinamandla kakhulu kwaye zinokugqiba i-100% yocingo. Nangona kunjalo, xa isixhobo se-wiring esizenzekelayo singagqibanga yonke i-wiring yesignali, kuyimfuneko ukuhambisa ngesandla iimpawu eziseleyo.
7. Ukulungiswa kweengcingo

Kweminye imiqondiso enemiqobo embalwa, ubude bocingo bude kakhulu. Ngeli xesha, unokuqala ukugqiba ukuba yeyiphi i-wiring efanelekileyo kwaye yeyiphi i-wiring engafanelekanga, kwaye emva koko uhlele ngesandla ukuze unciphise ubude bocingo lwesignali kunye nokunciphisa inani le-vias.