Isizathu sokutyabeka, kubonisa ukuba ifilimu eyomileyo kunye ne-copper foil plate bonding ayinamandla, ukuze isisombululo se-plating nzulu, esibangele "isigaba esibi" senxalenye yokwaleka, uninzi lwabavelisi be-PCB lubangelwa zezi zizathu zilandelayo. :
1. Amandla otyhileko oluphezulu okanye oluphantsi
Ngaphantsi kokukhanya kwe-ultraviolet, i-photoinitiator, efunxa amandla okukhanya, ihlahlela ibe yi-radicals yamahhala ukuqalisa i-photopolymerization yee-monomers, zenza iimolekyuli zomzimba ezinganyibilikiyo kwisisombululo se-alkali.
Ngaphantsi kwe-exposure, ngenxa ye-polymerization engaphelelanga, ngexesha lenkqubo yophuhliso, ukudumba kwefilimu kunye nokuthamba, okubangelwa imigca engacacanga kunye ne-film layer off, okubangela ukudibanisa kakubi ifilimu kunye nobhedu;
Ukuba ukuvezwa kuninzi kakhulu, kuya kubangela ubunzima bophuhliso, kodwa nakwinkqubo ye-electroplating iya kuvelisa i-warped peel, ukubunjwa kwe-plating.
Ngoko ke kubalulekile ukulawula amandla okuvezwa.
2. Uxinzelelo lwefilimu ephezulu okanye ephantsi
Xa uxinzelelo lwefilimu luphantsi kakhulu, umphezulu wefilimu unokungalingani okanye isithuba phakathi kwefilimu eyomileyo kunye neplate yethusi ayinakuhlangabezana neemfuno zamandla okubopha;
Ukuba uxinzelelo lwefilimu luphezulu kakhulu, i-solvent kunye nezixhobo eziguquguqukayo zomaleko wokumelana nomhlwa ziguquguquka kakhulu, okukhokelela ekubeni ifilimu eyomileyo ibe brittle, ukothuka kwe-electroplating kuya kuba kukuxobuka.
3. Ukushisa kwefilimu ephezulu okanye ephantsi
Ukuba ubushushu befilimu buphantsi kakhulu, ngenxa yokuba ifilimu yokuxhathisa i-corrosion ayikwazi ukuthamba ngokupheleleyo kunye nokuhamba okufanelekileyo, okubangela ukuba ifilimu eyomileyo kunye ne-copper-clad laminate surface adhesion ihlwempuzekile;
Ukuba iqondo lobushushu liphezulu kakhulu ngenxa yokuphuma komphunga ngokukhawuleza kwe-solvent kunye nezinye izinto eziguquguqukayo kwiqamza lokumelana nomhlwa, kunye nefilimu eyomileyo iba brittle, kwi-electroplating shock formation of warping peel, ekhokelela kwi-percolation.