I-PCB (iBhodi yeSekethe eShicileleyo), igama lesiTshayina libizwa ngokuba yibhodi yesekethe eprintiweyo, eyaziwa ngokuba yibhodi yesekethe eprintiweyo, licandelo elibalulekileyo le-elektroniki, liqumrhu elixhasayo lamacandelo e-elektroniki. Ngenxa yokuba iveliswa ngokuprintwa kwe-elektroniki, ibizwa ngokuba yibhodi yesekethe "eprintiweyo".
Ngaphambi kwe-PCBS, iisekethe zenziwe nge-point-to-point wiring. Ukuthembeka kwale ndlela kuphantsi kakhulu, kuba njengeminyaka yesiphaluka, ukuphuka komgca kuya kubangela ukuba i-node yomgca iphule okanye ifutshane. Itekhnoloji yokujija ngocingo yinkqubela phambili enkulu kwitekhnoloji yesekethe, ephucula ukuqina kunye nesakhono esinokuthathelwa indawo somgca ngokujija ucingo oluncinci olujikeleze ipali kwindawo yoqhagamshelo.
Njengoko imveliso ye-elektroniki yavela kwiityhubhu zokufunxa kunye nokuhanjiswa kwee-silicon semiconductors kunye neesekethe ezidityanisiweyo, ubungakanani kunye nexabiso lezinto ze-elektroniki nazo ziye zehla. Iimveliso ze-elektroniki ziya zivela ngokwandayo kwicandelo labathengi, nto leyo ebangela ukuba abavelisi bajonge izisombululo ezincinci nezingabizi kakhulu. Ngaloo ndlela, iPCB yazalwa.
Inkqubo yokwenziwa kwePCB
Imveliso yePCB inzima kakhulu, ithatha ibhodi eprintiweyo emine njengomzekelo, inkqubo yayo yokuvelisa ibandakanya ubukhulu becala ukwakheka kwe-PCB, imveliso yebhodi engundoqo, ukugqithiselwa kobeko lwePCB yangaphakathi, ukugrumba ibhodi engundoqo kunye nokuhlolwa, ukulatyuzwa, ukugrumba, ukugalelwa komngxuma kwimichiza yobhedu. , ukudluliselwa kobeko lwe-PCB yangaphandle, ukufakwa kwe-PCB yangaphandle kunye namanye amanyathelo.
1, uyilo lwePCB
Inyathelo lokuqala kwimveliso yePCB kukulungelelanisa kwaye ujonge uYilo lwePCB. Ifektri yokuvelisa i-PCB ifumana iifayile ze-CAD kwinkampani yokuyila i-PCB, kwaye ekubeni isofthiwe nganye ye-CAD inefayile yayo ekhethekileyo, i-PCB factory iguqulela kwifomathi edibeneyo - i-Gerber RS-274X eyandisiweyo okanye i-Gerber X2. Emva koko injineli yomzi-mveliso iya kukhangela ukuba i-PCB ihambelana nenkqubo yokuvelisa kunye nokuba kukho naziphi na iziphene kunye nezinye iingxaki.
2, imveliso yepleyiti engundoqo
Coca ipleyiti yobhedu, ukuba kukho uthuli, kunokukhokelela kwisiphaluka esifutshane sokugqibela okanye ikhefu.
I-PCB ene-8-layer: yenziwe nge-3 yeepleyiti ezinobhedu (iipleyiti eziphambili) kunye neefilimu ezi-2 zobhedu, kwaye emva koko ziboshwe ngamashiti ane-semi-cured. Ulandelelwano lwemveliso luqala kwipleyiti engundoqo ephakathi (i-4 okanye i-5 yemigca yemigca), kwaye ihlala ihlanganiswe kunye kwaye igxininiswe. Ukuveliswa kwe-PCB ye-4-layer iyafana, kodwa isebenzisa kuphela ibhodi engundoqo ye-1 kunye neefilimu ze-2 zethusi.
3, ukudluliselwa kobeko lwePCB yangaphakathi
Okokuqala, iileyile ezimbini zebhodi yeCore ephakathi (Core) zenziwe. Emva kokucoca, i-copper-clad plate ihlanganiswe nefilimu ye-photosensitive. Ifilimu iqina xa ibonakaliswe ekukhanyeni, yenza ifilimu ekhuselayo phezu kwe-copper foil ye-copper-clad plate.
Ifilim yoyilo lwePCB enamaleko amabini kunye nepleyiti yobhedu enemaleko-mbini ekugqibeleni ifakelwe kumaleko aphezulu wefilimu yoyilo yePCB ukuqinisekisa ukuba umaleko ongaphezulu nangaphantsi wefilimu yoyilo yePCB zipakishwe ngokuchanekileyo.
Isivanzi sirhabulisa ifilimu ebuthathaka kwifoyile yobhedu ngesibane se-UV. Ngaphantsi kwefilimu ebonakalayo, ifilimu ebuthathaka iyaphiliswa, kwaye phantsi kwefilimu engabonakaliyo, akukabikho ifilimu ephilileyo ephilileyo. Ifoyile yobhedu egqunywe phantsi kwefilim enyangiweyo yefotosensitive ngumgca woyilo wePCB ofunekayo, olingana nendima ye-inki yoshicilelo lwelaser yePCB yesandla.
Emva koko ifilimu ye-photosensitive enganyangekiyo ihlanjululwe nge-lye, kwaye umgca we-foil we-copper ofunekayo uya kugqunywa yifilimu ye-photosensitive ephilileyo.
I-foil yobhedu engafunwayo emva koko ifakwe kunye ne-alkali enamandla, njenge-NaOH.
Hlubula ifilimu enyangisiweyo yefotosensitive ukubonisa ifoyile yobhedu efunekayo kwimigca yoyilo yePCB.
I-4, i-core plate drilling kunye nokuhlolwa
I-core plate yenziwe ngempumelelo. Emva koko gqobhoza umngxuma ohambelanayo kwipleyiti engundoqo ukuququzelela ulungelelwaniso nezinye izinto ezikrwada ngokulandelayo
Nje ukuba ibhodi engundoqo icinezelwe kunye nezinye iileya zePCB, ayinakuguqulwa, ngoko ke ukuhlolwa kubaluleke kakhulu. Umatshini uya kuthelekisa ngokuzenzekelayo nemizobo yoyilo lwePCB ukujonga iimpazamo.
5. Laminate
Apha into entsha ekrwada ebizwa ngokuba semi-curing sheet iyafuneka, nto leyo encamathelayo phakathi kwebhodi engundoqo kunye nebhodi engundoqo (inombolo yePCB umaleko> 4), kunye nebhodi engundoqo kunye nefoyile yobhedu yangaphandle, kwaye ikwadlala indima. yokugquma.
Ifoyile yobhedu esezantsi kunye nemigangatho emibini yephepha enyangekileyo sele ilungisiwe ngomngxunya wolungelelwaniso kunye nepleyiti yentsimbi esezantsi kwangaphambili, kwaye ipleyiti engundoqo eyenziweyo nayo ibekwe kumngxunya wolungelelwaniso, kwaye ekugqibeleni izaleko ezimbini ze-semi-curred. Iphepha, umaleko wefoyile yobhedu kunye nomaleko wepleyiti yealuminiyam ecinezelekileyo zigqunywe kwipleyiti engundoqo ngokulandelelanayo.
Iibhodi ze-PCB ezinyanzeliswa ngamacwecwe entsimbi zibekwe kwisibiyeli, emva koko zithunyelwe kwi-vacuum hot press for lamination. Ukushisa okuphezulu kwe-vacuum eshushu yokucoca inyibilika i-epoxy resin kwiphepha le-semi-cured, ibambe iiplate eziphambili kunye ne-foil yobhedu kunye phantsi koxinzelelo.
Emva kokuba i-lamination igqityiwe, susa ipleyiti yentsimbi ephezulu ucinezela iPCB. Emva koko ipleyiti ye-aluminiyam enoxinzelelo iyathathwa, kwaye ipleyiti ye-aluminiyam nayo idlala uxanduva lokuhlukanisa i-PCBS eyahlukeneyo kunye nokuqinisekisa ukuba i-foil yobhedu kwi-PCB yangaphandle igudile. Ngeli xesha, omabini amacala ePCB akhutshiweyo aya kugqunywa ngumaleko wefoyile yobhedu egudileyo.
6. Ukugrumba
Ukudibanisa iileya ezine zefoyile yobhedu engadibaniyo kwi-PCB kunye, qala ngokugrumba i-perforation phezulu nasezantsi ukuvula i-PCB, kwaye emva koko i-metalize udonga lomngxuma ukuqhuba umbane.
Umatshini wokomba weX-reyi usetyenziselwa ukukhangela ibhodi engundoqo yangaphakathi, kwaye umatshini uya kufumana ngokuzenzekelayo kwaye awufumane umngxuma kwibhodi engundoqo, uze ugqobhoze umngxuma wokumisa kwi-PCB ukuqinisekisa ukuba ukomba olulandelayo ludlula embindini webhodi. umngxuma.
Beka umaleko wephepha le-aluminium kumatshini wepunch kwaye ubeke iPCB kuwo. Ukuze kuphuculwe ukusebenza kakuhle, iibhodi zePCB ezi-1 ukuya kwezi-3 ezifanayo ziya kupakishwa ndawonye ukuze kugqobhozwe ngokwenani leeleya zePCB. Okokugqibela, umaleko wepleyiti ye-aluminiyam igqunyelelwe kwi-PCB ephezulu, kwaye umaleko ongaphezulu nophantsi wepleyiti ye-aluminiyam ukwenzela ukuba xa i-drill bit igrunjwa kwaye iphuma, i-foil yobhedu kwi-PCB ayiyi kukrazula.
Kwinkqubo yangaphambili ye-lamination, i-epoxy resin enyibilikisiweyo yacudiswa ngaphandle kwe-PCB, ngoko kwakufuneka isuswe. Umatshini wokusila weprofayile usika iperiphery yePCB ngokweendlela ezichanekileyo zeXY.
7. Imvula yeekhemikhali zobhedu kwindonga yepore
Ekubeni phantse zonke iiplani zePCB zisebenzisa i-perforations ukudibanisa iileya ezahlukeneyo zocingo, uxhulumaniso olulungileyo lufuna ifilimu yobhedu engama-25 micron eludongeni lomngxuma. Olu ngqingqwa lwefilimu yobhedu lufuna ukufezekiswa nge-electroplating, kodwa udonga lomngxuma luqulunqwe yi-resin epoxy engaqhubekiyo kunye nebhodi ye-fiberglass.
Ngoko ke, inyathelo lokuqala kukuqokelela umaleko wezinto zokuqhuba kudonga lomngxuma, kwaye wenze ifilimu yobhedu eyi-1 micron kuyo yonke indawo yePCB, kubandakanywa nodonga lomngxuma, ngokubekwa kweekhemikhali. Yonke inkqubo, njengonyango lwamachiza kunye nokucoca, ilawulwa ngumatshini.
PCB ezinzileyo
I-PCB ecocekileyo
Ukuthumela i-PCB
8, ukudluliselwa kobeko lwePCB yangaphandle
Okulandelayo, ubeko lwangaphandle lwePCB luya kudluliselwa kwifoyile yobhedu, kwaye inkqubo iyafana nomgaqo wangaphambili ongundoqo wodluliselo loyilo lwePCB, oku kusetyenziso lwefilimu ekhutshelweyo kunye nefilimu enovakalelo ukudlulisa ubeko lwePCB kwifoyile yobhedu, Umahluko kuphela kukuba ifilimu elungileyo iya kusetyenziswa njengebhodi.
Ukudluliselwa kwe-PCB yangaphakathi yamkela indlela yokuthabatha, kwaye ifilimu engalunganga isetyenziswa njengebhodi. I-PCB igutyungelwe yifilimu yemifanekiso eqinisiweyo yomgca, icoca ifilimu yemifanekiso engaqiniswanga, ifoyile yobhedu eveziweyo iyabhalwa, umgca woyilo wePCB ukhuselwe yifilimu yemifanekiso eqinisiweyo kwaye ukhohlo.
Ukudluliselwa kobeko lwe-PCB yangaphandle yamkela indlela eqhelekileyo, kwaye ifilimu elungileyo isetyenziswa njengebhodi. I-PCB igutyungelwe yifilimu ephilisayo yefotosensitive kwindawo engeyomnxeba. Emva kokucoca ifilimu engabonakaliyo ye-photosensitive, i-electroplating iyenziwa. Apho kukho ifilimu, ayikwazi ukufakwa kwi-electroplated, kwaye apho kungekho filimu, ifakwe ngobhedu kunye ne-tin. Emva kokuba ifilimu isusiwe, i-alkaline etching iyenziwa, kwaye ekugqibeleni i-tin iyasuswa. Ipateni yomgca ishiywe ebhodini kuba ikhuselwe ngetoti.
Yibambe iPCB kwaye uyifake kwi-electroplate yobhedu kuyo. Njengoko kukhankanyiwe ngaphambili, ukuze kuqinisekiswe ukuba umngxuma has conductivity elungileyo ngokwaneleyo, ifilimu yobhedu electroplated eludongeni umngxuma kufuneka ubukhulu 25 microns, ngoko ke yonke inkqubo iya kulawulwa ngokuzenzekelayo yikhompyutha ukuqinisekisa ukuchaneka kwayo.
9, PCB yangaphandle etching
Inkqubo yokufaka igqitywe ngombhobho ozenzekelayo opheleleyo. Okokuqala, ifilimu ephilisayo yefotosensitive kwibhodi yePCB iyacocwa. Emva koko ihlanjwe ngealkali eyomeleleyo ukususa ifoyile yobhedu engafunwayo egqunywe yiyo. Emva koko susa i-tin yokugquma kwi-PCB ye-foil yobhedu kunye nesisombululo se-detin. Emva kokucoca, i-4-layer PCB layout igqityiwe.