Iphakheji ye-Bigh-Line (Dip)
Iphakheji ye-intanethi ye-intanethi Imiqolo emibini yokukhokelela kwicala lesixhobo kwaye ikwi-angles elungileyo kwindiza ehambelana nomzimba wecandelo.
I-chip yokwamkela le ndlela yokupakisha ineemigca emibini yezikhonkwane, ezinokuthi zithengiswe ngokuthe ngqo kwisokethi ye-chip ngesikhundla se-DIP okanye ithengiswe kwinani lemingxunya elifanayo. Iimpawu zayo kukuba inokuqonda ngokulula ukuba i-ilding yebhodi ye-PCB, kwaye ihambelana ngokuchanekileyo neBhodi ephambili. Nangona kunjalo, ngenxa yokuba indawo yephakheji kunye nobunzima bukhulu, kwaye iikhonkwane zonakaliswa ngokulula ngexesha lenkqubo yeplagi, ukuthembeka kulihlwempu. Kwangelo xesha, le ndlela yokupakisha ngokubanzi ayidluli kwimigca eyi-100 ngenxa yempembelelo yenkqubo.
Iifom zediski yedikheji ye-Demilayer i-quip, i-quiramic enye ye-ceiramic i-intanethi, kubandakanya i-dip ye-riramic ye-ceramic, kubandakanya uhlobo lodidi lwe-ceramic, uhlobo lwe-ceramic lolupeling glay).
Iphakheji enye yomgca (i-SIP)
Iphakheji ye-intanethi yomgca Uluhlu lweendlela ezithe tye okanye izikhonkwane ze-protrude ukusuka kwicala lesixhobo.
Iphakheji enye yomgca (i-SIP) ikhokelela kwelinye icala lephakheji kwaye ilungelelanise umgca othe ngqo. Ngokwesiqhelo, bakuluhlu lomngxunya, kwaye izikhonkwane zifakwe kwimingxunya yentsimbi yeBhodi yeSiphaluka eprintiweyo. Xa idityaniswe kwiBhodi yeSiphako eprintiweyo, iphakheji ihleli ecaleni. Umahluko wale fom yi-zigzag uhlobo lwepakeji ye-intanethi Ngale ndlela, kuluhlu olunikiweyo ubude, uxinzelelo lwePIN luphuculwe. Umgama weziko leziko liqhelekileyo lihlala lingu-2,54mm, kwaye inani lezikhonkwane zisusela kwi-2 ukuya kwi-23. Uninzi lwazo luneemveliso ezenziwe ngokwezifiso. Ubume bephakeji buhluka. Ezinye iiphakheji ezinemilo efanayo njengoko i-zip ibizwa ngokuba yi-SIP.
Malunga nokupakisha
Ukupakisha kubhekisele ekuqhagamsheleni iikhonkwane zesekethe kwi-selicon chip kumalungu angaphandle ngeengcingo zokunxibelelana nezinye izixhobo. Ifom yephakheji ibhekisa kwizindlu zokunyusa i-semicondcuct chips zesekethe. Ayidlala kuphela indima yokunyuka, ukulungisa, ukutywina, ukukhusela i-chip kunye nokuphucula ukusebenza kwe-electrosel, kodwa kukwaqhagamshela kwiingcingo ze-chip, kwaye ezi zikhonkwane zidlula kwibhodi yesekethe eprintiweyo. Qhagamshela nezinye izixhobo ukuze uqaphele unxibelelwano phakathi kweChip yangaphakathi kunye nesekethe yangaphandle. Ngenxa yokuba i-chip kufuneka ibodwa kwihlabathi langaphandle ukuthintela ukungcola emoyeni ukusuka kwisekethe isekekelo ye-chip kunye nokubangela ukonakala kwendlela yombane.
Kwelinye icala, i-chip ebekiweyo ikwalula ukuyifaka kunye nezothutho. Kuba umgangatho wetekhnoloji yokupakisha kwakhona uchaphazela ngokuthe ngqo ukusebenza kwe-chip ngokwawo kunye noyilo kunye nemveliso ye-PCB (iBhodi yeSekethe eprintiweyo) edityaniswe kuyo, kubaluleke kakhulu.
Okwangoku, ukupakisha ikakhulu kukhwaziswe yi-DIP Dip Line kunye ne-SMD yephakheji.
