Ipakethe ekwimigca emibini (DIP)
Iphakheji ye-Dual-in-line (i-DIP-i-dual-in-line package), ifom yephakheji yamacandelo. Imiqolo emibini yesikhokelo isuka kwicala lesixhobo kwaye ikwiengile ezichanekileyo ukuya kwinqwelomoya ehambelana nomzimba wecandelo.
I-chip eyamkela le ndlela yokupakisha inemiqolo emibini yezikhonkwane, ezinokuthi zithengiswe ngokuthe ngqo kwi-socket ye-chip kunye nesakhiwo se-DIP okanye i-soldered kwindawo ye-solder enenani elifanayo lemingxuma ye-solder. Uphawu lwayo kukuba inokuqonda ngokulula ukutyhutyha ibhodi yePCB, kwaye ihambelana kakuhle nebhodi ephambili. Nangona kunjalo, ngenxa yokuba indawo yephakheji kunye nobukhulu bukhulu kakhulu, kwaye izikhonkwane zonakaliswa ngokulula ngexesha lenkqubo yeplagi, ukuthembeka akubi. Ngexesha elifanayo, le ndlela yokupakisha ngokubanzi ayidluli iikhonkwane ze-100 ngenxa yempembelelo yenkqubo.
Iifom zesakhiwo sephakheji ye-DIP zezi: i-multilayer ceramic e-line-line ye-DIP, i-ceramic eyodwa-i-ceramic ephindwe kabini kumgca we-DIP, isakhelo esikhokelayo se-DIP (kubandakanya uhlobo lokutywinwa kweglasi ye-ceramic, uhlobo lwesakhiwo seplastiki ye-encapsulation, uhlobo lokupakisha lweglasi encibilikayo ephantsi).
Iphakheji yomgca omnye (SIP)
Iphakheji yomgca omnye (i-SIP-inline-inline package), ifom yephakheji yamacandelo. Uluhlu lwezikhonkwane ezithe tye okanye izikhonkwane ziphuma kwicala lesixhobo.
Iphakheji yomgca womgca omnye (SIP) ikhokelela ngaphandle kwelinye icala lephakheji kwaye ilungelelanise ngomgca othe ngqo. Ngokuqhelekileyo, ziluhlobo lomngxuma, kwaye izikhonkwane zifakwe kwimingxuma yentsimbi yebhodi yesekethe eprintiweyo. Xa idityaniswe kwibhodi yesiphaluka eprintiweyo, ipakethe isecaleni. Ukwahluka kwale fomu luhlobo lwezigzag yodidi lwephakheji yomgca omnye (ZIP), izikhonkwane zazo zisaphuma kwelinye icala lepakethe, kodwa zicwangciswe ngendlela egosogoso. Ngale ndlela, ngaphakathi kobude obunikiweyo, ukuxinana kwephini kuphuculwe. Umgama weziko le-pin udla ngo-2.54mm, kwaye inani lezikhonkwane livela kwi-2 ukuya kwi-23. Uninzi lwazo luyimveliso eyenziwe ngokwezifiso. Ubume bepakethi iyahluka. Ezinye iipakethe ezinemilo efanayo ne-ZIP zibizwa ngokuba yi-SIP.
Malunga nokupakishwa
Ukupakishwa kubhekiselele ekudibaniseni izikhonkwane zesekethe kwitshiphu yesilicon ukuya kumalungu angaphandle ngeengcingo ukudibanisa nezinye izixhobo. Ifom yephakheji ibhekiselele kwizindlu zokufakela iitshiphusi zesekethe ezihlanganisiweyo zesemiconductor. Ayidlali kuphela indima yokunyuka, ukulungiswa, ukutywinwa, ukukhusela i-chip kunye nokuphucula ukusebenza kwe-electrothermal, kodwa idibanisa nezikhonkwane zegobolondo lepakethe ngeengcingo ngokusebenzisa abafowunelwa kwi-chip, kwaye ezi zikhonkwane zidlula iingcingo kwiprinta. ibhodi yesekethe. Qhagamshela kunye nezinye izixhobo ukuqonda unxibelelwano phakathi kwe-chip yangaphakathi kunye nesekethe yangaphandle. Ngenxa yokuba itshiphu kufuneka ibe yodwa kwihlabathi langaphandle ukuthintela ubumdaka obusemoyeni ekubeni bonakalise isekethe yetshiphu kwaye bubangele ukuthotywa kombane.
Ngakolunye uhlangothi, i-chip epakiweyo ilula ukuyifaka kunye nokuthutha. Ekubeni umgangatho wokupakisha iteknoloji ichaphazela ngokuthe ngqo ukusebenza kwe-chip ngokwayo kunye noyilo kunye nokuveliswa kwe-PCB (ibhodi yesekethe eprintiweyo) exhunywe kuyo, kubaluleke kakhulu.
Okwangoku, ukupakishwa kwahlulwe ikakhulu kwi-DIP edibeneyo yomgca kunye ne-SMD chip packaging.