Ngo-2023, ixabiso leshishini le-PCB yehlabathi kwiidola zaseMelika lehle nge-15.0% unyaka nonyaka.

Ngexesha eliphakathi kunye nexesha elide, ishishini liya kugcina ukukhula okuzinzileyo.Umlinganiselo oqikelelweyo wonyaka wokukhula kwemveliso yePCB yehlabathi ukusuka ngo-2023 ukuya ku-2028 yi-5.4%.Ukusuka kwimbono yengingqi, i#PCB ishishini kuyo yonke imimandla yehlabathi ibonise ukukhula okuqhubekayo.Ngokombono wesakhiwo semveliso, i-substrate yokupakisha, ibhodi ephezulu ye-multi-layer enemigangatho ye-18 nangaphezulu, kunye nebhodi ye-HDI iya kugcina izinga eliphezulu lokukhula, kwaye izinga lokukhula kwekhompawundi kwiminyaka emihlanu ezayo liya kuba yi-8.8%, 7.8% , kunye ne-6.2%, ngokulandelanayo.

Ukupakisha iimveliso ze-substrate, kwelinye icala, ubukrelekrele bokwenziwa, i-computing yefu, ukuqhuba ngobukrelekrele, i-Intanethi yento yonke kunye nezinye iimveliso zophuculo lwetekhnoloji kunye nokwandiswa kwemeko yesicelo, ukuqhuba ishishini lombane ukuya kwii-chips eziphezulu kunye nokukhula kwemfuno yokupakisha, ngaloo ndlela uqhuba. ushishino lwehlabathi lokupakisha lwesubstrate ukugcina ukukhula kwexesha elide.Ngokukodwa, ikhuthaze umgangatho ophezulu wokupakisha iimveliso ze-substrate ezisetyenziselwa amandla aphezulu ekhompyutheni, ukudibanisa kunye nezinye iimeko zokubonisa ukukhula okuphezulu.Kwelinye icala, ukunyuka kwenkxaso yangaphakathi kuphuhliso lweshishini le-semiconductor, kunye nokwanda kotyalo-mali olunxulumeneyo kuya kukhawulezisa uphuhliso loshishino lwasekhaya lokupakisha olungaphantsi.Ngexesha elifutshane, njengoko uluhlu lwempahla ye-semiconductor yokuphela komenzi ngokuthe ngcembe lubuyela kumanqanaba aqhelekileyo, iWorld Semiconductor Trade Statistics Organisation (emva koku ebizwa ngokuba yi "WSTS") ilindele ukuba imakethi yehlabathi ye-semiconductor ikhule nge-13.1% ngo-2024.

Kwiimveliso ze-PCB, iimarike ezifana nomncedisi kunye nokugcinwa kwedatha, unxibelelwano, amandla amatsha kunye nokuqhuba okuhlakaniphile, kunye ne-electronics yabathengi iya kuqhubeka ibalulekile ekukhuleni kwexesha elide kwishishini.Ukusuka kwimbono yelifu, kunye nokuvela okukhawulezileyo kobukrelekrele bokwenziwa, imfuno yeshishini le-ICT yamandla aphezulu ekhompyuter kunye nothungelwano olunesantya esiphezulu luya lungxamiseka ngakumbi, luqhuba ukukhula okukhawulezayo kwemfuno yobukhulu obukhulu, obuphezulu, obuphezulu kunye high-speed, high-level HDI, kunye neemveliso zePCB ezishushu kakhulu.Ukusuka kwindawo yokujonga i-terminal, kunye ne-AI kwiifowuni eziphathwayo, i-PCS, i-smart wear, i-IOT kunye nezinye imveliso
Ngokuqhubeka kokwenziwa nzulu kosetyenziso lweemveliso, imfuno yobuchule bekhompuyutha kunye notshintshiselwano ngesantya esiphezulu sedatha kunye nokuhanjiswa kwezicelo ezahlukeneyo zetheminali kungenise ukukhula okugqabhukileyo.Iqhutywa ngulo mkhwa ungasentla, imfuno yefrikhwensi ephezulu, isantya esiphezulu, ukudityaniswa, i-miniaturization, encinci kunye nokukhanya, ukuchithwa kobushushu obuphezulu kunye nezinye iimveliso ze-PCB ezinxulumene nezixhobo ze-elektroniki ze-terminal ziyaqhubeka nokukhula.