Ukuze siphuhlise i-PCB ngokukhawuleza, asikwazi ukwenza ngaphandle kokufunda nokuzoba izifundo, ngoko ibhodi yokukopa ye-PCB yazalwa. Ukuxelisa imveliso ye-elektroniki kunye ne-cloning yinkqubo yokukopa iibhodi zeesekethe.

1.Xa sifumana i-pcb ekufuneka ikopishwe, qala urekhode imodeli, iiparamitha, kunye nendawo yazo zonke iinxalenye ephepheni. Ingqwalasela ekhethekileyo kufuneka ihlawulwe kwicala le-diode, i-transistor, kunye nolwalathiso lwe-IC trap. Kungcono ukurekhoda indawo yeendawo ezibalulekileyo ngeefoto.

2. Susa zonke iinxalenye kwaye ususe itoti kumngxuma wePAD. Coca i-PCB ngotywala kwaye uyibeke kwiskena. Xa uskena, iskena kufuneka sinyuse ipixels yokuskena kancinane ukufumana umfanekiso ocacileyo. Qala i-POHTOSHOP, tshayela isikrini ngombala, gcina ifayile kwaye uyiprinte ukuze isetyenziswe kamva.

3. Gcoba kancinci i-TOP LAYER kunye ne-BOTTOM LAYER ngephepha lomsonto kwifilimu yobhedu eShiny. Yiya kwisikena, uqalise i-PHOTOSHOP, kwaye utshayela umaleko ngamnye ngombala.

4.Lungisa umahluko kunye nokukhanya kwe-canvas ukwenzela ukuba iindawo ezinefilimu yobhedu kunye namacandelo angenayo ifilimu yethusi ihluke kakhulu. Emva koko vula i-subgraph emnyama namhlophe ukujonga ukuba imigca icacile. Gcina imephu njengeefayile zefomati ye-BMP emnyama namhlophe TOP.BMP kunye ne-BOT.BMP.

5.Guqula iifayile ezimbini zeBMP kwiifayile zePROTEL ngokulandelanayo, kwaye ungenise iileya ezimbini kwiPROTEL. Ukuba izikhundla ezimbini ze-PAD kunye ne-VIA zihambelana ngokusisiseko, kubonisa ukuba amanyathelo angaphambili ayenziwe kakuhle, ukuba kukho ukuphambuka, phinda isinyathelo sesithathu.

6.Guqula i-BMP ye-TOP layer ukuya phezulu.PCB, nikela ingqalelo ekuguquleni kwi-SILK layer, ulandele umgca kwi-TOP layer, kwaye ubeke isixhobo ngokomzobo wesinyathelo sesibini. Cima umaleko weSILK xa ugqibile.

I-7.In PROTEL, i-TOP.PCB kunye ne-BOT.PCB zingeniswa ngaphandle kwaye zidibaniswe kwidayagram enye.

8.Sebenzisa umshicileli we-laser ukuprinta i-TOP LAYER kunye ne-BOTTOM LAYER ngokulandelanayo kwifilimu ebonakalayo (i-1: umlinganiselo we-1), ubeke ifilimu kwi-PCB, thelekisa ukuba ayilunganga, ukuba ichanekile, igqityiwe.