Uphuhliso lwePCB alunakwahlulwa kulangazelelo lwabantu lobomi obungcono. Ukusuka kwirediyo yokuqala ukuya kwiibhodi zekhompyuter zanamhlanje kunye nemfuno yamandla ekhompyuter ye-AI, ukuchaneka kwePCB kuye kwaphuculwa ngokuqhubekayo.
Ukuze siphuhlise i-PCB ngokukhawuleza, asikwazi ukwenza ngaphandle kokufunda kunye nokuboleka. Ke ngoko, ibhodi yokukhuphela yePCB yazalwa. Ukukopishwa kwePCB, ukukopishwa kwebhodi yesekethe, ukubumba ibhodi yesekethe, ukulinganisa imveliso ye-elektroniki, ukulinganisa imveliso ye-elektroniki, njl., eneneni yinkqubo yokuphindaphinda ibhodi yesekethe. Kukho iindlela ezininzi zokukhuphela iPCB kunye nenani elikhulu lesoftware yebhodi yekopi ekhawulezayo yePCB.
Namhlanje, makhe sithethe ngebhodi yekopi yePCB kwaye yeyiphi ibhodi yesoftware ekhoyo?
PCB ikopi yebhodi software?
PCB ikopi yebhodi software 1: BMP2PCB. Isoftware yebhodi yokuqala yekopi eneneni yisoftware nje yokuguqula iBMP ibe yiPCB kwaye sele iphelisiwe ngoku!
PCB ikopi ibhodi software 2: QuickPcb2005. Yisoftware yebhodi yekopi exhasa imifanekiso yemibala kwaye inoguqulelo oluqhekekileyo.
Isoftware yebhodi yekopi ekhawulezayo yePCB 3: CBR
Isoftware yebhodi yekopi ekhawulezayo yePCB 4: PMPCB
Indlela yokukopa iPCB kunye nenkqubo eneenkcukacha?
Inyathelo lokuqala, xa ufumana iPCB, qala urekhode imifuziselo, iiparamitha, kunye nezikhundla zawo onke amacandelo ephepheni, ngakumbi izalathiso zediode, iitransistors, kunye neenotshi zeICs. Kungcono ukuthatha iifoto ezimbini zeendawo zecandelo ngekhamera yedijithali.
Isinyathelo sesibini, susa onke amacandelo kwaye ususe i-tin kwimingxuma ye-PAD. Coca i-PCB ngotywala, uze uyibeke kwiskena. Xa uskena, iskena sifuna ukonyusa kancinane ipixels eziskeniweyo ukufumana umfanekiso ocacileyo. Qala i-POHTOSHOP, skena umphezulu wesikrini sesilika kwimowudi yombala, gcina ifayile kwaye uyiprinte ukuze uyigcine.
Isinyathelo sesithathu, sebenzisa i-sandpaper yamanzi ukupholisa kancinane i-TOP LAYER kunye ne-BOTTOM LAYER de ifilimu yobhedu ikhanye. Yifake kwiskena, qalisa i-PHOTOSHOP, kwaye uskene iileya ezimbini ngokwahlukeneyo kwimo yombala. Qaphela ukuba iPCB mayibekwe ngokuthe tye nangokuthe tye kwiskena, kungenjalo umfanekiso oskeniweyo awunakusetyenziswa, uze ugcine ifayile.
Isinyathelo sesine, lungisa ukungafani kunye nokukhanya kweseyile ukwenza iinxalenye ngefilimu yethusi kunye neengxenye ngaphandle kwefilimu yethusi ihluke kakhulu. Emva koko uguqule lo mfanekiso kumnyama namhlophe, kwaye khangela ukuba imigca icacile. Ukuba ayicacanga, phinda eli nyathelo. Ukuba kucacile, gcina umfanekiso njengefayile ye-BMP emnyama namhlophe TOP.BMP kunye ne-BOT.BMP. Ukuba kukho naziphi na iingxaki kwimizobo, zinokulungiswa kwaye zilungiswe ngokusebenzisa i-PHOTOSHOP.
Inyathelo lesihlanu, guqula iifayile ezimbini zefomati ye-BMP kwiifayile zefomati yePROTEL ngokulandelelanayo. Layisha iileya ezimbini kwi-PROTEL. Ukuba izikhundla ze-PAD kunye ne-VIA zemigangatho emibini zidibanisa ngokusisiseko, kubonisa ukuba amanyathelo angaphambili ayenziwe kakuhle. Ukuba kukho ukutenxa, phinda inyathelo lesithathu.
Inyathelo lokuqala, xa ufumana iPCB, qala urekhode imifuziselo, iiparamitha, kunye nezikhundla zawo onke amacandelo ephepheni, ngakumbi izalathiso zediode, iitransistors, kunye neenotshi zeICs. Kungcono ukuthatha iifoto ezimbini zeendawo zecandelo ngekhamera yedijithali.
Isinyathelo sesibini, susa onke amacandelo kwaye ususe i-tin kwimingxuma ye-PAD. Coca i-PCB ngotywala, uze uyibeke kwiskena. Xa uskena, iskena sifuna ukonyusa kancinane ipixels eziskeniweyo ukufumana umfanekiso ocacileyo. Qala i-POHTOSHOP, skena umphezulu wesikrini sesilika kwimowudi yombala, gcina ifayile kwaye uyiprinte ukuze uyigcine.
Isinyathelo sesithathu, sebenzisa i-sandpaper yamanzi ukupholisa kancinane i-TOP LAYER kunye ne-BOTTOM LAYER de ifilimu yobhedu ikhanye. Yifake kwiskena, qalisa i-PHOTOSHOP, kwaye uskene iileya ezimbini ngokwahlukeneyo kwimo yombala. Qaphela ukuba iPCB mayibekwe ngokuthe tye nangokuthe tye kwiskena, kungenjalo umfanekiso oskeniweyo awunakusetyenziswa, uze ugcine ifayile.
Isinyathelo sesine, lungisa ukungafani kunye nokukhanya kweseyile ukwenza iinxalenye ngefilimu yethusi kunye neengxenye ngaphandle kwefilimu yethusi ihluke kakhulu. Emva koko uguqule lo mfanekiso kumnyama namhlophe, kwaye khangela ukuba imigca icacile. Ukuba ayicacanga, phinda eli nyathelo. Ukuba kucacile, gcina umfanekiso njengefayile ye-BMP emnyama namhlophe TOP.BMP kunye ne-BOT.BMP. Ukuba kukho naziphi na iingxaki kwimizobo, zinokulungiswa kwaye zilungiswe ngokusebenzisa i-PHOTOSHOP.
Inyathelo lesihlanu, guqula iifayile ezimbini zefomati ye-BMP kwiifayile zefomati yePROTEL ngokulandelelanayo. Layisha iileya ezimbini kwi-PROTEL. Ukuba izikhundla ze-PAD kunye ne-VIA zemigangatho emibini zidibanisa ngokusisiseko, kubonisa ukuba amanyathelo angaphambili ayenziwe kakuhle. Ukuba kukho ukutenxa, phinda inyathelo lesithathu.
Inyathelo lesithandathu, guqula i-BMP yomaleko we-TOP kwi-TOP.PCB. Qaphela ukuba kufuneka iguqulelwe kumaleko we-SILK, oleleyo olutyheli. Emva koko udwebe imigca kwi-TOP layer kwaye ubeke amacandelo ngokomzobo kwisinyathelo sesibini. Emva kokuzoba, cima umaleko we-SILK.
Inyathelo lesithandathu, guqula i-BMP yomaleko we-TOP kwi-TOP.PCB. Qaphela ukuba kufuneka iguqulelwe kumaleko we-SILK, oleleyo olutyheli. Emva koko udwebe imigca kwi-TOP layer kwaye ubeke amacandelo ngokomzobo kwisinyathelo sesibini. Emva kokuzoba, cima umaleko we-SILK.
Inyathelo lesixhenxe, guqula iBMP yomaleko weBOT kwiBOT.PCB. Qaphela ukuba kufuneka iguqulelwe kumaleko we-SILK, oleleyo olutyheli. Emva koko ukrwele imigca kumaleko weBOT. Emva kokuzoba, cima umaleko we-SILK.
Isinyathelo sesibhozo, layisha i-TOP.PCB kunye ne-BOT.PCB kwi-PROTEL kwaye udibanise kwidayagram enye, kwaye yiloo nto.
Inyathelo lesithoba, printa ULENKO OLUPHAKAMILEYO kunye ne-BOTTOM LAYER kwifilimu ecacileyo ngeprinta yelaser (1:1 ratio), beka ifilimu kuloo PCB, thelekisa ukuze ubone ukuba kukho naziphi na iimpazamo. Ukuba akukho ziphoso, uphumelele.