Ngokwesakhiwo semveliso, inokwahlulwa ibe yibhodi eqinile (ibhodi enzima), ibhodi eguquguqukayo (ibhodi ethambileyo), ibhodi edibeneyo edibeneyo, ibhodi ye-HDI kunye ne-substrate yephakheji.Ngokwenani lokuhlela umaleko womgca, iPCB inokwahlulwa ibe yiphaneli enye, iphaneli ephindwe kabini kunye nebhodi enamaleko amaninzi.
Ipleyiti eqinileyo
Iimpawu zeMveliso: Yenziwe nge-substrate eqinile akulula ukugoba kwaye inamandla athile.Inokumelana nokugoba kwaye inokubonelela ngenkxaso ethile kumacandelo e-elektroniki aqhotyoshelwe kuyo.I-substrate eqinile ibandakanya i-glass fiber cloth substrate, i-substrate yephepha, i-composite substrate, i-ceramic substrate, i-metal substrate, i-thermoplastic substrate, njl.
Izicelo: Izixhobo zekhompyutha kunye nenethiwekhi, izixhobo zonxibelelwano, ulawulo lwamashishini kunye nezonyango, i-electronics yabathengi kunye ne-automotive electronics.
Ipleyiti eguquguqukayo
Iimpawu zeMveliso: Ibhekisela kwibhodi yesekethe eprintiweyo eyenziwe nge-flexible insulating substrate.Inokugotywa ngokukhululekileyo, inxeba, isongwe, icwangciswe ngokungacwangciswanga ngokweemfuno zokucwangciswa kwendawo, kwaye ishukunyiswe ngokungekho mthethweni kwaye yandiswe kwindawo enemigangatho emithathu.Ngaloo ndlela, indibano yecandelo kunye nokuqhagamshelwa kwecingo kunokudibaniswa.
Usetyenziso: ii-smartphones, iilaptops, iitafile kunye nezinye izixhobo zombane eziphathwayo.
Ipleyiti yokudibanisa i-torsion eqinile
Iimpawu zeMveliso: ibhekiselele kwibhodi yesekethe eprintiweyo equlethe indawo enye okanye ngaphezulu engqongqo kunye neendawo eziguquguqukayo, umaleko obhityileyo webhodi yesekethe eprintiweyo ezantsi kunye nebhodi yesekethe eprintiweyo eqinileyo ezantsi edibeneyo lamination.Inzuzo yayo kukuba inokubonelela ngendima yenkxaso yepleyiti eqinile, kodwa ineempawu zokugoba zepleyiti eguquguqukayo, kwaye inokuhlangabezana neemfuno zendibano ezintathu-ntathu.
Usetyenziso: Izixhobo zombane ezikwinqanaba eliphezulu, iikhamera eziphathwayo kunye nezixhobo zekhompyutha ezisongayo.
ibhodi HDI
Iimpawu Product: High Uxinaniso Interconnect isishunqulelo, oko kukuthi, uxinaniso eliphezulu uqhagamshelwano lweteknoloji, i ibhodi yesekethe eprintiweyo ubuchwepheshe.Ibhodi ye-HDI ngokubanzi iveliswa ngendlela yokubeka, kwaye itekhnoloji yokomba i-laser isetyenziselwa ukugrumba imingxuma ekubekweni, ukuze yonke ibhodi yesekethe eprintiweyo yenze unxibelelwano lwe-interlayer kunye nemingxuma engcwatyiweyo neyimfama njengeyona ndlela iphambili yokuqhuba.Xa kuthelekiswa nebhodi eprintiweyo yemveli emininzi, ibhodi ye-HDI inokuphucula ukuxinana kwee-wiring zebhodi, ehambelana nokusetyenziswa kobuchwephesha bokupakisha obuphambili.Umgangatho wemveliso yomqondiso unokuphuculwa;Isenokwenza iimveliso zombane zibembane kwaye zilungele imbonakalo.
Isicelo: Ikakhulu kwintsimi ye-electronics yabathengi enemfuno ephezulu yoxinaniso, isetyenziswa ngokubanzi kwiifowuni eziphathwayo, iikhompyutheni zekhompyutheni, i-automotive electronics kunye nezinye iimveliso zedijithali, phakathi kwazo iifowuni eziphathwayo zezona zisetyenziswa kakhulu.Okwangoku, iimveliso zonxibelelwano, iimveliso zenethiwekhi, iimveliso zeseva, iimveliso zeemoto kunye neemveliso ze-aerospace zisetyenziswa kwitekhnoloji ye-HDI.
Ipakethe substrate
Iimpawu zeMveliso: oko kukuthi, ipleyiti yokulayisha itywina ye-IC, esetyenziswa ngokuthe ngqo ukuthwala itshiphu, inokubonelela ngoqhagamshelo lombane, ukhuseleko, inkxaso, ukutshatyalaliswa kobushushu, ukuhlanganisana kunye neminye imisebenzi yetshiphu, ukuze kuphunyezwe izikhonkwane ezininzi, ukunciphisa ubungakanani bemveliso yephakheji, ukuphucula ukusebenza kombane kunye nokutshatyalaliswa kobushushu, ubuninzi be-ultra-high okanye injongo ye-multi-chip modularization.
Intsimi yesicelo: Kwintsimi yeemveliso zonxibelelwano eziphathwayo ezifana neefowuni ze-smart kunye neekhompyutheni zethebhulethi, i-substrates yokupakisha isetyenziswe ngokubanzi.Ezinje ngeetshiphu zememori zokugcina, i-MEMS yokuva, iimodyuli zeRF zokuchongwa kweRF, iitshiphusi zeprosesa kunye nezinye izixhobo kufuneka zisebenzise ii-substrates zokupakisha.I-substrate yephakheji yonxibelelwano olukhawulezayo isetyenziswe ngokubanzi kwi-data broadband kunye neminye imimandla.
Uhlobo lwesibini luhlelwa ngokwenani lemigca yomgca.Ngokwenani lokuhlela umaleko womgca, iPCB inokwahlulwa ibe yiphaneli enye, iphaneli ephindwe kabini kunye nebhodi enamaleko amaninzi.
Iphaneli enye
Iibhodi ezinecala elinye (iibhodi ezicalanye) Kwi-PCB eyona nto isisiseko, iinxalenye zigxininiswe kwelinye icala, ucingo lugxininiswe kwelinye icala (kukho icandelo le-patch kunye nocingo linye icala, kunye neplagi- kwisixhobo kwelinye icala).Ngenxa yokuba ucingo luvela kwicala elinye kuphela, le PCB ibizwa ngokuba yi-Single-side.Ngenxa yokuba iphaneli enye inezithintelo ezininzi ezingqongqo kwisekethe yoyilo (kuba kukho icala elinye kuphela, i-wiring ayikwazi ukuwela kwaye kufuneka ijikeleze indlela eyahlukileyo), kuphela iisekethe zokuqala ezisetyenziselwa iibhodi ezinjalo.
Iphaneli ezimbini
Iibhodi ezinamacala amabini zineentambo kumacala omabini, kodwa ukusebenzisa iingcingo kumacala omabini, kufuneka kubekho uxhulumaniso olufanelekileyo lwesekethe phakathi kwamacala amabini.Le "bhulorho" phakathi kweesekethe ibizwa ngokuba ngumngxuma wokulingwa (nge).Umngxuma wokulingwa ngumngxuma omncinci ozaliswe okanye uqatywe ngentsimbi kwiPCB, enokudityaniswa ngeengcingo kumacala omabini.Ngenxa yokuba indawo yendawo yolawulo ephindwe kabini inkulu ngokuphindwe kabini kunaleyo yendawo yolawulo enye, indawo yolawulo ephindwe kabini isombulula ubunzima bendawo yocingo eshiyanayo kwindawo yolawulo enye (inokuqhutywa ngomngxuma ukuya kwelinye icala), kwaye ingaphezulu. ilungele ukusetyenziswa kwiisekethe ezintsonkothileyo kunephaneli enye.
Iibhodi ezininzi zeLayer Ukuze kwandiswe indawo enokuthi ifakwe iingcingo, iibhodi ezinamacala amaninzi zisebenzisa iibhodi zocingo ezinamacala ahlukeneyo okanye amabini.
Ibhodi yesekethe eprintiweyo enomaleko wangaphakathi onamacala amabini, umaleko wangaphandle onamacala amabini okanye umaleko wangaphakathi onamacala amabini, umaleko wangaphandle onecala elinye, ngokusebenzisa inkqubo yokubeka kunye nezixhobo zokugquma umgquba ngokutshintshana kunye kunye nemizobo eqhubayo idityaniswe ngokuhambelana. kwiimfuno zoyilo lwebhodi yesekethe eprintiweyo iba umaleko-mine, ibhodi yesekethe eprintiweyo ezintandathu, eyaziwa ngokuba yibhodi yesekethe eprintiweyo eninzi.
Inani leengqimba zebhodi alithethi ukuba kukho iileya ezininzi ezizimeleyo zocingo, kwaye kwiimeko ezikhethekileyo, iileya ezingenanto ziya kongezwa ukulawula ubukhulu bebhodi, ngokuqhelekileyo inani leemaleko lilinganayo, kwaye liqulethe iileya ezimbini ezingaphandle. .Uninzi lwebhodi yomkhosi yi-4 ukuya kwi-8 yesakhiwo somaleko, kodwa ngokobuchwepheshe kunokwenzeka ukuba ufezekise phantse i-100 yebhodi ye-PCB.Uninzi lweekhompyuter ezinkulu zisebenzisa i-multilayer mainframe, kodwa ekubeni ezo khompyuter zinokutshintshwa ngamaqela eekhompyuter ezininzi eziqhelekileyo, iibhodi ze-ultra-multilayer ziye zayeka ukusetyenziswa.Ngenxa yokuba iileya kwi-PCB zidityaniswe ngokusondeleyo, akukho lula ukubona inani lokwenyani, kodwa ukuba uqwalasela ngononophelo ibhodi yokusingatha, isengabonwa.