Umgaqo: Ifilimu yendalo yenziwe phezu kobhedu kwibhodi yesiphaluka, ekhusela ngokuqinileyo ubuso bobhedu obutsha, kwaye inokuthintela i-oxidation kunye nokungcola kwiqondo lokushisa eliphezulu. Ubukhulu befilimu ye-OSP bulawulwa ngokubanzi kwi-0.2-0.5 microns.

1. Inkqubo yokuhamba: ukukhupha amafutha → ukuhlamba amanzi → ukhukuliseko oluncinci → ukuhlamba ngamanzi → ukuhlamba ngeasidi → ukuhlamba ngamanzi acocekileyo → OSP → ukuhlamba amanzi acocekileyo → ukomisa.

2. Iindidi zezinto ze-OSP: I-Rosin, i-Active Resin kunye ne-Azole. Izinto ze-OSP ezisetyenziswe yi-Shenzhen United Circuits zisetyenziswa ngoku ngokubanzi ii-OSP ze-azole.

Yintoni inkqubo yonyango lomphezulu we-OSP yebhodi yePCB?

3. Iimpawu: i-flatness elungileyo, akukho IMC yenziwe phakathi kwefilimu ye-OSP kunye nobhedu lwebhodi yebhodi yesekethe, evumela i-solder ethe ngqo ye-solder kunye nebhodi yebhodi yobhedu ngexesha le-soldering (i-wettability efanelekileyo), iteknoloji yokucubungula ukushisa okuphantsi, ixabiso eliphantsi (ixabiso eliphantsi. ) Kwi-HASL), amandla amancinci asetyenziswa ngexesha lokucubungula, njl. PCB Proofing Yoko ibhodi ikhuthaza iziphene: ① inkangeleko yokuhlola kunzima, ayilungelanga ukuphinda-phinda i-soldering (ifuna amaxesha amathathu ngokubanzi); ② Umphezulu wefilimu ye-OSP kulula ukuwukrwempa; ③ iimfuno zokusingqongileyo zogcino ziphezulu; ④ ixesha lokugcina lifutshane.

4. Indlela yokugcina kunye nexesha: Iinyanga ze-6 kwi-package ye-vacuum (iqondo lokushisa 15-35℃, umswakama RH≤60%).

5. Iimfuno zesiza se-SMT: ① Ibhodi yesekethe ye-OSP kufuneka igcinwe kwiqondo lobushushu eliphantsi kunye nokufuma okuphantsi (iqondo lobushushu 15-35°C, ukufuma RH ≤60%) kwaye uthintele ukuvezwa kwendalo ezaliswe yigesi yeasidi, kwaye indibano iqala ngaphakathi kwe-48. iiyure emva kokukhulula iphakheji ye-OSP; ② Kucetyiswa ukuba uyisebenzise kwiiyure ezingama-48 emva kokuba iqhekeza elicalanye ligqityiwe, kwaye kucetyiswa ukuba ligcinwe kwikhabhinethi yobushushu obuphantsi endaweni yokupakisha i-vacuum;