3 Ubushushu obuphezulu kunye neemfuno zokutshatyalaliswa kobushushu

Nge-miniaturization, ukusebenza okuphezulu, kunye nokuveliswa kobushushu obuphezulu bezixhobo ze-elektroniki, iimfuno zolawulo lwe-thermal yezixhobo ze-elektroniki ziyaqhubeka zikhula, kwaye esinye sezisombululo ezikhethiweyo kukuphuhlisa iibhodi zesekethe eziprintiweyo ze-thermal.Imeko ephambili yokumelana nokushisa kunye ne-PCBs yokushisa i-heat-resistant-resistant kunye ne-heat-dissipating properties ze-substrate.Okwangoku, ukuphuculwa kwezinto ezisisiseko kunye nokongezwa kwezizalisi kuye kwaphucula i-heat-resistant kunye ne-heat-dissipating properties kwinqanaba elithile, kodwa ukuphuculwa kwe-thermal conductivity kuncinci kakhulu.Ngokuqhelekileyo, i-metal substrate (IMS) okanye ibhodi yesekethe engundoqo eprintiweyo isetyenziselwa ukutshabalalisa ubushushu becandelo lokufudumeza, elinciphisa umthamo kunye neendleko xa kuthelekiswa neradiyetha yendabuko kunye nokupholisa kwefeni.

I-aluminium yinto ekhangayo kakhulu.Inobuncwane obuninzi, ixabiso eliphantsi, i-thermal conductivity elungileyo kunye namandla, kwaye ihambelana nokusingqongileyo.Okwangoku, i-metal substrates okanye iintsimbi zetsimbi ziyi-aluminium yensimbi.Iingenelo zeebhodi zesekethe ezisekelwe kwi-aluminium zilula kwaye zinoqoqosho, unxibelelwano lwe-elektroniki oluthembekileyo, ukuhanjiswa okuphezulu kwe-thermal kunye namandla, i-solder-free kunye ne-lead-free yokhuseleko lokusingqongileyo, njl., kwaye inokuyilwa kwaye isetyenziswe kwiimveliso zabathengi ukuya kwiimoto, iimveliso zomkhosi. kunye ne-aerospace.Akukho mathandabuzo malunga ne-thermal conductivity kunye nokumelana nokushisa kwe-metal substrate.Isitshixo silele ekusebenzeni kwe-adhesive ye-insulating phakathi kwepleyiti yensimbi kunye noluhlu lwesekethe.

Okwangoku, amandla okuqhuba ulawulo lwe-thermal lugxile kwii-LED.Phantse i-80% yegalelo lamandla e-LED aguqulwa abe bubushushu.Ngoko ke, umba wokulawulwa kwe-thermal ye-LED ixabiswa kakhulu, kwaye igxininise ekutshitshisweni kokushisa kwe-substrate ye-LED.Ukubunjwa kwezinto ezinokumelana nokushisa okuphezulu kunye nokusingqongileyo ukutshabalalisa ubushushu be-insulating layers kubeka isiseko sokungena kwimarike yokukhanyisa i-LED ephezulu.

4 Izixhobo zombane ezithambileyo neziprintiweyo kunye nezinye iimfuno

4.1 Iimfuno zebhodi eziguquguqukayo

I-miniaturization kunye nokunciphisa izixhobo ze-elektroniki ngokuqinisekileyo kuya kusebenzisa inani elikhulu leebhodi zesekethe eziprintiweyo (FPCB) kunye neebhodi zesekethe eziprintiweyo eziqinileyo (R-FPCB).Imakethi ye-FPCB yehlabathi ngoku iqikelelwa malunga ne-13 yeebhiliyoni zeedola zaseMelika, kwaye izinga lokukhula lonyaka lilindeleke ukuba libe phezulu kunelo leePCB eziqinileyo.

Ngokwandiswa kwesicelo, ngaphezu kokunyuka kwenani, kuya kubakho iimfuno ezininzi zokusebenza ezintsha.Iifilimu zePolyimide zifumaneka ngokungenambala kunye nokungafihli, ezimhlophe, ezimnyama, ezityheli, kwaye zinokumelana nobushushu obuphezulu kunye neempawu eziphantsi ze-CTE, ezifanelekileyo kwizihlandlo ezahlukeneyo.Iisubstrates zefilimu zepolyester ezinexabiso eliphantsi nazo ziyafumaneka kwimarike.Imingeni emitsha yokusebenza ibandakanya ukuqina okuphezulu, ukuzinza komda, umgangatho wefilimu, kunye nokudityaniswa kombane wefilimu kunye nokumelana nokusingqongileyo ukuhlangabezana neemfuno ezihlala zitshintsha zabasebenzisi bokugqibela.

I-FPCB kunye neebhodi ze-HDI eziqinileyo kufuneka zihlangabezane neemfuno zesantya esiphezulu kunye nokuhanjiswa kwesignali ephezulu.Ilahleko ye-dielectric engaguqukiyo kunye ne-dielectric yee-substrates eziguquguqukayo nazo kufuneka ziqwalaselwe.I-Polytetrafluoroethylene kunye ne-advanced polyimide substrates zingasetyenziselwa ukwenza ukuguquguquka.Isekethe.Ukongeza umgubo we-inorganic kunye ne-carbon fiber filler kwi-polyimide resin inokuvelisa isakhiwo esinemigangatho emithathu ye-flexible thermally conductive substrate.I-inorganic fillers esetyenzisiweyo yi-aluminium nitride (AlN), i-aluminium oxide (Al2O3) kunye ne-hexagonal boron nitride (HBN).I-substrate ine-1.51W / mK conductivity ye-thermal kwaye inokumelana ne-2.5kV yokumelana nombane kunye novavanyo lwe-180 degree.

Iimarike zezicelo zeFPCB, ezifana neefowuni ezihlakaniphile, izixhobo ezinxitywayo, izixhobo zonyango, iirobhothi, njl., zibeka iimfuno ezintsha kwisakhiwo sokusebenza seFPCB, kunye nokuphuhlisa iimveliso ezintsha zeFPCB.Njengebhodi ye-ultra-thin flexible multilayer, i-FPCB ene-four-layer iyancitshiswa ukusuka kwi-0.4mm eqhelekileyo ukuya kwi-0.2mm;ibhodi eguquguqukayo yokuhanjiswa kwesantya esiphezulu, usebenzisa i-low-Dk kunye ne-low-Df polyimide substrate, ukufikelela kwiimfuno ze-5Gbps zokuhanjiswa kwesantya;enkulu Ibhodi eguquguqukayo yamandla isebenzisa i-conductor ngaphezulu kwe-100μm ukuhlangabezana neemfuno zamandla aphezulu kunye neesekethe eziphezulu zangoku;ibhodi eguquguqukayo esekelwe kubushushu obuphezulu yi-R-FPCB esebenzisa i-metal plate substrate ngokuyinxenye;ibhodi ye-tactile flexible i-pressure-sensed I-membrane kunye ne-electrode zixutywe phakathi kweefilimu ezimbini ze-polyimide ukuze zenze i-sensor e-flexible tactile;ibhodi eguquguqukayo enwebekayo okanye ibhodi eqinile-i-flexible, i-substrate eguquguqukayo i-elastomer, kunye nokuma kwephethini yocingo lwetsimbi kuphuculwe ukunwebeka.Ngokuqinisekileyo, ezi FPCB zikhethekileyo zifuna ii-substrates ezingaqhelekanga.

4.2 Iimfuno zombane eziprintiweyo

I-elektroniki eprintiweyo ifumene amandla kwiminyaka yakutshanje, kwaye kuqikelelwa ukuba phakathi koo-2020, i-elektroniki eprintiweyo iya kuba nemarike engaphezu kwe-300 yeebhiliyoni zeedola zaseMelika.Ukusetyenziswa kweteknoloji ye-elektroniki eprintiweyo kwishishini lesekethe eprintiweyo yinxalenye yethekhnoloji yesekethe eprintiweyo, eye yaba yimvumelwano kwishishini.Itekhnoloji ye-elektroniki eprintiweyo yeyona ikufutshane kwi-FPCB.Ngoku abavelisi bePCB batyale imali kwi-elektroniki eprintiweyo.Baqala ngeebhodi eziguquguqukayo baza batshintsha iibhodi zesekethe eziprintiweyo (PCB) bafaka iisekethe ze-elektroniki eziprintiweyo (PEC).Okwangoku, kukho ii-substrates ezininzi kunye nezixhobo ze-inki, kwaye xa kukho ukuphumelela ekusebenzeni kunye neendleko, ziya kusetyenziswa ngokubanzi.Abavelisi bePCB akufuneki baphoswe lithuba.

Usetyenziso olungundoqo lwangoku lwee-electronics eziprintiweyo kukwenziwa kweethegi zerediyo ze-radio frequency identification (RFID) ezinexabiso eliphantsi, ezinokuprintwa ngemiqulu.Ikhono likwiindawo zemiboniso eprintiweyo, ukukhanya, kunye ne-organic photovoltaics.Imakethi yetekhnoloji enokunxitywa okwangoku yintengiso encomekayo evelayo.Iimveliso ezahlukeneyo zobuchwepheshe obunxitywayo, ezifana nempahla ekrelekrele kunye neeglasi zemidlalo ezikrelekrele, iimonitha zemisebenzi, izivamvo zokulala, iiwotshi ezikrelekrele, ii-headsets eziphuculweyo, iikhampasi zokuhamba, njl. njl. iisekethe ze-elektroniki eziprintiweyo.

Inkalo ebalulekileyo yeteknoloji ye-elektroniki eprintiweyo yizinto eziphathekayo, kuquka i-substrates kunye nee-inki ezisebenzayo.I-Flexible substrates ayifanelekanga kuphela kwii-FPCB ezikhoyo, kodwa kunye ne-substrates yokusebenza ephezulu.Okwangoku, kukho izinto eziphezulu ze-dielectric substrate ezenziwe ngomxube we-ceramics kunye ne-polymer resins, kunye ne-high-temperature substrates, i-substrates ye-low-temperature kunye ne-transparent substrates engenambala., I-substrate etyheli, njl.

4 Izixhobo zombane ezithambileyo neziprintiweyo kunye nezinye iimfuno

4.1 Iimfuno zebhodi eziguquguqukayo

I-miniaturization kunye nokunciphisa izixhobo ze-elektroniki ngokuqinisekileyo kuya kusebenzisa inani elikhulu leebhodi zesekethe eziprintiweyo (FPCB) kunye neebhodi zesekethe eziprintiweyo eziqinileyo (R-FPCB).Imakethi ye-FPCB yehlabathi ngoku iqikelelwa malunga ne-13 yeebhiliyoni zeedola zaseMelika, kwaye izinga lokukhula lonyaka lilindeleke ukuba libe phezulu kunelo leePCB eziqinileyo.

Ngokwandiswa kwesicelo, ngaphezu kokunyuka kwenani, kuya kubakho iimfuno ezininzi zokusebenza ezintsha.Iifilimu zePolyimide zifumaneka ngokungenambala kunye nokungafihli, ezimhlophe, ezimnyama, ezityheli, kwaye zinokumelana nobushushu obuphezulu kunye neempawu eziphantsi ze-CTE, ezifanelekileyo kwizihlandlo ezahlukeneyo.Iisubstrates zefilimu zepolyester ezinexabiso eliphantsi nazo ziyafumaneka kwimarike.Imingeni emitsha yokusebenza ibandakanya ukuqina okuphezulu, ukuzinza komda, umgangatho wefilimu, kunye nokudityaniswa kombane wefilimu kunye nokumelana nokusingqongileyo ukuhlangabezana neemfuno ezihlala zitshintsha zabasebenzisi bokugqibela.

I-FPCB kunye neebhodi ze-HDI eziqinileyo kufuneka zihlangabezane neemfuno zesantya esiphezulu kunye nokuhanjiswa kwesignali ephezulu.Ilahleko ye-dielectric engaguqukiyo kunye ne-dielectric yee-substrates eziguquguqukayo nazo kufuneka ziqwalaselwe.I-Polytetrafluoroethylene kunye ne-advanced polyimide substrates zingasetyenziselwa ukwenza ukuguquguquka.Isekethe.Ukongeza umgubo we-inorganic kunye ne-carbon fiber filler kwi-polyimide resin inokuvelisa isakhiwo esinemigangatho emithathu ye-flexible thermally conductive substrate.I-inorganic fillers esetyenzisiweyo yi-aluminium nitride (AlN), i-aluminium oxide (Al2O3) kunye ne-hexagonal boron nitride (HBN).I-substrate ine-1.51W / mK conductivity ye-thermal kwaye inokumelana ne-2.5kV yokumelana nombane kunye novavanyo lwe-180 degree.

Iimarike zezicelo zeFPCB, ezifana neefowuni ezihlakaniphile, izixhobo ezinxitywayo, izixhobo zonyango, iirobhothi, njl., zibeka iimfuno ezintsha kwisakhiwo sokusebenza seFPCB, kunye nokuphuhlisa iimveliso ezintsha zeFPCB.Njengebhodi ye-ultra-thin flexible multilayer, i-FPCB ene-four-layer iyancitshiswa ukusuka kwi-0.4mm eqhelekileyo ukuya kwi-0.2mm;ibhodi eguquguqukayo yokuhanjiswa kwesantya esiphezulu, usebenzisa i-low-Dk kunye ne-low-Df polyimide substrate, ukufikelela kwiimfuno ze-5Gbps zokuhanjiswa kwesantya;enkulu Ibhodi eguquguqukayo yamandla isebenzisa i-conductor ngaphezulu kwe-100μm ukuhlangabezana neemfuno zamandla aphezulu kunye neesekethe eziphezulu zangoku;ibhodi eguquguqukayo esekelwe kubushushu obuphezulu yi-R-FPCB esebenzisa i-metal plate substrate ngokuyinxenye;ibhodi ye-tactile flexible i-pressure-sensed I-membrane kunye ne-electrode zixutywe phakathi kweefilimu ezimbini ze-polyimide ukuze zenze i-sensor e-flexible tactile;ibhodi eguquguqukayo enwebekayo okanye ibhodi eqinile-eguquguqukayo, i-substrate eguquguqukayo i-elastomer, kunye nokuma kwephethini yocingo lwetsimbi kuphuculwe ukuba kunwenwe.Ngokuqinisekileyo, ezi FPCB zikhethekileyo zifuna ii-substrates ezingaqhelekanga.

4.2 Iimfuno zombane eziprintiweyo

I-elektroniki eprintiweyo ifumene amandla kwiminyaka yakutshanje, kwaye kuqikelelwa ukuba phakathi koo-2020, i-elektroniki eprintiweyo iya kuba nemarike engaphezu kwe-300 yeebhiliyoni zeedola zaseMelika.Ukusetyenziswa kweteknoloji ye-elektroniki eprintiweyo kwishishini lesekethe eprintiweyo yinxalenye yethekhnoloji yesekethe eprintiweyo, eye yaba yimvumelwano kwishishini.Itekhnoloji ye-elektroniki eprintiweyo yeyona ikufutshane kwi-FPCB.Ngoku abavelisi bePCB batyale imali kwi-elektroniki eprintiweyo.Baqala ngeebhodi eziguquguqukayo baza batshintsha iibhodi zesekethe eziprintiweyo (PCB) bafaka iisekethe ze-elektroniki eziprintiweyo (PEC).Okwangoku, kukho ii-substrates ezininzi kunye nezixhobo ze-inki, kwaye xa kukho ukuphumelela ekusebenzeni kunye neendleko, ziya kusetyenziswa ngokubanzi.Abavelisi bePCB akufuneki baphoswe lithuba.

Usetyenziso olungundoqo lwangoku lwee-electronics eziprintiweyo kukwenziwa kweethegi zerediyo ze-radio frequency identification (RFID) ezinexabiso eliphantsi, ezinokuprintwa ngemiqulu.Ikhono likwiindawo zemiboniso eprintiweyo, ukukhanya, kunye ne-organic photovoltaics.Imakethi yethekhinoloji enokunxitywa Okwangoku yimarike encomekayo esakhulayo.Iimveliso ezahlukeneyo zobuchwepheshe obunxitywayo, ezifana nempahla ekrelekrele kunye neeglasi zemidlalo ezikrelekrele, iimonitha zemisebenzi, izivamvo zokulala, iiwotshi ezikrelekrele, ii-headsets eziphuculweyo, iikhampasi zokuhamba, njl. njl. iisekethe ze-elektroniki eziprintiweyo.

Inkalo ebalulekileyo yeteknoloji ye-electronics eprintiweyo yizinto eziphathekayo, kubandakanywa i-substrates kunye neenki ezisebenzayo.I-Flexible substrates ayifanelekanga kuphela kwii-FPCB ezikhoyo, kodwa kunye ne-substrates yokusebenza ephezulu.Okwangoku, kukho izinto eziphezulu ze-dielectric substrate eziqulunqwe ngumxube we-ceramics kunye ne-polymer resins , kunye ne-substrates yobushushu obuphezulu, i-substrates yobushushu obuphantsi kunye ne-transparent substrates engenambala., I-Yellow substrate, njl.