Iimpawu ezisisiseko zebhodi yesekethe eprintiweyo zixhomekeke ekusebenzeni kwebhodi ye-substrate.Ukuphucula ukusebenza kobugcisa bebhodi yesekethe eprintiweyo, ukusebenza kwebhodi ye-substrate yesekethe eprintiweyo kufuneka kuphuculwe kuqala.Ukuze kuhlangatyezwane neemfuno zophuhliso lwebhodi yesekethe eprintiweyo, izinto ezintsha ezahlukeneyo ziphuhliswa ngokuthe ngcembe kwaye zisetyenziswe.
Kwiminyaka yakutshanje, imakethi yePCB iye yatshintsha ugxininiso lwayo ukusuka kwiikhompyuter ukuya kunxibelelwano, kubandakanya nezikhululo ezisisiseko, iiseva, kunye neetheminali eziphathwayo.Izixhobo zonxibelelwano eziphathwayo ezimelwe zii-smartphones ziye zaqhuba ii-PCBs kuxinaniso oluphezulu, olubhityileyo, kunye nokusebenza okuphezulu.Itekhnoloji yesekethe eprintiweyo ayinakwahlulwa kwizinto zesubstrate, ezibandakanya iimfuno zobugcisa ze-PCB substrates.Umxholo ofanelekileyo wezinto eziphantsi kwe-substrate ngoku uququzelelwe kwinqaku elikhethekileyo kwireferensi yoshishino.
1 Imfuno yokuxinana okuphezulu kunye nomgca ocolekileyo
1.1 Imfuno yefoyile yobhedu
IiPCBs zonke ziphuhla zisiya kuphuhliso oluphezulu kunye nophuhliso lomgca obhityileyo, kwaye iibhodi zeHDI zibalaseleyo.Kwiminyaka elishumi eyadlulayo, i-IPC yachaza ibhodi ye-HDI njengobubanzi bomgca/isithuba somgca (L/S) we-0.1mm/0.1mm nangaphantsi.Ngoku i-shishini ngokusisiseko lifezekisa i-L / S eqhelekileyo ye-60μm, kunye ne-L / S ephezulu ye-40μm.Uguqulelo lwaseJapan luka-2013 lwedatha yendlela yofakelo lwetekhnoloji kukuba ngo-2014, i-L / S eqhelekileyo yebhodi ye-HDI yayiyi-50μm, i-L / S ephezulu yayiyi-35μm, kwaye i-L / S eveliswe ngolingo yayiyi-20μm.
Ukubunjwa kwepateni yesekethe ye-PCB, inkqubo yemveli yokubhala iikhemikhali (indlela yokukhupha) emva kwefotoimaging kwi-substrate yefoyile yobhedu, ubuncinci bomda wendlela yokukhupha ukwenza imigca emihle imalunga ne-30μm, kunye nefoyile yobhedu ebhityileyo (9 ~ 12μm) i-substrate efunekayo.Ngenxa yexabiso eliphezulu lefoyile yobhedu ebhityileyo yeCCL kunye neziphene ezininzi kwifoyile yobhedu ebhityileyo, iifektri ezininzi zivelisa ifoyile yobhedu eyi-18μm kwaye zisebenzise i-etching ukubhitya umaleko wobhedu ngexesha lemveliso.Le ndlela ineenkqubo ezininzi, ukulawula ubunzima obunzima, kunye neendleko eziphezulu.Kungcono ukusebenzisa i-foil yobhedu encinci.Ukongeza, xa i-PCB yesekethe i-L/S ingaphantsi kwe-20μm, i-foil yobhedu ebhityileyo ngokuqhelekileyo kunzima ukuyiphatha.Ifuna i-ultra-thin copper foil (3 ~ 5μm) i-substrate kunye ne-ultra-thin copper foil eqhotyoshelwe kumthwali.
Ukongeza kwiifoyile zobhedu ezincinci, imigca emihle yangoku ifuna uburhalarhume obuphantsi kumphezulu wephepha lobhedu.Ngokuqhelekileyo, ukwenzela ukuba kuphuculwe amandla okudibanisa phakathi kwe-foil yobhedu kunye ne-substrate kunye nokuqinisekisa amandla okuqhuba umqhubi, i-foil layer ye-copper iyaqina.Uburhabaxa befoyile yobhedu eqhelekileyo bukhulu kuno-5μm.Ukufakela iincopho ezirhabaxa zefoyile yobhedu kwi-substrate iphucula ukuxhathisa ukuxobula, kodwa ukuze kulawulwe ukuchaneka kocingo ngexesha lokukrola umgca, kulula ukuba iincopho zokubethelela i-substrate eseleyo, ibangele iisekethe ezimfutshane phakathi kwemigca okanye ukuncipha kokugquma. , ebaluleke kakhulu kwimigca emihle.Umgca unzima ngakumbi.Ke ngoko, iifoyile zobhedu ezinoburhabaxa obuphantsi (ngaphantsi kwe-3 μm) kunye noburhabaxa obuphantsi (1.5 μm) ziyafuneka.
1.2 Imfuno ye-laminated dielectric sheets
Isici sobugcisa sebhodi ye-HDI kukuba inkqubo yokwakha (BuildingUpProcess), i-foil ye-resin-coated copper foil (RCC), okanye i-laminated layer ye-semi-cured epoxy glass cloth kunye ne-foil yobhedu kunzima ukufezekisa imigca emihle.Okwangoku, indlela ye-semi-additive (SAP) okanye indlela ephuculweyo ye-semi-processed (MSAP) ithandwa ukuba yamkelwe, oko kukuthi, ifilimu ye-dielectric insulating isetyenziselwa ukupakisha, kwaye emva koko i-electroless copper plating isetyenziselwa ukwenza ubhedu. umaleko womqhubi.Ngenxa yokuba umaleko wobhedu ubhityile kakhulu, kulula ukwenza imigca ecolekileyo.
Enye yeengongoma eziphambili zendlela ye-semi-additive yi-laminated dielectric material.Ukuze kuhlangatyezwane neemfuno zemigca emihle yoxinaniso oluphezulu, i-laminated material ibeka phambili iimfuno zeempawu zombane ze-dielectric, i-insulation, ukumelana nobushushu, amandla okudibanisa, njl., kunye nokuguquguquka kwenkqubo yebhodi ye-HDI.Okwangoku, i-HDI yamazwe ngamazwe imathiriyeli yeendaba ezilaminethiweyo ziyimveliso ye-ABF / GX yochungechunge lwaseJapan Ajinomoto Inkampani, esebenzisa i-epoxy resin kunye neearhente ezahlukeneyo zokunyanga ukongeza umgubo we-inorganic ukuphucula ukuqina kwezinto kunye nokunciphisa i-CTE, kunye nelaphu le-fiber yeglasi. Ikwasetyenziselwa ukunyusa ukuqina..Kukwakho nemathiriyeli yefilimu ebhityileyo efanayo yeSekisui Chemical Company yaseJapan, kunye neTaiwan Industrial Technology Research Institute nayo iphuhlise izinto ezinjalo.Iimathiriyeli ze-ABF nazo ziphuculwa ngokuqhubekayo kwaye ziphuhliswa.Isizukulwana esitsha semathiriyeli elaminethiweyo sifuna ngokukodwa uburhabaxa obuphantsi bomgangatho, ukwanda kwe-thermal ephantsi, ilahleko yedielectric ephantsi, kunye nokomelezwa okuqinileyo.
Kwipakethe ye-semiconductor yehlabathi, i-IC yokupakisha i-substrates ithathe indawo ye-ceramic substrates kunye ne-organic substrates.I-pitch ye-flip chip (FC) yokupakisha substrates iya isiba ncinci ngokuncinci.Ngoku ububanzi bomgca oqhelekileyo/isithuba somgca yi-15μm, kwaye iya kuba ncinane kwixesha elizayo.Ukusebenza kwe-multi-layer carrier idinga ubukhulu becala iipropati ze-dielectric eziphantsi, i-coefficient ephantsi yokwandiswa kwe-thermal kunye nokumelana nokushisa okuphezulu, kunye nokuphishekela i-substrates yexabiso eliphantsi ngesiseko seenjongo zokusebenza kweentlanganiso.Okwangoku, ukuveliswa kobuninzi beesekethe ezilungileyo ngokusisiseko kwamkela inkqubo ye-MSPA yokufakwa kwe-laminated kunye ne-foil yobhedu ebhityileyo.Sebenzisa indlela ye-SAP ukuvelisa iipateni zesekethe kunye ne-L / S ngaphantsi kwe-10μm.
Xa iiPCBs ziba ngqingqwa kwaye zibhityile, ubuchwepheshe bebhodi ye-HDI iye yavela kwi-laminates equlathe undoqo ukuya kwi-coreless Anylayer interconnection laminates (Anylayer).Naluphi na uqhagamshelo loqhagamshelo iibhodi ze-laminate ze-HDI ezinomsebenzi ofanayo zingcono kuneebhodi ze-HDI eziqulathe ezingundoqo.Ummandla kunye nobukhulu bunokuncitshiswa malunga ne-25%.Ezi kufuneka zisebenzise i-thinner kwaye zigcine iimpawu zombane ezilungileyo ze-dielectric layer.
2 I-frequency ephezulu kunye nemfuno yesantya esiphezulu
Itekhnoloji yonxibelelwano lwe-elektroniki iqala ukusuka kwingcingo ukuya kwi-wireless, ukusuka kwi-frequency ephantsi kunye nesantya esisezantsi ukuya kwisantya esiphezulu kunye nesantya esiphezulu.Ukusebenza kwefowuni yeselula yangoku ingene kwi-4G kwaye iya kufikelela kwi-5G, oko kukuthi, isantya sokuhambisa ngokukhawuleza kunye nomthamo omkhulu wokuhambisa.Ukufika kwexesha le-computing yefu yehlabathi liye laphindaphinda kabini ukuthuthwa kwedatha, kwaye izixhobo zokunxibelelana eziphezulu kunye nesantya esiphezulu yinto engenakuphepheka.I-PCB ifanelekile kwi-high-frequency kunye ne-high-speed transmission.Ukongeza ekunciphiseni ukuphazamiseka komqondiso kunye nokulahlekelwa kuyilo lwesekethe, ukugcina ingqibelelo yesignali, kunye nokugcina ukuveliswa kwe-PCB ukuhlangabezana neemfuno zoyilo, kubalulekile ukuba ne-substrate ephezulu yokusebenza.
Ukuze kulungiswe ingxaki ye-PCB yokwandisa isantya kunye nokuthembeka komqondiso, iinjineli zokuyila zijolise ikakhulu kwiipropati zokulahleka kombane.Izinto eziphambili zokukhethwa kwe-substrate yi-dielectric constant (Dk) kunye ne-dielectric loss (Df).Xa uDkt ephantsi kune-4 kunye ne-Df0.010, i-Df / Df laminate ephakathi, kwaye xa uDkt ephantsi kune-3.7 kwaye i-Df0.005 iphantsi, iphantsi kwe-Df / Df grade laminates, ngoku kukho iintlobo ezahlukeneyo ze-substrates. ukungena kwimarike ukukhetha kuyo.
Okwangoku, ezona zixhobo zisetyenziswa ngokuqhelekileyo kwibhodi yesekethe ye-high-frequency substrates ziyi-resins ezisekelwe kwi-fluorine, i-polyphenylene ether (i-PPO okanye i-PPE) i-resins kunye ne-epoxy epoxy resins.I-fluorine-based dielectric substrates, ezifana ne-polytetrafluoroethylene (PTFE), zineepropati ze-dielectric ezisezantsi kwaye zidla ngokusetyenziswa ngaphezu kwe-5 GHz.Kukwakho ne-epoxy elungisiweyo FR-4 okanye i-PPO substrates.
Ukongeza kwi-resin ekhankanywe ngasentla kunye nezinye izinto ezikhuselayo, i-roughness surface (iprofayili) yobhedu lwe-conductor nayo yinto ebalulekileyo echaphazela ukulahleka kokudluliselwa kwesignali, echaphazelekayo yimpembelelo yesikhumba (SkinEffect).Umphumo wesikhumba yi-electromagnetic induction eyenziwa kwi-wire ngexesha lokudluliselwa kwesignali ye-high-frequency, kunye ne-inductance inkulu kumbindi wecandelo locingo, ukwenzela ukuba i-current okanye isignali ithande ukugxila kumphezulu wocingo.Ubunzima bomphezulu we-conductor buchaphazela ukulahlekelwa kwesignali yokudlulisa, kwaye ukulahleka kwendawo epholileyo kuncinci.
Ngexesha elifanayo, ubukhulu boburhabaxa bomphezulu wobhedu, ngakumbi ukulahleka komqondiso.Ngoko ke, kwimveliso yokwenene, sizama ukulawula uburhabaxa bobunzima bobhedu obuphezulu kangangoko kunokwenzeka.Uburhabaxa buncinci kangangoko ngaphandle kokuchaphazela amandla okudibanisa.Ngokukodwa kwiisignali ezikuluhlu olungaphezulu kwe-10 GHz.Kwi-10GHz, uburhabaxa befoyile yobhedu kufuneka bube ngaphantsi kwe-1μm, kwaye kungcono ukusebenzisa i-super-planar copper foil (uburhabaxa bobuso 0.04μm).Uburhabaxa bomphezulu wefoyile yethusi kufuneka zidityaniswe nonyango olufanelekileyo lwe-oxidation kunye ne-bonding resin system.Kwixesha elizayo elingekude, kuya kubakho i-resin-coated copper foil ephantse ingabikho nkcazo, enokuba namandla aphezulu e-peel kwaye ayiyi kuchaphazela ukulahleka kwe-dielectric.