Iimpawu ezisisiseko zeBhodi yeSiphaluka eziprintiweyo zixhomekeke kwintsebenzo yeBhodi yeBhodi. Ukuphucula ukusebenza kobugcisa beBhodi yeSiphako eprintiweyo, ukwenziwa kwebhodi eprintiweyo yesekethe kufuneka kuphuculwe kuqala. Ukwenzela ukuhlangabezana neemfuno zophuhliso lwebhodi yesekethe eprintiweyo, izinto ezintsha ezazisenziwa ngokuthe ngcembe zaza zasetyenziswa.
Kwiminyaka yakutshanje, imakethi ye-PCB isuse kugxilwe kuyo kwiikhompyuter kunxibelelwano, kubandakanya nezikhululo ezisisiseko, iiseva, kunye ne-terminals. Izixhobo zonxibelelwano ezizimeleyo ezimelwe zii-smartphones ziqhube kwi-PCBS ukuya kwixilongo eliphezulu, elincinci, kunye nokusebenza okuphezulu. Itekhnoloji yesekethe eprintiweyo ayifani kwizinto ezinkulu, ezikwabandakanya iimfuno zobugcisa zePCB. Umxholo ofanelekileyo wezinto ezithathiweyo ngoku ulungelelaniswe kwinqaku elikhethekileyo lesalathiso seshishini.
1 Ibango lokuxinana okuphezulu kunye nomgca ohle
1.1 Ibango le-foil ye-callper
I-PCBS ikhulisa bonke i-denstanes ephezulu kunye nophuhliso oluncinci, kunye neebhodi ze-HDI zibalasele kakhulu. Kwiminyaka elishumi eyadlulayo, i-IPC ichaze ibhodi ye-HDI njengobubanzi bomgca / i-spacling yelayini (l / s) ye-0.1mm / 0.1mm kwaye ngezantsi. Ngoku i-shishini ngokusisiseko ifumana isifundo esiqhelekileyo se-L / s ye-60μm, kunye ne-l / s ephezulu ye-40μm. Inguqulelo ye-Japan yowama-2013 yeDatha yeTekhnoloji yeTekhnoloji yeXesha leTekhnoloji yile nto ngo-2014, eyona nto iqhelekileyo yeBhodi ye-HDI yayiyi-50, i-LAPSPR, i-LODSPRE i-L / s eveliswayo yayiyi-20μm.
I-PCB yesekethe yepatheni, inkqubo yokuthabatha i-ecaltical scocial (indlela yokuthambisa) emva kokufaka i-foil yobhedu, umda omncinci wendlela yokwenza imigca imalunga ne-40μm, kunye ne-tricper call (9 ~ 12μm). Ngenxa yexabiso eliphezulu le-Cloper Calper Fiel ye-CCL kunye neziphene ezininzi kwi-Criel ye-Chicird Copper Foil, iifektri ezininzi zivelisa i-18μm i-14μm i-whoil ye-14μ kwaye isebenzisa i-etching ukunciphisa umda wobhedu ngexesha lemveliso. Le ndlela ineenkqubo ezininzi, ukulawulwa kobunzima obunzima, kunye neendleko eziphezulu. Kungcono ukusebenzisa i-foil encinci yobhedu. Ukongeza, xa isekefiki ye-PCB L / S ingaphantsi kwe-20μm, i-foil yobhedu inzima ngokubanzi inzima ukuphatha. Ifuna i-ultra-fiel yobhedu
Ukongeza kwiifoldi zobhedu, imigca emnandi yangoku ifuna uburharha obuphantsi kumphezulu we-foil yobhedu. Ngokubanzi, ukuze kuphuculwe amandla aphezulu phakathi kwe-foil yobhedu kunye nokuqinisekisa ukuba umqhubi wesifundo atyhalela amandla, i-foil ye-foil ichithelwe. Uburhala obuqhelekileyo bobhedu oluqhelekileyo bungaphezulu kwe-5μm. Ukuxhonywa kweencopho ezimbi ze-foliper ze-foil kwi-disperintic kuphucula ukunyangwa, kodwa ukuze kulawulwe ukuchaneka kwe-wire ngexesha lokusebenza, kulula ukumiswa kwemigca okanye kunciphise kakhulu kwimigca emihle. Umgca uthatha kakhulu. Ke ngoko, i-copper foils enobukrakra obuphantsi (ngaphantsi kwe-3 μm) kunye nokuthe tyaba (1.5 μm) ziyafuneka.
1.2 Ibango lamaphepha aMnyama
Inqaku lobugcisa lebhodi ye-HDI yile nkqubo yokwakha (i-yelupProccess), i-resin ye-resin esetyenziswayo (i-RCC esetyenziswayo), okanye i-racc), okanye i-rate ye-gesi ekhuselekileyo ye-Epoxy. Okwangoku, indlela ye-soriticarication (i-SAP) okanye indlela ephuculweyo yendlela (i-imp) idla ngokuthathwa, oko kukuthi, ifilimu yokuthambisa ifilimu isetyenziselwa ukwenza ulawulo lonxibelelwano loncwadi. Kuba i-copper yobhedu icekeceke kakhulu, kulula ukwenza imigca emihle.
Elinye lawona manqaku aphambili kwindlela yophawu ye-seminarive yindawo enesidima se-diadric. Ukwenzela ukuhlangabezana neemfuno zemigca emihle yemigca emihle, i-laminad ibeka phambili iimfuno zepropathi yombane, i-insumpase, ukumelana nobushushu, ukunyanzelwa kobushushu, kunye nenkqubo yokuziqhelanisa nebhodi ye-HDI. Okwangoku, izixhobo zemithombo yeendaba ze-HDI yehlabathi ze-HDI ziimveliso ze-ABF / GX / i-GX / esebenzisa i-epoxy i-evinoto ye-e-i-Inhloring ye-Inorganic yokuphucula i-rigidic ye-Inorganic yokuphucula i-rigidity isetyenziselwa ukwandisa ubungqola. . Kukho izinto ezifanayo zefilimu zefilimu yenkampani ye-sekisui ye-Sekisui yaseSekisui yase-Japan, kunye neTeawan Wemiveli yeTekhnoloji yeTekhnoloji ikwaphuhlise izinto ezinjalo. Izinto ze-ABF zikwaphuculwe ngokuqhubekayo kwaye zaphuhliswa. Esi sizukulwana esitsha sezinto ezidakumbileyo sifuna ukrwada komhlaba ophantsi, ukwanda komhlaba okuphantsi, ilahleko ye-dislectric ephantsi, kunye nokomeleza okuqinileyo.
Kwiphakheji ye-semiconductor yehlabathi, ukupakisha imihlaba ekutshintshwe i-ceramic subretes namanye amaphetha. I-pitch ye-flip ye-chip ye-chip (FC) i-factolings iya kuhlala incinci kwaye incinci. Ngoku ububanzi bomgangatho oqhelekileyo / ububanzi bendawo yi-15μm, kwaye iya kuba mncinci kwixesha elizayo. Ukusebenza kwesiqu somthi wobuninzi ikakhulu kufuna iipropathi ze-diectric eziphantsi, ukwandiswa kwe-thermsal ephantsi kunye nokuchasana nobushushu, kunye nokufuna amagqabantshintshi aphantsi kwenjongo yokusebenza. Okwangoku, ukuveliswa kwesininzi sesekethe esihlekisayo ngokusisiseko yamkisa inkqubo ye-MSP ye-ispage ye-insulimer kunye ne-foil yobhedu. Sebenzisa indlela ye-SAP yokwenza iipateni zesekethe nge-l / s ngaphantsi kwe-10μm.
Xa i-PCBS iba yi-denser kunye ne-titner, iTekhnoloji yeBhodi ye-HDI ivele kwi-core-enemiphetha ye-Oreal Andlayer I-Adlayer Guqula lalela (nayeyer). Nakuphi na ukunxibelelana kwe-cuntrate ye-HDI yebhodi ye-HDI kunye nomsebenzi ofanayo kungcono kune-core-iqulathe iibhodi ze-HDI. Indawo kunye nobunzima bunokuncitshiswa malunga ne-25%. Ezi kufuneka zisebenzise kancinci kwaye zigcine iipropathi zombane ezifanelekileyo zomaleko weDiecric.
I-2 i-frequency kunye ne-Dead Sead Sead
Itekhnoloji yoNxibelelwano lwe-elektroniki ukusuka kwi-Wired ukuya kwi-Wireless, ukusuka kwi-frequency ephantsi kunye nesantya esisezantsi ukuya kwi-Right ephezulu kunye nesantya esiphezulu. Intsebenzo yefowuni yangoku ye-4G kwaye iya kuhamba ukuya kwi-5g, oko kukuthi, isantya esikhawulezayo sokuhambisa kunye nokuhambisa okukhulu. Ukufika kwexesha le-Computer yeHlabathi yeLifu liphindwe kabini kwitrafikhi yedatha, kunye nokuhamba ngokukhululekileyo kunye nezixhobo zonxibelelwano ezihamba ngesantya esiphezulu yindlela engenakuphikiswa. I-PCB ilungele ukubuyela ngaphakathi kunye nokuhambisa ngesantya esiphezulu. Ukongeza kokunciphisa ukuphazamiseka komqondiso kunye nelahleko kuyilo lwesekethe, ukugcina ingqibelelo yomqondiso, kunye nokugcina ukuvelisa i-PCB ukufumana iimfuno zoyilo, kubalulekile ukuba ube nomgangatho wokusebenza okuphezulu.
Ukulungiselela ukusombulula ingxaki ye-PCB yonyusa isantya kunye nokunyaniseka komqondiso, iinjineli zoyilo ikakhulu zigxile kwiipropathi zelahleko yombane. Izinto eziphambili zokukhethwa kwethanga lelona xesha lesidlo sasemini ihleli (DK) kunye nelahleko yediliya (DF). Xa i-DK ingaphantsi kwe-4 kunye ne-DF0.010, yi-DK / DF i-DK / DK iphantsi kwe-3.7 ne-DF0.005 i-DF0.005 i-DF / i-DF0.005 ye-DF / i-DF0.005 ye-DF / i-DFITE ye-DFE / i-DFE ye-DFE / i-DFITE ye-DF / i-DFE ye-DFE / i-DFE ye-DFE / i-DFE ye-DFE / i-DFE ye-DFE / i-DFITE ye-DF / DF i-DF / i-DFE ye-DFE / i-DFITE ingena kwimakethi yokufaka imakethi.
Okwangoku, eyona isetyenziswa rhoqo kwiBhodi yeSekethe ePhezulu kakhulu ikakhulu ikakhulu ziintsholongwane ngokusekwe kwi-sloorine, ipolyphenyne ether (i-PPO okanye i-PPO okanye i-PPE. Fluorine-based dielectric substrates, such as polytetrafluoroethylene (PTFE), have the lowest dielectric properties and are usually used above 5 GHz. Kukho i-Epoxy e-Epoxy Fr-4 okanye i-PPO.
Ukongeza kule resin ekhankanywe apha ngasentla kunye nezinye izinto zokuthambisa, ukuqina komhlaba Isiphumo solusu kukungeniswa kwe-elektromagnetic eveliswe kwi-wire ngexesha losulelo oluhamba ngesiginali, kwaye i-Indestition inkulu embindini wecandelo lecingo, ukuze i-wine okanye umqondiso wangoku okanye umqondiso udla ngokugxila kumphezulu wecingo. Ubungqingqwa bomqhubi buchaphazela ukuphulukana nomqondiso wothumelo, kwaye ilahleko yomhlaba egudileyo incinci.
Kwindlela efanayo, kokukhona ubukhulu bomgangatho wobhedu, kokukhona ilahleko yomqondiso. Ke ngoko, kwimveliso yokwenyani, sizama ukulawula uburhalarhume obukhulu bobhedu olunokwenzeka. Ubunzima buncinci kangangoko kunokwenzeka ngaphandle kokuchaphazela amandla aphezulu. Ngakumbi imiqondiso kuluhlu olungaphezulu kwe-10 GHz. Kwi-10gz, i-foil ye-foil iquka kufuneka ingabi ngaphantsi kwe-1μm, kwaye kungcono ukusebenzisa i-fort-raticreper ye-test-racer transiler Ubungqingqwa bobhedu lwe-foil yobhedu kufuneka budibane nonyango olufanelekileyo lwe-oxidation kunye nenkqubo yokuqalisa i-resin. Kwixesha elizayo, kuya kubakho i-resin-coperding yobhedu ephithizelwe i-foil engahambelani nolwandlalo, olunokuba namandla aphezulu e-Peel kwaye aluyi kuchaphazela ilahleko ye-diecric.