Kwinkqubo yophuhliso lweemveliso zombane zanamhlanje, umgangatho weebhodi zeesekethe zichaphazela ngokuthe ngqo ukusebenza kunye nokuthembeka kwezixhobo zombane.Ukuze kuqinisekiswe umgangatho weemveliso, iinkampani ezininzi zikhetha ukwenza uvavanyo lwesiko lweebhodi zePCB.Eli khonkco libaluleke kakhulu kuphuhliso lwemveliso kunye nemveliso.Ke, yintoni kanye kanye equkwa yinkonzo yokuqinisekisa ibhodi yePCB?
ukusayina kunye neenkonzo zokubonisana
1. Uhlalutyo lwemfuno: Abavelisi be-PCB kufuneka babe nonxibelelwano olunzulu kunye nabathengi ukuze baqonde iimfuno zabo ezithile, kubandakanywa nemisebenzi yesekethe, imilinganiselo, izinto, kunye neemeko zesicelo.Kuphela ngokuziqonda ngokupheleleyo iimfuno zabathengi sinokubonelela ngezisombululo ezifanelekileyo zePCB.
2. Uphononongo lwe-Design for manufacturability (DFM): Emva kokuba uyilo lwe-PCB lugqityiwe, uphononongo lwe-DFM luyafuneka ukuze kuqinisekiswe ukuba isisombululo soyilo sinokwenzeka kwinkqubo yokwenziwa koqobo kunye nokuphepha iingxaki zokuvelisa ezibangelwa ziziphene zoyilo.
Ukukhethwa kwezinto kunye nokulungiselela
1. Izinto eziphathekayo ze-substrate: Izinto eziqhelekileyo ze-substrate zibandakanya i-FR4, i-CEM-1, i-CEM-3, imathiriyeli ye-high-frequency, njl. Ukukhethwa kwezinto ze-substrate kufuneka kusekelwe kwi-frequency yokusebenza kwesekethe, iimfuno zokusingqongileyo, kunye nokuqwalaselwa kweendleko.
2. Izinto zokuqhuba: Izinto ezisetyenziswa ngokuqhelekileyo zibandakanya i-copper foil, edla ngokuhlulahlula ibe yi-electrolytic copper kunye nobhedu oluqengqelekayo.Ubuninzi be-foil yethusi ngokuqhelekileyo buphakathi kwe-microns eyi-18 kunye ne-105 microns, kwaye ikhethwe ngokusekelwe kumthamo okhoyo wokuthwala umgca.
3. Iipads kunye ne-plating: Iipads kunye neendlela zokuqhuba ze-PCB zihlala zifuna unyango olukhethekileyo, olufana ne-tin plating, igolide yokucwiliswa, i-electroless nickel plating, njl., ukuphucula ukusebenza kwe-welding kunye nokuqina kwe-PCB.
Iteknoloji yokuvelisa kunye nolawulo lwenkqubo
1. Ukuvezwa kunye nophuhliso: Umzobo wesekethe owenziweyo udluliselwa kwibhodi ye-copper-clad ngokusebenzisa i-exposure, kwaye iphethini yesekethe ecacileyo yenziwa emva kokuphuhliswa.
2. I-Etching: Inxalenye yefoyile yobhedu engagqunywanga yi-photoresist isuswa nge-chemical etching, kwaye isekethe eyenziwe ngefoyile yethusi igcinwe.
3. Ukugrumba: Gqoka imingxunya eyahlukeneyo kunye nemingxuma yokuxhoma kwi-PCB ngokweemfuno zoyilo.Indawo kunye nobubanzi bale mingxuma kufuneka ichaneke kakhulu.
4. I-Electroplating: I-Electroplating yenziwa kwimingxuma egrunjiweyo nakwimizila yomhlaba ukunyusa i-conductivity kunye nokumelana nokubola.
5. Umaleko wokuxhathisa i-solder: Faka isicelo se-inki ye-solder yokuxhathisa kwi-PCB ebusweni ukukhusela i-solder paste ukuba isasazeke kwiindawo ezingenayo i-soldering ngexesha lenkqubo ye-soldering kunye nokuphucula umgangatho we-welding.
6. Ukuprintwa kwesikrini sesilika: Ulwazi lomlinganiswa wesikrini sesilika, kubandakanywa iindawo ezikuyo kunye neelebhile, ziprintwa kumphezulu we-PCB ukuququzelela ukudibanisa nokugcinwa okulandelayo.
ukuhlaba kunye nokulawula umgangatho
1. Uvavanyo lwentsebenzo yombane: Sebenzisa izixhobo zokuvavanya ubuchwephesha ukujonga ukusebenza kombane wePCB ukuqinisekisa ukuba umgca ngamnye uqhagamshelwe ngokuqhelekileyo kwaye akukho zijikelezo ezimfutshane, iisekethe ezivulekileyo, njl.
2. Uvavanyo olusebenzayo: Yenza uvavanyo olusebenzayo olusekelwe kwimiba yokwenyani yesicelo ukuqinisekisa ukuba i-PCB inokufikelela kwiimfuno zoyilo.
3. Uvavanyo lokusingqongileyo: Vavanya i-PCB kwiindawo ezigqithisileyo ezifana nobushushu obuphezulu kunye nomswakama ophezulu ukujonga ukuthembeka kwayo kwiindawo ezinzima.
4. Ukuhlolwa kwembonakalo: Ngokusebenzisa i-manual okanye i-automatic optical inspection (AOI), khangela ukuba kukho iziphene kwi-PCB surface, njengokuqhawula umgca, ukuphambuka kwendawo ye-hole, njl.
Imveliso yovavanyo lwebhetshi encinci kunye nempendulo
1. Ukuveliswa kwebhetshi encinci: Ukuvelisa inani elithile le-PCB ngokweemfuno zabathengi zokuvavanya ngakumbi kunye nokuqinisekiswa.
2. Uhlalutyo lweengxelo: Iingxaki zeengxelo ezifunyenwe ngexesha lokuveliswa kovavanyo lwebhetshi encinci kuyilo kunye neqela lokuvelisa ukwenza ukulungiswa okuyimfuneko kunye nokuphuculwa.
3. Ukulungiswa kunye nokulungelelaniswa: Ngokusekelwe kwingxelo yokuveliswa kovavanyo, isicwangciso soyilo kunye nenkqubo yokuvelisa iyalungiswa ukuze kuqinisekiswe umgangatho wemveliso kunye nokuthembeka.
Ibhodi yePCB inkonzo yokuqinisekisa isiko yiprojekthi ecwangcisiweyo egubungela i-DFM, ukhetho lwempahla, inkqubo yokuvelisa, uvavanyo, imveliso yovavanyo kunye nenkonzo yokuthengisa emva kokuthengisa.Akuyona nje inkqubo elula yokuvelisa, kodwa kunye nesiqinisekiso esipheleleyo somgangatho wemveliso.
Ngokusebenzisa ngokufanelekileyo ezi nkonzo, iinkampani zinokuphucula ngokufanelekileyo ukusebenza kwemveliso kunye nokuthembeka, ukunciphisa umjikelo wophando kunye nophuhliso, kunye nokuphucula ukukhuphisana kwemarike.