I-Multilayer PCB yebhodi yesekethe yovavanyo lwesakhiwo se-multilayer kunye nohlalutyo

Kwishishini lombane, iibhodi zesekethe zePCB ezinamanqwanqwa amaninzi ziye zaba yinxalenye engundoqo yezixhobo ezininzi zombane ezikumgangatho ophezulu ezinezakhiwo ezidityanisiweyo nezintsonkothileyo. Nangona kunjalo, ulwakhiwo lwayo olunemigangatho emininzi luzisa uluhlu lwemingeni yovavanyo kunye nohlalutyo.

1. Iimpawu ze-multi-layer PCB ibhodi yesekethe isakhiwo
Iibhodi zesekethe ze-Multilayer PCB zidla ngokuqulunqwa ngamaleko atshintshayo atshintshayo kunye ne-insulating, kwaye izakhiwo zawo zintsonkothile kwaye zixinene. Esi sakhiwo sinemigangatho emininzi inezi mpawu zilandelayo:

Ukuhlanganiswa okuphezulu: Ukwazi ukudibanisa inani elikhulu lamacandelo e-elektroniki kunye neesekethe kwindawo elinganiselweyo ukuhlangabezana neemfuno zezixhobo ze-elektroniki zanamhlanje ze-miniaturization kunye nokusebenza okuphezulu.
Ukuhanjiswa kwesignali ezinzileyo: Ngokuqulunqwa kwe-wiring efanelekileyo, ukuphazamiseka kwesignali kunye nengxolo kunokuncitshiswa, kwaye umgangatho kunye nokuzinza kokuhanjiswa kwesignali kunokuphuculwa.
Ukusebenza kakuhle kokutshatyalaliswa kobushushu: Isakhiwo se-multi-layer sinokukhupha ngcono ukushisa, ukunciphisa ubushushu bokusebenza kwamacandelo e-elektroniki, kunye nokuphucula ukuthembeka kunye nobomi bezixhobo.

2. Ukubaluleka kovavanyo lwesakhiwo se-multi-layer yeebhodi zeesekethe ze-PCB ezininzi
Qinisekisa umgangatho wemveliso: Ngokuvavanya ulwakhiwo olunemigangatho emininzi yeebhodi zesekethe zePCB, iingxaki ezinobulunga obunokubakho, ezinje ngeesekethe ezimfutshane, iisekethe ezivulekileyo, ukudityaniswa komgangatho ophakathi, njl. njl., inokufunyanwa ngexesha, ngaloo ndlela iqinisekisa umgangatho wemveliso. kunye nokuthembeka.
Isisombululo soyilo oluphuculweyo: Iziphumo zovavanyo zinokubonelela ngengxelo yoyilo lwebhodi yesekethe, ukunceda abaqulunqi baphucule uyilo lwe-wiring, bakhethe izixhobo ezifanelekileyo kunye neenkqubo, kunye nokuphucula ukusebenza kwebhodi yesekethe kunye nokwenza.
Ukunciphisa iindleko zokuvelisa: Ukuvavanya okusebenzayo ngexesha lenkqubo yokuvelisa kunokunciphisa izinga le-scrap kunye nenani lokuphinda kusebenze, ukunciphisa iindleko zemveliso, kunye nokuphucula ukusebenza kakuhle kwemveliso.

3. Multi-layer PCB yesekethe ibhodi yesekethe multi- umaleko isakhiwo indlela yokuvavanya
Uvavanyo lokusebenza kombane
Uvavanyo oluqhubekayo: Jonga ukuqhubeka phakathi kwemigca eyahlukeneyo kwibhodi yesekethe ukuqinisekisa ukuba akukho zijikelezo ezimfutshane okanye iisekethe ezivulekileyo. Ungasebenzisa ii-multimeters, abavavanyi bokuqhubeka kunye nezinye izixhobo zokuvavanya.
Uvavanyo lokumelana ne-insulation: Ukulinganisa ukunyanzeliswa kwe-insulation phakathi kwemigangatho eyahlukeneyo kwibhodi yesiphaluka naphakathi komgca kunye nomhlaba ukugqiba ukuba ukusebenza kwe-insulation kulungile. Ngokuqhelekileyo kuvavanywa kusetyenziswa isixhobo sokuvavanya ukumelana nobushushu.
Uvavanyo lwengqibelelo yomqondiso: Ngokuvavanya izibonakaliso zesantya esiphezulu kwibhodi yesiphaluka, ukuhlalutya umgangatho wokuhambisa, ukubonakalisa, i-crosstalk kunye nezinye iiparitha zesiginali ukuqinisekisa ukunyaniseka komqondiso. Izixhobo ezifana ne-oscilloscopes kunye ne-analyzers yesignali zingasetyenziselwa uvavanyo.

Uvavanyo lwesakhiwo somzimba
Umlinganiselo wobukhulu be-Interlayer: Sebenzisa izixhobo ezinje ngesixhobo sokulinganisa ubukhulu ukulinganisa ubukhulu phakathi komaleko ngamnye webhodi yesekethe yePCB enemigangatho emininzi ukuqinisekisa ukuba iyahlangabezana neemfuno zoyilo.
Umlinganiselo wedayamitha yomngxuma: Khangela i-diameter yokomba kunye nokuchaneka kwendawo kwibhodi yesekethe ukuze uqinisekise ukufakela okuthembekileyo kunye nokudibanisa kwamacandelo e-elektroniki. Oku kunokuvavanywa kusetyenziswa i-boremeter.
Uvavanyo lomgangatho othe tyaba: Sebenzisa isixhobo sokulinganisa umcaba kunye nezinye izixhobo zokubona ukuthambeka komphezulu webhodi yesekethe ukunqanda umphezulu ongalinganiyo ekuchaphazeleni ukuwelda kunye nokufakwa komgangatho wamacandelo e-elektroniki.

Uvavanyo lokuthembeka
Uvavanyo lokutshitshiswa kwe-Thermal: Ibhodi yesekethe ibekwe kwiindawo eziphezulu kunye neziphantsi zeqondo lokushisa kwaye ijikelezwe ngenye indlela, kwaye ukusebenza kwayo utshintsho ngexesha lokutshintsha kweqondo lokushisa kuyajongwa ukuvavanya ukuthembeka kwayo kunye nokumelana nobushushu.
Uvavanyo lokungcangcazela: Ukuqhuba uvavanyo lokungcangcazela kwibhodi yesekethe ukulinganisa iimeko zokungcangcazela kwindawo yokusetyenziswa kwangempela kwaye ujonge ukuthembeka kwayo koqhagamshelo kunye nokuzinza kokusebenza phantsi kweemeko zokungcangcazela.
Uvavanyo lweflash eshushu: Beka ibhodi yesekethe kwindawo efumileyo nephezulu yobushushu ukuze uvavanye ukusebenza kwayo kokugquma kunye nokumelana nomhlwa kwindawo etshisayo.

4. Uhlalutyo lwesakhiwo se-multilayer PCB yebhodi yesekethe
Uhlalutyo lwemfezeko yomqondiso
Ngokuhlalutya iziphumo zovavanyo lwengqibelelo yomqondiso, sinokuqonda ukuhanjiswa komqondiso kwibhodi yesekethe, sifumane izizathu ezisisiseko zokubonakaliswa komqondiso, i-crosstalk kunye nezinye iingxaki, kwaye sithathe amanyathelo ahambelanayo okulungelelaniswa. Ngokomzekelo, unokulungelelanisa ukucwangciswa kwe-wiring, ukwandisa ukuchasana kokupheliswa, sebenzisa amanyathelo okukhusela, njl.njl. ukuphucula umgangatho kunye nokuzinza kwesignali.
uhlalutyo lwe-thermal
Ukusebenzisa isoftware yohlalutyo lwe-thermal ukuhlalutya ukusebenza kokutshatyalaliswa kobushushu beebhodi zesekethe ze-PCB ezininzi, unokumisela ukuhanjiswa kweendawo ezishushu kwibhodi yesekethe, ukwandisa uyilo lokutshatyalaliswa kobushushu, kunye nokuphucula ukuthembeka kunye nobomi bebhodi yesekethe. Ngokomzekelo, unokongeza i-heat sinks, ulungelelanise ukucwangciswa kwamacandelo e-elektroniki, ukhethe izinto eziphathekayo ezineempawu ezingcono zokutshatyalaliswa kobushushu, njl.
uhlalutyo lokuthembeka
Ngokusekelwe kwiziphumo zokuvavanya ukuthembeka, ukuthembeka kwebhodi yesekethe ye-PCB eninzi iyavavanywa, iindlela zokungaphumeleli ezinokubakho kunye namakhonkco abuthathaka achongiwe, kwaye kuthathwe amanyathelo okuphucula ahambelanayo. Ngokomzekelo, ukucwangciswa kwesakhiwo seebhodi zeesekethe kunokuqiniswa, umgangatho kunye nokuxhatshazwa kwe-corrosion of material kunokuphuculwa, kwaye inkqubo yokuvelisa inokuphuculwa.

Uvavanyo lwesakhiwo se-multi-layer kunye nohlalutyo lweebhodi zeesekethe ze-PCB ezininzi linyathelo elibalulekileyo ekuqinisekiseni umgangatho kunye nokuthembeka kwezixhobo zombane. Ngokusebenzisa iindlela zokuvavanya ezisebenzayo kunye neendlela zokuhlalutya, iingxaki ezivela ngexesha loyilo, ukuveliswa kunye nokusetyenziswa kweebhodi zeesekethe zinokufunyanwa kwaye zisonjululwe ngexesha elifanelekileyo, ukuphucula ukusebenza kunye nokuveliswa kweebhodi zeesekethe, ukunciphisa iindleko zemveliso, kunye nokubonelela ngenkxaso enamandla uphuhliso lweshishini lombane. inkxaso.