Ngophuhliso olukhawulezayo lweemveliso zombane ukuya ekukhanyeni, ezibhityileyo, ezincinci, ezinoxinano oluphezulu, olusebenzayo kunye nobuchwephesha bokudityaniswa kwe-microelectronic, umthamo wamacandelo e-elektroniki kunye neebhodi zesekethe eziprintiweyo nazo ziyancipha ngokukhawuleza, kwaye ukuxinana kwendibano kuyanda. ukuziqhelanisa nale ntsingiselo yophuhliso, abanduleli baphuhlise iteknoloji iplagi PCB, eyandisa ngempumelelo indibano PCB ingxinano, yanciphisa umthamo imveliso, yaphucula uzinzo kunye nokuthembeka iimveliso PCB ezizodwa, nokukhuthaza uphuhliso lwemveliso PCB.

Kukho ubukhulu becala iintlobo ezintathu zeteknoloji yeplagi yesiseko sentsimbi: umngxuma ocinezelayo we-semi-solidified sheet; Umngxuma weplagi womatshini wokushicilela wesikrini; Vacuum iplagi umngxuma.

1.semi-solidified sheet umngxuma ocinezelayo

Kukusebenzisa iphepha lokunyanga i-semi-curing kunye nomxholo ophezulu weglue.

Ngokusebenzisa i-vacuum eshushu eshushu, i-resin kwiphepha le-semi-curing igcwaliswa kumngxuma odinga iplagi, ngelixa indawo engayifuni iplagi yeplagi ikhuselwe yimpahla yokukhusela.Emva kokucinezela, krazula izinto ezikhuselayo, usike off the overflow glue, oko kukuthi ukufumana ipleyiti umngxuma plug imveliso egqityiweyo.

1). izinto ezifunekayo kunye nezixhobo zezixhobo: ishidi elihlanjululweyo elinomxholo ophezulu weglue, izinto zokukhusela (i-aluminium foil, i-foil yobhedu, ifilimu yokukhulula, njl.), i-foil yobhedu, ifilimu yokukhulula

2). Izixhobo: Umatshini wokugaya i-CNC, umgca we-metal substrate wonyango, umatshini we-riveting, i-vacuum eshushu, umatshini wokugaya ibhanti.

3). Inkqubo yetekhnoloji: i-substrate yentsimbi, ukusika imathiriyeli ekhuselayo → i-substrate yentsimbi, ukugrumba imathiriyeli → i-substrate yentsimbi yonyango → i-rivet → i-laminate → i-vacuum eshushu → ukukrazula imathiriyeli ekhuselayo → sika iglu ngokugqithisileyo

2.Isikrini somngxuma weplagi womatshini wokushicilela

ibhekisa kumatshini woshicilelo oqhelekileyo wescreen seplagi umngxuma resin emngxunyeni kwi substrate yesinyithi, kwaye ke curing.Emva kokunyanga, unqumle iglu ephuphumayo, oko kukuthi, ipleyiti yomngxuma weplagi egqityiweyo. ipleyiti inkulu ngokwentelekiso (ububanzi be-1.5mm okanye ngaphezulu), i-resin iya kulahleka ngexesha lomngxuma weplagi okanye inkqubo yokubhaka, ngoko ke kuyimfuneko ukuncamathela umaleko wefilimu ekhuselayo yobushushu obuphezulu kwicala elingasemva ukuxhasa i-resin, kunye ne-drill. inani leendawo zokungenisa umoya kwi-orifice indawo ukuququzelela ukuphuma komngxuma weplagi.

1) . izinto ezifunekayo kunye nezixhobo zezixhobo: i-plug resin, ifilimu ekhuselayo yobushushu obuphezulu, i-air cushion plate.

2) izixhobo: Umatshini wokugaya i-CNC, umgca we-metal substrate wonyango, umatshini wokushicilela isikrini, i-oven yomoya oshushu, umatshini wokugaya ibhanti.

3) inkqubo yetekhnoloji: i-substrate yentsimbi, i-aluminiyam sheet ukusika → i-substrate ye-aluminium, i-aluminium sheeting → unyango lwe-metal substrate surface → ifilimu ekhuselayo yobushushu obuphezulu → ukomba ipleyiti yombhobho → umngxuma weplagi yomatshini wokushicilela → ukubhaka ukunyanga → krazula ifilimu ekhuselayo yobushushu obuphezulu → sika iglu ngokugqithisileyo.

3.Umngxuma wokuvala iplagi

ibhekisa kusetyenziso lomatshini wokuvala umngxuma weplagi kwindawo yokufunxa iplagi yomngxuma intlaka emngxunyeni kwi substrate yesinyithi, uze ubhake i-curing.Emva kokunyanga, unqumle iglu ephuphumayo, oko kukuthi, ipleyiti yomngxuma weplagi egqityiweyo. ubukhulu obukhulu beplagi yeplagi yesiseko sentsimbi (ububanzi be-1.5mm okanye ngaphezulu), i-resin iya kulahleka ngexesha lomngxuma weplagi okanye inkqubo yokubhaka, ngoko ke umaleko wefilimu ekhuselayo yobushushu kufuneka uncanyathiselwe ngasemva ukuze uxhase. intlaka..

1). izinto ezifunekayo kunye nezixhobo zokusebenza: i-plug resin, ifilimu ekhuselayo yobushushu obuphezulu.

2). izixhobo: I-CNC drill, i-metal substrate surface yonyango umgca, umatshini we-vacuum plug, i-oven yomoya oshushu, i-grinder yebhanti.

3) . Inkqubo yobuchwepheshe: ukuvulwa kwe substrate yentsimbi → i substrate yentsimbi, ukugrumba i-aluminiyam sheet → i-metal substrate unyango → incamathelisa ifilimu ekhuselayo yobushushu obuphezulu → umngxuma weplagi weplagi yokucoca → ukubhaka kunye nokunyanga → ukukrazula ifilimu ekhuselayo yobushushu obuphezulu → sike iglue kakhulu.

I-Metal substrate ye-Metal iplagi engundoqo yomngxuma iteknoloji isiqingatha sokuphilisa ifilimu yokuzalisa imingxuma yokuzalisa uxinzelelo, umatshini wokushicilela wesilika-isikrini sokuvala umngxuma weplagi kunye nomatshini wokucoca, iteknoloji yeplagi nganye ineenzuzo zayo kunye nokungalungi kwayo, kufuneka ihambelane neemfuno zoyilo lwemveliso, iimfuno zeendleko. , iintlobo zezixhobo, ezifana nokuhlolwa okubanzi, okunokunyusa ukusebenza kwemveliso, ukuphucula umgangatho wemveliso, ukunciphisa iindleko zokuvelisa.