Makhe sijonge kuyilo ibhodi pcb kunye pcba
Ndiyakholelwa ukuba baninzi abantu abanjaloeqhelekileyongoyilo ibhodi pcb kwaye basenokuyiva rhoqo kubomi bemihla ngemihla, kodwa basenokungazi kakhulu malunga PCBA kwaye bade babhide ngayo neebhodi zesekethe eprintiweyo.Ke yintoni uyilo lwebhodi yepcb?I-PCBA iye yavela njani?Yahluke njani kwiPCBA?Makhe sihlolisise.
* Malunga noyilo lwebhodi yepcb*

Ngenxa yokuba yenziwe ngokushicilela nge-elektroniki, ibizwa ngokuba yibhodi yesekethe "eprintiweyo".Ibhodi pcb yinxalenye ebalulekileyo elektroniki kushishino elektroniki, inkxaso kumacandelo elektroniki, kunye nomphathiswa uqhagamshelo zombane amacandelo elektroniki.Iibhodi ze-PCB ziye zasetyenziswa ngokubanzi kwimveliso kunye nokuveliswa kweemveliso zombane.Iimpawu zayo ezizodwa zinokushwankathelwa ngolu hlobo lulandelayo:

1. Ubuninzi be-wiring, ubungakanani obuncinci kunye nobunzima bokukhanya buhambelana ne-miniaturization yezixhobo zombane.

2. Ngenxa yokuphindaphinda kunye nokuhambelana kwemizobo, iimpazamo ze-wiring kunye nendibano ziyancitshiswa, kwaye ixesha lokugcinwa kwezixhobo, ukulungiswa kunye nokuhlolwa kugcinwa.

3. Kuyinzuzo ukuvelisa oomatshini kunye nomatshini, ukuphucula imveliso yabasebenzi, kunye nokunciphisa iindleko zezixhobo zombane.

4. Uyilo lunokuthi lubekwe emgangathweni ukuze kube lula ukutshintshana.

*Malunga nePCBA*

I-PCBA sisishunqulelo sebhodi yesekethe eprintiweyo + indibano, oko kukuthi, i-PCBA yinkqubo yonke yokuncamathisela indawo ephezulu yebhodi yesekethe eprintiweyo kunye nokudipha.

QAPHELA: Ukunyuka komphezulu kunye ne-die mount zimbini iindlela zokudibanisa izixhobo kwibhodi yesekethe eprintiweyo.Umahluko omkhulu kukuba iteknoloji yokunyuka kwendawo ayifuni imingxuma yokubhoboza kwibhodi yesekethe eprintiweyo, izikhonkwane zecandelo kufuneka zifakwe kwimingxuma yokugaya ye-DIP.

Itekhnoloji ye-Surface Mount Technology (SMT) Itekhnoloji yokunyuswa komphezulu ikakhulu isebenzisa umatshini wokuchola kunye nokubeka ukubeka izinto ezincinci kwibhodi yesekethe eprintiweyo.Inkqubo yayo yokuvelisa ibandakanya ukubeka i-PCB, ukuprintwa kwe-solder paste, ukufakwa komatshini wokubeka, i-oven yokuphinda ikhuphe kunye nokuhlolwa kwemveliso.

Ii-DIP zii-“plug-ins”, okt ukufaka iinxalenye kwibhodi yesekethe eprintiweyo.Ezi nxalenye zikhulu ngobukhulu kwaye azifanelekanga iteknoloji yokufakela kwaye ihlanganiswe ngendlela yeeplagi.Iinkqubo eziphambili zemveliso zezi: i-adhesive, plug-in, ukuhlolwa, i-wave soldering, i-brush plating kunye nokuhlolwa kwemveliso.

*Umahluko phakathi kwePCBs kunye neePCBAs*

Ukusuka kwintshayelelo engentla, sinokwazi ukuba iPCBA ibhekisa ngokubanzi kwinkqubo yokusetyenzwa, kwaye inokuqondwa njengebhodi yesekethe egqityiweyo.PCBA ingabalwa kuphela emva kokuba zonke iinkqubo kwibhodi yesekethe eprintiweyo zigqityiwe.Ibhodi yesekethe eprintiweyo yibhodi yesekethe engenanto eprintiweyo engenazo iinxalenye kuyo.