Eli nqaku ikakhulu lazisa iingozi ezintathu zokusebenzisa i-PCB ephelelwe lixesha.
01
I-PCB ephelelweyo inokubangela i-oxidation yephedi yomphezulu
I-oxidation yeepads ze-soldering iya kubangela i-soldering embi, enokuthi ekugqibeleni ibangele ukusilela ekusebenzeni okanye umngcipheko wokuyeka. Ukunyangwa komphezulu ohlukeneyo kwiibhodi zeesekethe kuya kuba nemiphumo eyahlukeneyo yokulwa ne-oxidation. Ngokomgaqo, i-ENIG ifuna ukuba isetyenziswe ngaphakathi kweenyanga ezili-12, ngelixa i-OSP ifuna ukuba isetyenziswe kwiinyanga ezintandathu. Kucetyiswa ukuba ulandele ubomi beshelufu yefektri yebhodi yePCB (shelflife) ukuqinisekisa umgangatho.
Iibhodi ze-OSP zingathunyelwa ngokubanzi kumzi-mveliso webhodi ukuhlamba ifilimu ye-OSP kwaye usebenzise kwakhona umaleko omtsha we-OSP, kodwa kukho ithuba lokuba isekethe ye-foil yobhedu iya konakaliswa xa i-OSP isusiwe ngokuchola, ngoko ke. Kungcono ukuqhagamshelana nomzi-mveliso webhodi ukuqinisekisa ukuba ifilimu ye-OSP inokuphinda iphinde isetyenziswe.
Iibhodi ze-ENIG azinakwenziwa kwakhona. Kucetyiswa ngokubanzi ukwenza "i-press-baking" kwaye emva koko uvavanye ukuba kukho nayiphi na ingxaki ngokuthengiswa.
02
I-PCB ephelelwe lixesha inokufunxa ukufuma kwaye ibangele ukugqabhuka kwebhodi
Ibhodi yesekethe inokubangela i-popcorn effect, ukuqhuma okanye ukuchithwa xa ibhodi yesekethe iphinda ihlawulwe emva kokufunxa ukufuma. Nangona le ngxaki ingasonjululwa ngokubhaka, ayilulo lonke uhlobo lwebhodi olulungele ukubhaka, kwaye ukubhaka kunokubangela ezinye iingxaki zomgangatho.
Ngokuqhelekileyo, ibhodi ye-OSP ayikhuthazwa ukubhaka, kuba ukubhaka okuphezulu kobushushu kuya kuyonakalisa ifilimu ye-OSP, kodwa abanye abantu baye babona abantu bathatha i-OSP ukubhaka, kodwa ixesha lokubhaka kufuneka libe lifutshane kangangoko kunokwenzeka, kwaye ubushushu akufanele bube. ibe phezulu kakhulu. Kuyimfuneko ukugqiba isithando somlilo ngexesha elifutshane, eliyimingeni eninzi, ngaphandle koko i-solder pad iya kuba ne-oxidized kwaye ichaphazele i-welding.
03
Ukukwazi ukudityaniswa kwePCB ephelelwe lixesha kunokuthotywa kwaye kubi
Emva kokuba ibhodi yesekethe iveliswe, ukukwazi ukudibanisa phakathi kweengqimba (i-layer to layer) iya kuthotywa ngokuthe ngcembe okanye ihlehlise ngokuhamba kwexesha, oku kuthetha ukuba njengoko ixesha likhula, amandla okudibanisa phakathi kwebhodi yesekethe iya kuncipha ngokuthe ngcembe.
Xa ibhodi yesekethe enjalo iphantsi kobushushu obuphezulu kwisithando somlilo, ngenxa yokuba iibhodi zeesekethe ezenziwe ngezinto ezahlukeneyo zinee-coefficients ezahlukeneyo zokwandisa i-thermal, phantsi kwesenzo sokwandiswa kwe-thermal kunye nokunciphisa, kunokubangela i-de-lamination kunye ne-bubbles surface. Oku kuya kuchaphazela kakhulu ukuthembeka kunye nokuthembeka kwexesha elide kwibhodi yesekethe, kuba i-delamination yebhodi yesekethe inokwaphula i-vias phakathi kweengqimba zebhodi yesekethe, okukhokelela kwiimpawu ezingalunganga zombane. Eyona ngxaki iphazamisayo ziingxaki ezingezizo ezingezizo ezinokuthi zenzeke, kwaye kunokwenzeka ukuba kubangele i-CAF (isekethe emfutshane encinci) ngaphandle kokwazi.
Umonakalo wokusebenzisa ii-PCB eziphelelweyo usemkhulu kakhulu, ngoko ke abaqulunqi kusafuneka basebenzise ii-PCB ngexesha elibekiweyo kwixesha elizayo.