1. Zoba ibhodi yesekethe yePCB:
2. Cwangcisa ukuprinta kuphela I-TOP LAYER kwaye ngokusebenzisa umaleko.
3. Sebenzisa iprinta yelaser ukuprinta kwiphepha lokutshintshwa kwe-thermal.
4. Isekethe yombane i-thinnest iseti kule bhodi yesekethe yi-10mil.
5. Ixesha lokwenziwa kwepleyiti yomzuzu omnye liqala kumfanekiso omnyama nomhlophe wesekethe ye-elektroniki eprintwe kwiphepha lokudlulisa i-thermal yiprinta yelaser.
6. Kwiibhodi zeesekethe ezisecaleni, enye kuphela eyaneleyo.
Emva koko uyiqhoboshele kubungakanani obufanelekileyo belaminate yobhedu, ubushushu kwaye ucinezele umatshini wokuhambisa ubushushu, imizuzwana engama-20 ukugqiba ukuhanjiswa kobushushu. Thatha i-laminate ye-copper clad kwaye utyhile iphepha lokudlulisa i-thermal, unokubona umzobo ocacileyo wesekethe kwi-laminate yobhedu.
7. Emva koko ubeke i-laminate ye-copper clad kwi-tank ye-corrosion oscillating, usebenzisa isisombululo esixubileyo se-hydrochloric acid kunye ne-hydrogen peroxide, kuthatha imizuzwana eyi-15 kuphela ukususa i-copper engaphezulu.
Umlinganiselo ofanelekileyo we-hydrochloric acid, i-hydrogen peroxide, kunye ne-high-speed oscillating corrosion tank yizitshixo zokufikelela ngokukhawuleza kunye nokugqibeleleyo.
Emva kokugungxulwa ngamanzi, ibhodi yesekethe ebolileyo ingakhutshwa. Kwadlula imizuzwana engama-45 ngeli xesha. Ungaze uchukumise ulwelo oluzinzisa kakhulu oludlekayo ngokungakhathali. Ngaphandle koko, intlungu iya kukhunjulwa ubomi bonke.
8. Sebenzisa i-acetone kwakhona ukucima i-toner emnyama. Ngale ndlela, ibhodi yovavanyo yePCB igqityiwe.
9. Faka i-flux kumphezulu webhodi yesekethe
10. Sebenzisa i-wide blade soldering iron to tin kwibhodi yesekethe ukuze udibanise lula kamva.
11. Susa i-solder flux kwaye usebenzise i-soldering flux kwisixhobo sokuxhoma phezulu ukuze ugqibezele ukusoda kwesixhobo.
12. Ngenxa ye-solder efakwe ngaphambili, kulula ukuthengisa isixhobo.
13. Emva kwe-solder, coca ibhodi yesiphaluka ngamanzi okuhlamba.
14. Inxalenye yebhodi yesekethe.
15. Kukho iingcingo ezininzi ezimfutshane kwibhodi yesekethe.
16. I-wiring emfutshane igqitywe ngu-0603, 0805, 1206 zero ohm resistance.
17. Emva kwemizuzu elishumi, ibhodi yesekethe ilungele uvavanyo.
18. Ibhodi yesekethe phantsi kovavanyo.
19. Gqibezela ukulungisa ingxaki yesekethe.
Indlela yokwenza ipleyiti yokudlulisa i-thermal yomzuzu omnye inokwenza imveliso yehardware ibe lula njengenkqubo yesoftware. Emva kokuba uvavanyo lwebhloko yesiphaluka lugqityiwe, ukuveliswa kwesiphaluka ekugqibeleni kugqitywe ngokusebenzisa indlela yokwenza iplate esemthethweni.
Le ndlela ayigcini nje kuphela iindleko zovavanyo, kodwa okona kubaluleke kakhulu, igcina ixesha. Ingcinga efanelekileyo, ukuba ulinde usuku okanye ezimbini ngaphambi kokuba ufumane ibhodi yesekethe ngokomjikelezo oqhelekileyo wokwenza iplate, uvuyo luya kutshatyalaliswa.