"Ukucoca" kuhlala kungahoywa kwinkqubo ye-PCBA yeebhodi zesekethe, kwaye kuthathwa ukuba ukucoca asilonyathelo elibalulekileyo. Nangona kunjalo, ngokusetyenziswa kwexesha elide kwemveliso kwicala lomthengi, iingxaki ezibangelwe kukucoca ukungasebenzi kwasekuqaleni kubangela ukusilela okuninzi, ukulungisa okanye iimveliso ezikhunjulweyo zibangele ukwanda okukhawulezileyo kwiindleko zokusebenza. Apha ngezantsi, itekhnoloji yokuphucula iya kucacisa ngokufutshane indima yokucocwa kwe-PCBA yeeBhodi zeSekethe.
Inkqubo yemveliso yePCBA (iNdibano yeSebeki yeSekethe) ihamba ngamanqanaba enkqubo ezininzi, kwaye inqanaba ngalinye lingcolile kwiidigri ezahlukeneyo. Ke ngoko, iidiphozithi ezahlukeneyo okanye ukungcola zihlala kumphezulu weBhodi yeSekethe. Ezi ngcoliseko ziya kunciphisa ukusebenza kwemveliso, kwaye zibangele ukusilela kwemveliso. Umzekelo, kwinkqubo yokuthengisa izinto ezithengiswayo ze-elektroniki, itheyithi yeThuthi, iFlex, njl. Zisetyenziselwa ukubhenela kwi-aculistment. Emva kokuthengiswa, iintsalela ezivelisiweyo. Iintsalela ziqukethe i-asidi ye-orgadic kunye nee-ion. Phakathi kwabo, i-acids ye-organic iya kuphuhlisa ibhodi yesekethe. Ubukho bee-ion zombane zinokubangela isekethe emfutshane kwaye ibangele ukuba imveliso isilele.
Zininzi iintlobo zezingcoliseko kwiBhodi yeSekethe, ezinokushwankathelwa ngokwamanqanaba amabini: Ionic kunye ne-un-ionic. I-Ionic Pelbalsens inxibelelana nomswakama kwindalo esingqongileyo, kunye nokufuduka kombane kwenzeka emva kokufakelwa kombane, ukwenza umsebenzi we-Dendritic, okukhokelela kwi-PCBA SEPOSE YOKWENZA INDAWO YOKUGQIBELA YAMSEBENZI. Ukungcoliseka kwe-ionic kunokungena kwi-suble theate ye-pc b kwaye ukhule iidemon phantsi komphezulu we-PCB. Ukongeza kwi-Ionic kunye ne-Ionic Pelbalgans, kukho i-poltbals engcolisekileyo, enjengeebhola zomthengisi, amanqaku entshukumo enokohlwaya, kwaye amalungu ohlangani lolwe xa kuthelekiswa. I-phenomena eyahlukeneyo engafunekiyo enjengeepores kunye nemijikelezo emifutshane.
Ngaba zininzi kakhulu zokungcola, zeziphi ezona zibalulekileyo? I-flux okanye i-Talar Paste isetyenziswa rhoqo kwi-Reflow Gyserment kwaye ikhuphe iinkqubo zokungekho mthethweni. Zibunjwe ikakhulu zii-solnts, iiarhente ezimanzi, i-resions, i-corrossion inhibitors kunye ne-arctiators. Iimveliso eziguqulwe ngekhefu zibophelelekile ukuba zikhona emva kokuthengiswa. Ezi zinto ngokwemigaqo yokungaphumeleli kwemveliso, iintsali ze-Post-Welding zezona zinto zibalulekileyo zichaphazela umgangatho wemveliso. Intsalela ye-Ionic inokubangela ukufuduka i-eleclic kunye nokunciphisa ukunganyangeki, kunye neentsalela zaseRosin kulula ukulungisa uthuli okanye kwiimeko ezinzima, kuya kukhokelela ekungaphelini kwesekethe. Ke ngoko, ukucocwa ngokungqongqo kufuneka kwenziwe emva kokuba i-welding ukuqinisekisa umgangatho we-PCBA.
Ngamafutshane, ukucocwa kweBhodi yeSiphaluka kubaluleke kakhulu. "Ukucoca" yinkqubo ebalulekileyo enxulumene ngqo nomgangatho weBhodi yeSiphaluka kwaye ibalulekile.