"Ukucoca" kudla ngokunganakwa kwinkqubo yokuvelisa i-PCBA yeebhodi zeesekethe, kwaye kuthathwa ukuba ukucoca akusiyo inyathelo elibalulekileyo. Nangona kunjalo, kunye nokusetyenziswa kwexesha elide lemveliso kwicala lomxhasi, iingxaki ezibangelwa ukucoceka okungenamsebenzi kwinqanaba lokuqala kubangela ukungaphumeleli okuninzi, ukulungiswa okanye Iimveliso ezikhunjulweyo zibangele ukunyuka okubukhali kwiindleko zokusebenza. Ngezantsi, i-Heming Technology iya kuchaza ngokufutshane indima yokucoca i-PCBA yeebhodi zesekethe.
Inkqubo yokuvelisa ye-PCBA (indibano yesiphaluka eprintiweyo) ihamba ngezigaba ezininzi zenkqubo, kwaye isigaba ngasinye singcolisekile kwiidigri ezahlukeneyo. Ngoko ke, iidiphozithi ezahlukeneyo okanye ukungcola kuhlala phezu komphezulu webhodi yesekethe PCBA. Ezi zingcolisi ziya kunciphisa imveliso Performance, kwaye nokuba kubangele ukusilela imveliso. Ngokomzekelo, kwinkqubo yokuthengisa izinto ze-elektroniki, i-solder paste, i-flux, njl. Emva kwe-soldering, iintsalela zenziwe. Iintsalela ziqulethe i-acids eziphilayo kunye ne-ion. Phakathi kwazo, iiasidi ze-organic ziya corrode ibhodi yesekethe PCBA. Ubukho bee-ion zombane bunokubangela isiphaluka esifutshane kwaye kubangele ukuba imveliso ingaphumeleli.
Kukho iintlobo ezininzi ezingcolisayo kwibhodi yesekethe PCBA, enokuthi ishwankathelwe ibe ngamacandelo amabini: ionic kunye non-ionic. Izingcolisi ze-Ionic zidibana nomswakama kwimeko-bume, kwaye ukufuduka kwe-electrochemical kwenzeka emva kokufakelwa kombane, ukwenza isakhiwo se-dendritic, okubangelwa indlela ephantsi yokumelana, kunye nokutshabalalisa umsebenzi we-PCBA webhodi yesiphaluka. Izingcolisi ezingezizo i-ionic zinokungena kumaleko wokugquma wePC B kwaye zikhule iidendrites phantsi komphezulu wePCB. Ukongeza kwizinto ezingcolisa i-ionic kunye ne-non-ionic, kukho kwakhona izinto ezingcolisa i-granular, ezifana neebhola ze-solder, iindawo ezidadayo kwibhafu ye-solder, uthuli, uthuli, njl. amajoyinti alolwa ngexesha le-soldering. Izinto ezahlukeneyo ezingafunekiyo ezifana neepores kunye neesekethe ezimfutshane.
Ekubeni zininzi kangaka izinto ezingcolisa umoya, zeziphi ezona zixhalabileyo? I-Flux okanye i-solder paste isetyenziswa ngokuqhelekileyo kwi-reflow soldering kunye neenkqubo ze-wave soldering. Ubukhulu becala zenziwa zizinyibilikisi, ii-agent zokumanzisa, iintlaka, ii-corrosion inhibitors kunye ne-activators. Iimveliso eziguqulwe ngobushushu zibophelelekile ukuba zibekho emva kokuthengiswa. Ezi zinto Ngokumalunga nokungaphumeleli kwemveliso, iintsalela ze-post-welding yeyona nto ibalulekileyo echaphazela umgangatho wemveliso. Iintsalela ze-Ionic zinokubangela ukufuduka kwe-electromigration kunye nokunciphisa ukunyanzeliswa kwe-insulation, kunye neentsalela ze-rosin resin zilula ukubhengeza Uthuli okanye ukungcola kubangela ukuba ukuchasana koqhagamshelwano kunyuke, kwaye kwiimeko ezinzima, kuya kubangela ukusilela kwesekethe evulekileyo. Ngoko ke, ukucocwa okungqongqo kufuneka kwenziwe emva kwe-welding ukuqinisekisa umgangatho webhodi yesekethe ye-PCBA.
Isishwankathelo, ukucocwa kwebhodi yesekethe PCBA kubaluleke kakhulu. "Ukucoca" yinkqubo ebalulekileyo ehambelana ngokuthe ngqo nomgangatho webhodi yesekethe ye-PCBA kwaye iyimfuneko.