Intshayelelo kwiingenelo nezingalungangaI-BGA PCBibhodi

Ibhodi ye-grid grid i-Grid (BGA) iBhodi yeSekethe (i-PCB) yiphakheji yeNtaba yeNtaba yeNtaba yePCB eyenzelwe ngokuthe ngqo kwimijikelezo emisiweyo. Iibhodi ze-BGA zisetyenziswa kwizicelo apho indawo yokuphakamisa isigxina, umzekelo, kwizixhobo ezinjengendawo efana ne-microprocessars. Ezi ziibhodi zesekethe ezishicilelweyo ezishicilelweyo kwaye azinakuphinda zisetyenziswe. Iibhodi ze-BGA zineePINI ezininzi ngakumbi kune-PCBS eqhelekileyo. Inqaku ngalinye kwiBhodi ye-BGA lingathengiswa ngokuzimeleyo. Olu nxibelelwano lupheleleyo lwezi PCBs lusasazeka ngohlobo lwe-matrix efanayo okanye igridi engaphezulu. Ezi PCB zenziwe ukuba yonke indawo engaphantsi inokusetyenziswa ngokulula endaweni yokusebenzisa nje indawo ye-peipheral.

Izikhonkwane zephakheji ye-BGA zimfutshane kakhulu kune-PCB eqhelekileyo kuba ineemo zodidi lomlinganiso. Ngenxa yesi sizathu, ibonelela ngentsebenzo engcono kwisantya esiphezulu. I-BGA Willing ifuna ulawulo oluchanekileyo kwaye lihlala likhokelwa ngoomatshini abazenzekelayo. Kungenxa yezi zizathu zokuba izixhobo ze-BGA azikufanelekeli kwisokisi.

Iteknoloji yeTekhnoloji ye-BGA

I-oven ye-compy isetyenziselwa ukuthwala iphakheji ye-BGA kwiBhodi yeSiphaluka eprintiweyo. Xa ukunyibilika kwebhola yomrhwebi kuqala ngaphakathi kwe-oveni, impikiswano ebusweni beebhola ezityhidiweyo zigcina iphakheji ehambelana ne-PCB. Le nkqubo iyaqhubeka de iphakheji isuswe kwi-oveni, ipholile kwaye iqinile. Ukwenzela ukuba ube namalungu othumelwano ongezelelweyo, inkqubo yokuthengiswa okulawulwayo yephakheji ye-BGA iyimfuneko kwaye kufuneka ifike kwiqondo lobushushu elifunekayo. Xa kusenziwa iindlela zokurhweba ngokufanelekileyo, ikwasusa nakuphi na ukubakho kwemijikelezo emifutshane.

Izibonelelo zomhlaba we-BGA

Zininzi izibonelelo zokushicilela i-BGA, kodwa kuphela eyona nto iphambili ichazwe ngezantsi.

1. Iphakheji ye-BGA isebenzisa indawo yePCB isebenza ngokufanelekileyo: Ukusetyenziswa kwezikhokelo zokupakisha i-BGA Ukusetyenziswa kwezinto ezincinci kunye nendawo encinci. Ezi phakheji zikwanceda ukugcina indawo eyaneleyo yokwenziwa kwenkqubo kwi-PCB, ngaloo ndlela kunyusa ukusebenza kwawo.

2. Ukuphuculwa kokusebenza kombane kunye ne-thermal: Ubungakanani beepakeji ze-BGA zincinci kakhulu, ke ezi CCBs zichitha ubushushu obuncinci kwaye inkqubo yokungasebenzi kulula ukuyisebenzisa. Nanini na xa i-selicon ye-silicon ikhuselwe phezulu, uninzi lobushushu luyekiswa ngqo kwigridi yebhola. Nangona kunjalo, kunye ne-silicon ifayo ifakwe ezantsi, i-silicon ifayo ixhuma ngaphezulu kwephakeji. Kungenxa yoko le nto kuthathwa njengelona khetho lufanelekileyo kwitekhnoloji yokupholisa. Akukho zikhonkwane zephakheji ze-BGA, ngoko ke ukuqina kwezi PCBs kuyanda ngelixa kuqinisekisa ukusebenza kakuhle kombane.

3. Ukuphucula igalelo elinegalelo ngokuphuculwa komthengisi ophuculweyo: Iipads zeephakheji ze-BGA zinkulu ngokwaneleyo ukuba zenze ukuba zibe lula ukuba bathengise kwaye kulula ukuphatha. Ke ngoko, ukukhululeka kwe-welding kunye nokusingatha kwenza ukuba kuqiniseke kakhulu ukwenza. Iipads ezinkulu zale PCBS zinokuphinda ziphinde ziphinde ziphinde ziphinde zenziwe ngokulula.

4. Nciphisa umngcipheko womonakalo: Iphakheji ye-BGA ithengiswa uqinile-imeko eqinileyo, ngaloo ndlela ibonelela ngokuqina okuqinileyo kunye nokuqina nangayiphi na imeko.

ye-5. Ukunciphisa iindleko: Ezi zibonelelo zingentla zinceda ukunciphisa iindleko ze-BGA. Ukusetyenziswa ngokukuko kweebhodi zesekethe eziprintiweyo zibonelela ngamaxesha amanye ukusindisa imisebenzi kunye nokuphucula ukusebenza kwe-thermon, ukunceda ekuqinisekiseni ukuba i-elektroniki iphakathi kunye nokunciphisa iziphene.

Izinto ezingalunganga ze-BGA

Oku kulandelayo kukho izinto ezingalunganga ze-BGA iipakeji, ezichazwe ngokweenkcukacha.

I-1. Inkqubo yokuhlola inzima kakhulu: Kunzima ukuyihlola isekethe ngexesha lenkqubo yokuthengisa izinto kwiphakheji ye-BGA. Kunzima kakhulu ukukhangela naziphi na iimpazamo ezinokubakho kwiphakheji ye-BGA. Emva kwecandelo ngalinye lithengisiwe, iphakheji kunzima ukuyifunda kwaye ihlole. Nokuba kukho nayiphi na impazamo ifunyenwe ngexesha lenkqubo yokutshekisha, kuya kuba nzima ukuyilungisa. Ke ngoko, ukulungiselela ukuhlolwa, ukubiza kakhulu i-Scan ye-CT kunye ne-X-ray tekhnoloji isetyenzisiwe.

2. Imiba yokunyaniseka: Iiphakheji ze-BGA zichaphazeleka kuxinzelelo. Olu hlazo lubangelwa kukugoba uxinzelelo. Olu xinzelelo lubangela imiba ekuthembekileyo kwezi bhodi zesekethe eziprintwayo. Nangona imiba yokuthembeka inqabile kwiiphakeji ze-BGA, kunokwenzeka ukubakho.

Itekhnoloji ye-BGA ye-raypcb

Eyona teknoloji isetyenziswayo esetyenziswayo ye-BGA yephakheji esetyenziswe yi-raypcb yi-0.3mm, kwaye ubuncinci bomgama obekwe kwi-0.2mm. Ubuncinci besithuba phakathi kweephakeji ezimbini ezahlukeneyo ze-BGA (ukuba ugcinwe kwi-0.2mm). Nangona kunjalo, ukuba iimfuno zahlukile, nceda uqhakamshele i-raypcb yotshintsho kwiinkcukacha ezifunekayo. Umgama wobukhulu bephakheji ye-BGA uboniswa kumzobo ongezantsi.

Ukupakishwa kwe-BGA yexesha elizayo

Ayinakuphikwa ukuba i-Bga ikhuphe imakethi yombane kunye ne-elektroniki kwixesha elizayo. Ikamva le-BGA liqinile kwaye liya kuba semarikeni ixesha elithile. Nangona kunjalo, inqanaba langoku lenkqubela phambili kwezobuchwephesha likhawuleza kakhulu, kwaye kulindeleke ukuba kungekudala, kuya kubakho olunye uhlobo lwebhodi yesekethe eprintiweyo eprintiweyo kunepaki ye-BGA. Nangona kunjalo, inkqubela phambili yetekhnoloji ikwazise ukunyuka kwamaxabiso kunye nemicimbi yexabiso kwi-elektroniki. Ke ngoko, kucingelwa ukuba ipakisi ye-BGA iya kuhamba indlela ende kumzi-mveliso we-elektroniki ngenxa yezizathu zokusebenza kweendleko kunye nezizathu zokuqhekeza. Ukongeza, zininzi iindidi zeephakheji ze-BGA, kwaye umahluko kwiindidi zabo ukonyusa ukubaluleka kweephakheji ze-BGA. Umzekelo, ukuba ezinye iintlobo zeephakheji ze-BGA azilungelanga iimveliso ze-elektroniki, ezinye iintlobo ze-BGA ziya kusetyenziswa.