Intshayelelo kwiinzuzo kunye nokungalunganga kweBGA PCBibhodi

Uluhlu lwegridi yebhola (BGA) ibhodi yesekethe eprintiweyo (PCB) yiphakheji yomphezulu we-PCB eyilelwe ngokukodwa imijikelezo edibeneyo.Iibhodi ze-BGA zisetyenziselwa izicelo apho ukunyuswa komhlaba kusisigxina, umzekelo, kwizixhobo ezifana ne-microprocessors.Ezi ziibhodi zeesekethe eziprintiweyo ezilahlwayo kwaye azinakuphinda zisetyenziswe.Iibhodi ze-BGA zinezikhonkwane zoqhagamshelo ezininzi kuneePCB eziqhelekileyo.Inqaku ngalinye kwibhodi ye-BGA inokuthengiswa ngokuzimeleyo.Udibaniso lulonke lwezi PCBs lusasazwe ngendlela ye-matrix efanayo okanye igridi yomphezulu.Ezi PCBs ziyilelwe ukuze yonke underside kube lula ukusetyenziswa endaweni nje ukusebenzisa indawo peripheral.

Izikhonkwane zepakethe ye-BGA zifutshane kakhulu kune-PCB eqhelekileyo kuba inohlobo lwemilo yomjikelezo kuphela.Ngenxa yesi sizathu, ibonelela ukusebenza ngcono ngesantya esiphezulu.I-BGA welding ifuna ulawulo oluchanekileyo kwaye isoloko ikhokelwa ngoomatshini abazenzekelayo.Kungenxa yoko le nto izixhobo ze-BGA zingafanelekanga ukunyuswa kweesokethi.

Itekhnoloji yokupakisha i-BGA yokupakishwa

I-oven reflow isetyenziselwa ukuthengisa iphakheji ye-BGA kwibhodi yesekethe eprintiweyo.Xa ukunyibilika kweebhola ze-solder kuqala ngaphakathi kwi-oven, ukuxinana kumphezulu weebhola ezityhidiweyo zigcina ipakethe ihambelana kwindawo yayo yokwenyani kwi-PCB.Le nkqubo iyaqhubeka de iphakheji isuswe kwi-oven, ipholile kwaye ibe yomelele.Ukuze ube namalungu e-solder ehlala ixesha elide, inkqubo yokuthengisa elawulwayo ye-package ye-BGA iyimfuneko kakhulu kwaye kufuneka ifikelele kubushushu obufunekayo.Xa kusetyenziswa iindlela ezifanelekileyo ze-soldering, kwakhona kuphelisa nayiphi na indlela yeesekethe ezimfutshane.

Izinto ezilungileyo zokupakishwa kweBGA

Zininzi iingenelo zokupakishwa kwe-BGA, kodwa kuphela ezona zilungileyo zichazwe ngezantsi.

1. Ukupakishwa kwe-BGA kusebenzisa indawo ye-PCB ngokufanelekileyo: Ukusetyenziswa kwe-BGA yokupakisha isikhokelo sokusetyenziswa kwamacandelo amancinci kunye neenyawo ezincinci.Ezi phakheji zikwanceda ukugcina indawo eyaneleyo yokwenza ngokwezifiso kwi-PCB, ngokwandisa ukusebenza kwayo.

2. Ukuphuculwa kokusebenza kombane kunye ne-thermal: Ubungakanani beephakheji ze-BGA zincinci kakhulu, ngoko ke ezi PCB zichitha ubushushu obuncinci kwaye inkqubo yokutshatyalaliswa kulula ukuyiphumeza.Nanini na xa i-wafer ye-silicon inyuselwe phezulu, uninzi lobushushu bugqithiselwa ngokuthe ngqo kwigridi yebhola.Nangona kunjalo, kunye ne-silicon die efakwe ezantsi, i-silicon die idibanisa phezulu kwiphakheji.Kungenxa yoko le nto ithathwa njengolona khetho lubalaseleyo kwitekhnoloji yokupholisa.Akukho zikhonkwane ezigobekayo okanye eziethe-ethe kwiphakheji ye-BGA, ngoko ke ukuqina kwezi PCB kunyuswa ngelixa kuqinisekisa ukusebenza kakuhle kombane.

3. Ukuphucula ingeniso yokuvelisa ngokuthengisa okuphuculweyo: Iipakethi zeepakethi ze-BGA zikhulu ngokwaneleyo ukuze zibe lula ukuthengisa kwaye kulula ukuzibamba.Ke ngoko, lula ukuwelda kunye nokuphatha kwenza kube ngokukhawuleza kakhulu ukwenza.Iipads ezinkulu zezi PCB zinokuphinda zisetyenzwe ngokulula xa zifuneka.

4. UNCIPHISA UMNGCIPHEKO WOKONAKALA: Iphakheji ye-BGA i-solid-state soldered, ngaloo ndlela inika ukuqina okuqinileyo kunye nokuqina kuyo nayiphi na imeko.

of 5. Nciphisa iindleko: eziluncedo ngasentla ukunceda ukunciphisa iindleko BGA ukupakishwa.Ukusetyenziswa ngokufanelekileyo kweebhodi zeesekethe eziprintiweyo kubonelela ngamathuba angakumbi okugcina izixhobo kunye nokuphucula ukusebenza kwe-thermoelectric, kunceda ekuqinisekiseni umgangatho ophezulu we-elektroniki kunye nokunciphisa iziphene.

Izinto ezingeloncedo zokupakishwa kweBGA

Ezi zilandelayo zezinye izinto ezingeloncedo kwiiphakheji ze-BGA, ezichazwe ngokweenkcukacha.

1. Inkqubo yokuhlola inzima kakhulu: Kunzima kakhulu ukuhlola isekethe ngexesha lenkqubo yokuthengisa amacandelo kwiphakheji ye-BGA.Kunzima kakhulu ukujonga naziphi na iimpazamo ezinokuthi zibekho kwiphakheji ye-BGA.Emva kokuba icandelo ngalinye lithengisiwe, iphakheji inzima ukufunda nokuhlola.Nangona nayiphi na impazamo ifunyenwe ngexesha lokujonga inkqubo, kuya kuba nzima ukuyilungisa.Ke ngoko, ukwenza lula ukuhlolwa, kusetyenziswa i-CT scan ebiza kakhulu kunye ne-X-ray technologies.

2. Imiba yokuthembeka: Iiphakheji ze-BGA zisengozini yoxinzelelo.Le fragility kungenxa yoxinzelelo lokugoba.Olu xinzelelo lokugoba lubangela imiba yokuthembeka kwezi bhodi zesekethe eziprintiweyo.Nangona imiba yokuthembeka inqabile kwiiphakheji ze-BGA, into enokwenzeka ihlala ikhona.

I-BGA ipakishwe iteknoloji yeRayPCB

Ithekhnoloji esetyenziswa ngokuqhelekileyo kwipakethe ye-BGA esetyenziswa yi-RayPCB yi-0.3mm, kwaye umgama omncinci omele ube phakathi kweesekethe ugcinwe kwi-0.2mm.Ubuncinci bezithuba phakathi kweepakethe ezimbini ezahlukeneyo ze-BGA (ukuba zigcinwe kwi-0.2mm).Nangona kunjalo, ukuba iimfuno zahlukile, nceda uqhagamshelane ne-RAYPCB malunga notshintsho kwiinkcukacha ezifunekayo.Umgama wesayizi yephakheji ye-BGA uboniswe kulo mfanekiso ungezantsi.

Ukupakishwa kweBGA yekamva

Ayinakuphikiswa into yokuba ukupakishwa kwe-BGA kuya kukhokelela kwintengiso yombane kunye neyemveliso ye-elektroniki kwixesha elizayo.Ikamva lokupakishwa kwe-BGA liqinile kwaye liya kuba kwimarike ixesha elide.Nangona kunjalo, izinga langoku lokuqhubela phambili kwezobuchwepheshe likhawuleza kakhulu, kwaye kulindeleke ukuba kwixesha elizayo elingekude, kuya kubakho olunye uhlobo lwebhodi yesekethe eprintiweyo esebenza ngakumbi kune-BGA yokupakisha.Nangona kunjalo, ukuhambela phambili kwetekhnoloji kuzise nokunyuka kwamaxabiso kunye nemiba yeendleko kwihlabathi le-elektroniki.Ke ngoko, kucingelwa ukuba ukupakishwa kwe-BGA kuya kuhamba indlela ende kwishishini lombane ngenxa yeendleko-ngempumelelo kunye nezizathu zokuqina.Ukongeza, kukho iintlobo ezininzi zeepakethe ze-BGA, kwaye iyantlukwano kwiintlobo zazo kwandisa ukubaluleka kweepakethe ze-BGA.Umzekelo, ukuba ezinye iintlobo zeepakethi ze-BGA azifanelekanga kwiimveliso ze-elektroniki, ezinye iintlobo zeepakethi ze-BGA ziya kusetyenziswa.