Intshayelelo yeNge-in-Pad:

Kuyaziwa ukuba i-vias (VIA) inokwahlulwa ibe yipleyiti ngomngxuma, umngxuma oyimfama kunye nomngxuma we-vias, onemisebenzi eyahlukeneyo.

Ngophuhliso lweemveliso ze-elektroniki, i-vias idlala indima ebalulekileyo ekudibaneni kwe-interlayer yeebhodi zesekethe eziprintiweyo. I-Via-in-Pad isetyenziswa ngokubanzi kwi-PCB encinci kunye ne-BGA (i-Ball Grid Array). Ngophuhliso olungenakuphepheka lokuxinana okuphezulu, i-BGA (i-Ball Grid Array) kunye ne-SMD chip miniaturization, ukusetyenziswa kwe-teknoloji ye-Via-in-Pad kuba kubaluleke ngakumbi.

I-Vias kwi-pads ineenzuzo ezininzi ngaphezu kwee-vias ezingaboniyo kunye nokungcwatywa:

. Ifanelekile kwi-pitch entle ye-BGA.

. Kukulungele ukuyila iPCB yoxinaniso oluphezulu kunye nokugcina indawo yocingo.

. Ulawulo olungcono lwe-thermal.

. I-Anti-low inductance kunye nolunye uyilo olunesantya esiphezulu.

. Ibonelela ngomphezulu othe tyaba wamacandelo.

. Nciphisa indawo yePCB kwaye uphucule ngakumbi iingcingo.

Ngenxa yezi nzuzo, nge-in-pad isetyenziswa ngokubanzi kwiiPCB ezincinci, ngakumbi kuyilo lwePCB apho kufuneka ukuhanjiswa kobushushu kunye nesantya esiphezulu kunye ne-BGA pitch encinci. Nangona i-vias eyimfama kunye nengcwatywayo inceda ukwandisa ingxinano kunye nokugcina indawo kwi-PCBs, i-vias kwi-pads iseyeyona nto ingcono kakhulu yolawulo lwe-thermal kunye ne-high-speed design components.

Ngokuthembeka ngokuzaliswa kwenkqubo yokuzalisa / i-plating capping, iteknoloji ye-pad-in-pad ingasetyenziselwa ukuvelisa ii-PCB ezinoxinano oluphezulu ngaphandle kokusebenzisa izindlu zeekhemikhali kunye nokuphepha iimpazamo ze-soldering. Ukongeza, oku kunokubonelela ngeengcingo ezongezelelweyo zokudibanisa kuyilo lweBGA.

Kukho izinto ezahlukeneyo zokuzalisa umngxuma kwipleyiti, intlama yesilivere kunye nokuncamatheliswa kobhedu ziqhele ukusetyenziselwa izinto zokuqhuba, kwaye i-resin isetyenziswa ngokuqhelekileyo kwizinto ezingaqhubekiyo.