Uwubuyisela njani umva umzobo wesicwangciso sebhodi yokukopa yePCB

PCB ikopi ibhodi, ishishini lidla ngokubizwa ngokuba ibhodi yesekethe ikopi ibhodi, ibhodi yesekethe clone, ikopi yebhodi yesekethe, PCB clone, PCB uyilo reverse okanye PCB reverse uphuhliso.

Oko kukuthi, kwisiseko sokuba kukho izinto eziphathekayo zeemveliso zombane kunye neebhodi zesekethe, uhlahlelo umva iibhodi zesekethe usebenzisa reverse uphando kunye nophuhliso ubuchule, kunye neefayile PCB imveliso yokuqala, ibhili yezinto (BOM) iifayile, iifayile schematic kunye nezinye zobugcisa. amaxwebhu PCB silk screen imveliso amaxwebhu abuyiselwe 1:1.

Emva koko sebenzisa ezi fayile zobugcisa kunye neefayile zemveliso kwi-PCB yokuvelisa, i-welding yecandelo, uvavanyo lwe-flying probe, ukulungiswa kwebhodi yesekethe, kwaye ugcwalise ikopi epheleleyo yethempleyithi yebhodi yesekethe.

Abantu abaninzi abazi ukuba yintoni ibhodi yokukhuphela yePCB. Abanye abantu bade bacinge ukuba ibhodi yokukhuphela yePCB yikopi.

Ekuqondeni komntu wonke, i-copycat ithetha ukuxelisa, kodwa ibhodi yekopi yePCB ngokuqinisekileyo ayifanisi. Injongo yebhodi yekopi yePCB kukufunda itekhnoloji yoyilo lwamva nje lwesekethe ye-elektroniki yangaphandle, kwaye emva koko ifunxe izisombululo zoyilo olubalaseleyo, kwaye ke uyisebenzise ukuphuhlisa uyilo olungcono. Imveliso.

Kunye nophuhliso oluqhubekayo kunye nzulu kushishino ibhodi ikopi, ingcamango yebhodi yekopi yePCB yanamhlanje iye yandiswa kuluhlu olubanzi, kwaye ayisekho kuphela kwibhodi yesekethe elula yokukhuphela kunye ne-cloning, kodwa ibandakanya ukuphuhliswa kwemveliso yesibini kunye nophuhliso lwemveliso entsha. Uphando nophuhliso.

Ngokomzekelo, ngokuhlalutya kunye nengxoxo yamaxwebhu obugcisa akhoyo emveliso, iingcamango zoyilo, iimpawu zesakhiwo, iteknoloji yenkqubo, njl., inokubonelela ngohlalutyo olunokwenzeka kunye nereferensi yokhuphiswano kuphuhliso kunye noyilo lweemveliso ezintsha, kunye nokuncedisa i-R & D kunye neeyunithi zoyilo ukulandelela ngexesha iintsingiselo zophuhliso lwetekhnoloji, uhlengahlengiso kwangexesha kunye nokuphuculwa kwezicwangciso zoyilo lwemveliso, kunye nophando kunye nophuhliso lwezona mveliso zintsha zikhuphisanayo kwimarike.

Inkqubo yokukopa i-PCB inokuqonda uhlaziyo olukhawulezayo, ukuphuculwa kunye nophuhliso lwesibini lweentlobo ezahlukeneyo zeemveliso ze-elektroniki ngokutsalwa kunye nokuguqulwa okungaphelelanga kweefayile zedatha yobugcisa. Ngokwemizobo yeefayile kunye nemifanekiso yeskimu ekhutshwe kwiibhodi zokukopa, abaqulunqi beengcali banokulandela iimfuno zomthengi. Ukulungele ukukhulisa uyilo kunye nokutshintsha iPCB.

Kwakhona kunokwenzeka ukongeza imisebenzi emitsha kwimveliso okanye ukuyila kwakhona iimpawu zokusebenza kwesi siseko, ukwenzela ukuba iimveliso ezinemisebenzi emitsha ziya kutyhilwa ngesantya esikhawulezayo kunye nesimo sengqondo esitsha, kungekhona nje ukuba namalungelo abo epropathi yengqondo, kodwa kwakhona. kwimarike Iphumelele ithuba lokuqala kwaye yazisa izibonelelo eziphindwe kabini kubathengi.

Nokuba isetyenziselwa ukuhlalutya imigaqo yebhodi yesekethe kunye neempawu zokusebenza kwemveliso kuphando olubuyela umva, okanye iphinda isetyenziswe njengesiseko kunye nesiseko soyilo lwePCB kuyilo lwangaphambili, iischematics zePCB zinendima ekhethekileyo.

Ke, ungawubuyisela njani umva umzobo wesicwangciso sePCB ngokomzobo woxwebhu okanye eyona nto, kwaye yintoni inkqubo ebuyela umva? Zeziphi iinkcukacha ekufuneka ziqwalaselwe?

Inyathelo lokubuya umva

 

1. Rekhoda iinkcukacha ezinxulumene PCB

Fumana iqhekeza le-PCB, qala urekhode imodeli, iiparamitha, kunye nendawo yazo zonke iikhomponenti ephepheni, ngakumbi isalathiso se-diode, i-triode, kunye nesalathiso se-IC gap. Kungcono ukusebenzisa ikhamera yedijithali ukuthatha iifoto ezimbini zendawo yamacandelo. Iibhodi ezininzi zesekethe ze-pcb ziya phambili ngakumbi. Ezinye ze-diode transistors apha ngasentla aziqatshelwa kwaphela.

2. Umfanekiso oskeniweyo

Susa zonke iinxalenye kwaye ususe i-tin kwi-PAD emngxunyeni. Coca i-PCB ngotywala kwaye uyibeke kwiskena. Xa iskena siskena, kufuneka unyuse ipixels eskeniweyo kancinci ukuze ufumane umfanekiso ocacileyo.

Emva koko usasaze ngokukhawuleza iileya eziphezulu kunye nezantsi kunye nephepha le-gauze lamanzi kuze kube yilapho ifilimu yethusi icwebezela, yibeke kwi-scanner, qalisa i-PHOTOSHOP, kwaye uhlolisise iileya ezimbini ngokwahlukileyo ngombala.

Qaphela ukuba iPCB mayibekwe ngokuthe tye nangokuthe nkqo kwiskena, kungenjalo umfanekiso oskeniweyo awunakusetyenziswa.

3. Lungisa kwaye ulungise umfanekiso

Lungisa umahluko, ukukhanya kunye nobumnyama be-canvas ukwenza inxalenye ngefilimu yobhedu kunye nenxalenye ngaphandle kwefilimu yethusi inomlinganiselo oqinileyo, uze ujike umfanekiso wesibini ube ngumnyama nomhlophe, kwaye ukhangele ukuba imigca icacile. Ukuba akunjalo, phinda eli nyathelo. Ukuba icacile, gcina umfanekiso njengefayile ye-BMP emnyama namhlophe kwi-TOP BMP kunye ne-BOT BMP. Ukuba ufumana naziphi na iingxaki kwimizobo, ungasebenzisa i-PHOTOSHOP ukuyilungisa nokuzilungisa.

4. Ukuqinisekisa ukuhambelana kwePAD kunye ne-VIA

Guqula iifayile ezimbini zefomati ye-BMP kwiifayile zefomathi ye-PROTEL, kwaye uzigqithisele kwimigangatho emibini kwi-PROTEL. Ngokomzekelo, izikhundla ze-PAD kunye ne-VIA ezigqithise iileya ezimbini zihambelana ngokusisiseko, ezibonisa ukuba amanyathelo angaphambili ayenziwe kakuhle. Ukuba kukho ukutenxa, phinda inyathelo lesithathu. Ke ngoko, ukukopa kwePCB ngumsebenzi ofuna umonde, kuba ingxaki encinci iya kuchaphazela umgangatho kunye nenqanaba lokumatanisa emva kokukopa.

5. Zoba umaleko

Guqula i-BMP yomaleko we-TOP kwi-TOP PCB. Nikelani ingqalelo ekuguquleni kwi-SILK layer, eyiyellow layer. Emva koko unokulandelela umgca kwi-TOP layer kwaye ubeke isixhobo ngokomzobo kwisinyathelo sesibini. Cima umaleko we-SILK emva kokuzoba. Phinda kwakhona de zonke iileya zizotywe.

6. I-TOP PCB kunye ne-BOT PCB edibeneyo yomfanekiso

Ngenisa i-TOP PCB kunye ne-BOT PCB kwi-PROTEL kwaye uzidibanise zibe ngumfanekiso omnye.

7. Ukuprintwa kweLaser ULENKO OLUPHAKAMILEYO, ULENKO OLUPHANTSI

Sebenzisa umshicileli we-laser ukuprinta ULENKO ELIPHEZULU kunye ne-BOTTOM LAYER kwifilimu ebonakalayo (1: 1 ratio), ubeke ifilimu kwi-PCB, kwaye uthelekise ukuba kukho impazamo. Ukuba ichanekile, ugqibile.

8. Uvavanyo

Vavanya ukuba umsebenzi wobugcisa bombane webhodi yokukopa iyafana nebhodi yokuqala. Ukuba kuyafana, kwenziwa ngokwenene.
Ingqalelo kwiinkcukacha

1. Yahlula ngokufanelekileyo imimandla yokusebenza

Xa kusenziwa uyilo olungasemva lomzobo weskimu sebhodi yesekethe yePCB elungileyo, ulwahlulo olufanelekileyo lweendawo ezisebenzayo lunokunceda iinjineli zinciphise iingxaki ezingeyomfuneko kwaye ziphucule ukusebenza kakuhle komzobo.

Ngokubanzi, amacandelo anomsebenzi ofanayo kwibhodi yePCB aya kulungelelaniswa ngendlela egxininiswe, kwaye ukwahlula indawo ngomsebenzi kunokuba nesiseko esiluncedo nesichanekileyo xa uguqula umzobo weskimu.

Nangona kunjalo, ulwahlulo lwalo mmandla wokusebenza alunanjongo. Ifuna ukuba iinjineli zibe nokuqonda okuthile kolwazi olunxulumene nesekethe ye-elektroniki.

Okokuqala, fumana i-core component kwiyunithi ethile esebenzayo, kwaye ngoko ngokuhambelana noxhumo lwe-wiring, unokufumana amanye amacandelo eyunithi efanayo yokusebenza kwindlela yokwenza ulwahlulo olusebenzayo.

Ukwenziwa kwemimandla esebenzayo sisiseko somzobo weskim. Ukongeza, kule nkqubo, ungalibali ukusebenzisa iinombolo ze-serial zecandelo kwibhodi yesekethe ngobuchule. Banokukunceda ukwahlula imisebenzi ngokukhawuleza.

2. Fumana iindawo ezifanelekileyo zereferensi

Le nxalenye yereferensi kunokuthiwa icandelo eliphambili lesixeko sothungelwano sePCB esisetyenziswe ekuqaleni komzobo ocwangcisiweyo. Emva kokuba inxalenye yereferensi inqunywe, inxalenye yereferensi izotywa ngokwezikhonkwane zala macandelo ereferensi, anokuqinisekisa ukuchaneka komzobo weskimu ukuya kumlinganiselo omkhulu. Ukwabelana ngesondo.

Kwiinjineli, ukumiselwa kweengxenye zereferensi akuyona into enzima kakhulu. Kwiimeko eziqhelekileyo, amacandelo adlala indima enkulu kwisekethe anokukhethwa njengeenxalenye zereferensi. Ngokuqhelekileyo zikhulu ngobukhulu kwaye zinezikhonkwane ezininzi, ezilungele ukuzoba. Ezinjengeesekethe ezihlanganisiweyo, ii-transformers, ii-transistors, njl. njl., zonke zinokusetyenziswa njengamacandelo afanelekileyo okukhangela.

3. Yahlula ngokuchanekileyo imigca kwaye uzobe iingcingo ngokufanelekileyo

Ngokwahlula phakathi kweengcingo zomhlaba, iingcingo zamandla, kunye neengcingo zesignali, iinjineli nazo kufuneka zibe nolwazi olufanelekileyo lonikezelo lwamandla, ulwazi loqhagamshelwano lwesekethe, ulwazi lwe-wiring yePCB, njalo njalo. Ukwahlula le migca kunokuhlalutywa kwimiba yoxhulumaniso lwamacandelo, umgca we-foil yobhedu ububanzi kunye neempawu zemveliso ye-elektroniki ngokwayo.

Kumzobo we-wiring, ukwenzela ukuba ugweme ukuwela kunye nokunyanzeliswa kwemigca, inani elikhulu leempawu zokumisa zingasetyenziselwa umgca womhlaba. Imigca eyahlukeneyo ingasebenzisa imibala eyahlukeneyo kunye nemigca eyahlukeneyo ukuqinisekisa ukuba icacile kwaye iyabonakala. Kumacandelo ahlukeneyo, iimpawu ezikhethekileyo zingasetyenziswa, okanye nokuba Zoba iisekethe zeeyunithi ngokwahlukileyo, kwaye ekugqibeleni uzidibanise.

4. Lawula isikhokelo esisisiseko kwaye ufunde kwiischematics ezifanayo

Ukwakhiwa kwesakhelo sesekethe ye-elektroniki esisiseko kunye neendlela zokuzoba, iinjineli kufuneka zibe nobuchule, kungekhona nje ukukwazi ukuzoba ngokuthe ngqo ezinye iisekethe ezilula kunye neklasikhi zeeyunithi, kodwa kunye nokwenza isakhelo esipheleleyo seesekethe ze-elektroniki.

Kwelinye icala, musa ukungayihoyi into yokuba uhlobo olufanayo lweemveliso zombane zinento efanayo kwidayagram yesikimu. Iinjineli zinokusebenzisa ukuqokelelwa kwamava kwaye zifunde ngokupheleleyo kwimizobo yesekethe efanayo ukubuyisela umva umzobo weskim semveliso entsha.

5. Jonga kwaye ulungiselele

Emva kokuba umzobo weskim ugqityiwe, uyilo olungasemva lwe-PCB schematic lunokuthiwa lugqitywe emva kovavanyo kunye nokuqinisekiswa. Ixabiso legama lamacandelo anovakalelo kwiparamitha zonikezelo lwe-PCB kufuneka lijongwe kwaye lilungiswe. Ngokomzobo wefayile ye-PCB, umzobo weskim uyathelekiswa kwaye uhlalutywe ukuqinisekisa ukuba umzobo woyilo uhambelana ngokupheleleyo nomzobo wefayile.