Ukuthintela imingxuma kwiplating kunye ne-welding kubandakanya ukuvavanya iinkqubo ezintsha zokuvelisa kunye nokuhlalutya iziphumo. I-Plating kunye ne-welding voids zihlala zinezizathu ezibonakalayo, ezifana nohlobo lwe-solder paste okanye i-drill bit esetyenziswa kwinkqubo yokuvelisa. Abavelisi bePCB banokusebenzisa inani lezicwangciso ezingundoqo ukuchonga nokujongana noonobangela abaqhelekileyo bezi voids.

1.Lungisa ijiko lobushushu le-reflux

Enye yeendlela zokuthintela i-welding cavities kukulungelelanisa indawo ebalulekileyo ye-curve reflux. Ukunika amanqanaba ahlukeneyo exesha kunokunyusa okanye kunciphise amathuba okuba enze i-voids. Ukuqonda iimpawu ezifanelekileyo zegophe lokubuya kubalulekile kuthintelo oluyimpumelelo lwecango.

Okokuqala, jonga kwiiSetingi zangoku zexesha lokufudumala. Zama ukunyusa ubushushu be-preheating okanye ukwandisa ixesha lokufudumeza kwe-reflux curve. Imingxunya ye-Solder inokwakheka ngenxa yobushushu obungonelanga kwindawo yokufudumeza, ngoko ke sebenzisa ezi zicwangciso zokujongana nonobangela.

Iindawo zobushushu ezilinganayo zikwangunobangela oqhelekileyo kwi-welded voids. Amaxesha amafutshane okuntywila anokungavumeli onke amacandelo kunye neendawo zebhodi ukuba zifikelele kubushushu obufunekayo. Zama ukuvumela ixesha elongezelelweyo kule ndawo yegophe le-reflux.

2.Sebenzisa i-flux encinci

I-flux eninzi inokukhubeka kwaye ihlala ikhokelele kwi-welding. Enye ingxaki kwi-joint cavity: i-flux degassing. Ukuba i-flux ayinalo ixesha elaneleyo lokukhupha i-degass, igesi engaphezulu iya kubanjiswa kwaye i-void iya kwenziwa.

Xa i-flux eninzi isetyenziswe kwi-PCB, ixesha elifunekayo ukuze i-flux ikhutshwe ngokupheleleyo iyandiswa. Ngaphandle kokuba wongeza ixesha elongezelelweyo lokususa i-degassing, i-flux eyongezelelweyo iya kubangela i-weld voids.

Ngelixa ukongeza ixesha elingakumbi le-degassing kunokusombulula le ngxaki, kusebenza ngakumbi ukunamathela kumthamo we-flux efunekayo. Oku konga amandla kunye nezibonelelo kwaye kwenza ukuba amalungu acoceke.

3.Sebenzisa kuphela amasuntswana okubhola abukhali

Unobangela oqhelekileyo wemingxuma yokucwenga ayilunganga ngokugrunjwa kwemingxuma. Amasuntswana abuthuntu okanye ukungachaneki kakuhle kokomba kunokonyusa amathuba okwenziwa kobutyobo ngexesha lokomba. Xa ezi ziqwenga zincamathela kwiPCB, zenza iindawo ezingenanto ezingenakutyalwa ngobhedu. Oku kuphazamisa ukuqhuba, umgangatho kunye nokuthembeka.

Abavelisi banokuyisombulula le ngxaki ngokusebenzisa iintsimbi ezibukhali nezibukhali kuphela. Misela ishedyuli engaguqukiyo yokulola okanye ukubuyisela amasuntswana edrill, afana nekota. Oku kugcinwa rhoqo kuya kuqinisekisa ubulunga obungaguqukiyo bokomba kunye nokunciphisa ukubakho kobutyobo.

4.Zama uyilo lwetemplate ezahlukeneyo

Uyilo lwetemplate olusetyenziswe kwinkqubo yokubuyisela kwakhona lunokunceda okanye luthintele ukukhuselwa kwe-welded voids. Ngelishwa, akukho sicombululo sobukhulu obunye kukhetho loyilo lwetemplate. Olunye uyilo lusebenza ngcono ngeentlama ezahlukeneyo zesolder, i-flux, okanye iintlobo zePCB. Kungathatha uvavanyo kunye nempazamo ukufumana ukhetho lohlobo oluthile lwebhodi.

Ukufumana ngempumelelo uyilo lwetemplate elungileyo kufuna inkqubo yovavanyo elungileyo. Abavelisi kufuneka bafumane indlela yokulinganisa kunye nokuhlalutya umphumo we-formwork design kwi-voids.

Indlela ethembekileyo yokwenza oku kukwenza ibhetshi yePCBS ngoyilo oluthile lwethempleyithi kwaye emva koko uzihlole ngocoselelo. Iitemplate ezininzi ezahlukeneyo zisetyenziselwa ukwenza oku. Ukuhlolwa kufuneka kubonise ukuba yeyiphi i-formwork designs ine-avareji yenani lemingxuma ye-solder.

Isixhobo esiphambili kwinkqubo yokuhlola ngumatshini weX-reyi. I-X-reyi yenye yeendlela zokufumana i-welded voids kwaye iluncedo ngakumbi xa ujongene ne-PCBS encinci, epakishwe ngokuqinileyo. Ukuba nomatshini ofanelekileyo weX-reyi kuya kwenza inkqubo yokuhlola ibe lula kwaye isebenze ngakumbi.

5.Ukunciphisa izinga lokomba

Ukongeza kubukhali be-bit, isantya sokomba siya kuba nefuthe elikhulu kumgangatho wokucwenga. Ukuba isantya esincinci siphezulu kakhulu, siya kunciphisa ukuchaneka kunye nokwandisa amathuba okubunjwa kobutyobo. Izantya zokugrumba eziphezulu zinokunyusa umngcipheko wokuqhekeka kwePCB, isoyikise ukuthembeka kwesakhiwo.

Ukuba imingxuma kwi-coating isaxhaphakile emva kokulola okanye ukutshintsha i-bit, zama ukunciphisa izinga lokomba. Izantya ezicothayo zivumela ixesha elininzi lokubumba, ukucoca kwimingxuma.

Gcina ukhumbule ukuba iindlela zokuvelisa zendabuko azikho ukhetho namhlanje. Ukuba ukusebenza kakuhle kukuqwalaselwa ekuqhubeni amazinga aphezulu okomba, ushicilelo lwe-3D lunokuba lukhetho oluhle. I-PCBS eprintiweyo ye-3D yenziwe ngokufanelekileyo kuneendlela zemveli, kodwa ngokuchaneka okufanayo okanye okuphezulu. Ukukhetha i-PCB eprintiweyo ye-3D kunokungafuni ukugrunjwa kwimingxunya konke konke.

6.Namathela kwintlama ye-solder esemgangathweni

Kungokwemvelo ukujonga iindlela zokugcina imali kwinkqubo yokwenziwa kwePCB. Ngelishwa, ukuthenga intlama ye-solder enexabiso eliphantsi okanye ekumgangatho ophantsi kunokonyusa amathuba okwenza i-weld voids.

Iimpawu zeekhemikhali zeentlobo ezahlukeneyo ze-solder paste zichaphazela ukusebenza kwazo kunye nendlela abadibana ngayo ne-PCB ngexesha lenkqubo ye-reflux. Umzekelo, ukusebenzisa i-solder paste engenalo ilothe inokuncipha ngexesha lokupholisa.

Ukukhetha i-solder paste ekumgangatho ophezulu kufuna ukuba uqonde iimfuno zePCB kunye netemplate esetyenziswayo. I-solder paste etyebileyo iya kuba nzima ukungena kwitemplate enendawo encinci yokuvula.

Kunokuba luncedo ukuvavanya iipasti ze-solder ezahlukeneyo ngexesha elifanayo nokuvavanya iitemplates ezahlukeneyo. Ugxininiso lubekwe ekusebenziseni umthetho webhola emihlanu ukulungisa ubungakanani be-template aperture ukwenzela ukuba i-solder paste ihambelane netemplate. Umgaqo uthi abavelisi bayakusebenzisa iformwork enemingxuma efunekayo ukulingana iibhola ezintlanu zokuncamathelisa i-solder. Le ngcamango yenza lula inkqubo yokudala ulungelelwaniso lwetemplate yokuncamathisela yokuvavanya.

7.Nciphisa i-solder paste oxidation

I-Oxidation ye-solder paste idla ngokuvela xa kukho umoya omninzi okanye ukufuma kwindawo yokuvelisa. I-oxidation ngokwayo yonyusa amathuba okwenza i-voids, kwaye ikwacebisa ukuba umoya ogqithisileyo okanye ukufuma konyusa ngakumbi umngcipheko we-voids. Ukusombulula kunye nokunciphisa i-oxidation inceda ukukhusela i-voids ekwenzeni kunye nokuphucula umgangatho we-PCB.

Okokuqala jonga uhlobo lwe-solder paste esetyenzisiweyo. Intlama ye-solder enyibilikayo emanzini ithandeka ngakumbi kwi-oxidation. Ukongezelela, ukuguquguquka okwaneleyo kwandisa umngcipheko we-oxidation. Ngokuqinisekileyo, ukuguquguquka okukhulu kukwayingxaki, ngoko ke abavelisi kufuneka bafumane ibhalansi. Nangona kunjalo, ukuba i-oxidation iyenzeka, ukwandisa umthamo we-flux ngokuqhelekileyo kunokusombulula ingxaki.

Abavelisi be-PCB banokuthatha amanyathelo amaninzi ukuthintela i-plating kunye nemingxuma yokuwelda kwiimveliso zombane. I-Voids ichaphazela ukuthembeka, ukusebenza kunye nomgangatho. Ngethamsanqa, ukunciphisa amathuba okwenza i-voids kulula njengokutshintsha i-solder paste okanye ukusebenzisa uyilo olutsha lwe-stencil.

Ukusebenzisa indlela yokuvavanya-tshekisha-uhlalutyo, nawuphi na umenzi unokufumana kunye nokujongana neyona nto ibangela i-voids kwiinkqubo ze-reflux kunye ne-plating.