Ibhodi yesekethe ephezulu echanekileyo ibhekiselele ekusebenziseni umgca womgca wobubanzi / isithuba, imingxuma emincinci, ububanzi obuncinci bomsesane (okanye akukho bubanzi bendandatho) kunye nemingxuma engcwatywayo kunye neemfama ukufezekisa ukuxinana okuphezulu.
Ukuchaneka okuphezulu kuthetha ukuba isiphumo "sosihle, sincinci, sincinci, kwaye sincinci" siya kukhokelela kwiimfuno ezichanekileyo. Thatha ububanzi bomgca njengomzekelo:
0.20mm ububanzi bomgca, 0.16～0.24mm eveliswe ngokuhambelana nemimiselo ifanelekile, kwaye impazamo ngu (0.20±0.04) mm; ngelixa ububanzi bomgca we-0.10mm, iphutha (0.1±0.02) mm, ngokucacileyo Ukuchaneka kokugqibela kunyuswe ngumlinganiselo we-1, kwaye njalo akunzima ukuyiqonda, ngoko iimfuno zokuchaneka okuphezulu aziyi kuxoxwa. ngokwahlukeneyo. Kodwa yingxaki ebalaseleyo kwitekhnoloji yemveliso.
Ubuchwephesha bocingo oluncinci kunye noluxineneyo
Kwixesha elizayo, ububanzi bomgca woxinaniso oluphezulu/i-pitch iya kusuka ku-0.20mm-0.13mm-0.08mm-0.005mm ukuhlangabezana neemfuno ze-SMT kunye ne-multi-chip packaging (Mulitichip Package, MCP). Ngoko ke, iteknoloji elandelayo iyafuneka.
①Substrate
Ukusebenzisa i-copper foil encinci okanye i-ultra-thin (<18um) i-substrate kunye neteknoloji yonyango esemgangathweni.
②Inkqubo
Ukusebenzisa ifilimu eyomileyo eyomileyo kunye nenkqubo yokuncamathisela emanzi, ifilimu eyomileyo enqabileyo kunye nelungileyo inokunciphisa ukuphambuka kobubanzi bomgca kunye neziphene. Ifilimu emanzi inokuzalisa izithuba ezincinci zomoya, ukwandisa ukunamathela kwi-interface, kunye nokuphucula ukunyaniseka kwecingo kunye nokuchaneka.
③Ifilimu ye-Electrodeposited photoresist
I-Electro-deposited Photoresist (ED) isetyenziswa. Ubukhulu bayo bunokulawulwa kuluhlu lwe-5-30 / um, kwaye lunokuvelisa iingcingo ezilungileyo ezigqibeleleyo. Ifaneleka ngakumbi kububanzi obumxinwa bomsesane, akukho bubanzi beringi kunye nepleyiti epheleleyo ye-electroplating. Okwangoku, kukho imigca yemveliso ye-ED engaphezu kweshumi emhlabeni.
④ Itekhnoloji yokuvezwa kokukhanya okunxuseneyo
Ukusebenzisa iteknoloji yokuvezwa kokukhanya okuhambelanayo. Ekubeni ukubonakaliswa kokukhanya okuhambelanayo kunokoyisa impembelelo yokwahluka kobubanzi bomgca obangelwa yimisebe ye-oblique yomthombo wokukhanya "we-point", ucingo oluhle kunye nobukhulu obuchanekileyo bomgca kunye nemiphetho egudileyo inokufumaneka. Nangona kunjalo, izixhobo ze-parallel exposure ziyabiza, utyalo-mali luphezulu, kwaye kufuneka lusebenze kwindawo ecocekileyo kakhulu.
⑤Itekhnoloji yokuhlola okuzenzekelayo
Ukusebenzisa iteknoloji yokuhlola okuzenzekelayo. Le teknoloji iye yaba yindlela efunekayo yokufumanisa kwimveliso yeengcingo ezilungileyo, kwaye ikhuthazwa ngokukhawuleza, isetyenziswe kwaye iphuhliswe.
I-EDA365 iForam yoMbane
Itekhnoloji yeMicroporous
Imingxuma esebenzayo yeebhodi eziprintiweyo ezisetyenziselwa ukunyuswa komphezulu wetheknoloji ye-microporous zisetyenziselwa ukudibanisa kombane, okwenza ukusetyenziswa kobuchwephesha be-microporous kubaluleke kakhulu. Ukusebenzisa izixhobo eziqhelekileyo zokugaya kunye noomatshini bokugaya i-CNC ukuvelisa imingxuma emincinci kunokusilela okuninzi kunye neendleko eziphezulu.
Ngako oko, ubuninzi beebhodi eziprintiweyo zigxininise kakhulu ekuphuculeni iingcingo kunye neepads. Nangona iziphumo ezinkulu zifunyenwe, amandla ayo alinganiselwe. Ukuphucula ngakumbi ukuxinana (okufana neengcingo ezingaphantsi kwe-0.08mm), ixabiso liyenyuka. , Ke jika usebenzise iimicropores ukuphucula uxinaniso.
Kwiminyaka yakutshanje, oomatshini bokuqhuba amanani kunye neteknoloji ye-micro-drill baye benza inkqubela phambili, kwaye ngoko ke iteknoloji ye-micro-hole iphuhliswe ngokukhawuleza. Le yeyona nto ibalaseleyo kwimveliso yePCB yangoku.
Kwixesha elizayo, ubuchwephesha bokubumba umngxuma omncinci buya kuxhomekeka ikakhulu kumatshini wokugrumba we-CNC kunye neentloko ezincinci ezigqwesileyo, kunye nemingxuma emincinci eyenziwe ngetekhnoloji ye-laser isengaphantsi kwezo zakhiwe ngoomatshini bokomba be-CNC ngokwembono yeendleko kunye nomgangatho womngxuma. .
① CNC umatshini wokomba
Okwangoku, itekhnoloji yomatshini wokugaya i-CNC yenze inkqubela phambili kunye nenkqubela phambili. Kwaye kwaseka isizukulwana esitsha somatshini wokomba we-CNC ophawulwa ngokugrumba imingxunya emincinci.
Ukusebenza kakuhle kokugaya imingxuma emincinci (ngaphantsi kwe-0.50mm) yomatshini wokugaya i-micro-hole i-1 amaxesha aphezulu kunomatshini oqhelekileyo we-CNC wokugaya, kunye nokungaphumeleli okumbalwa, kunye nesantya sokujikeleza ngu-11-15r / min; inokugrumba imingxuma emincinci eyi-0.1-0.2mm, isebenzisa umxholo we-cobalt ophezulu. I-drill bitana ekumgangatho ophezulu inokwemba iipleyiti ezintathu (1.6mm/block) ezipakishwe phezulu kwenye. Xa i-drill bit yaphukile, inokuyeka ngokuzenzekelayo kwaye ichaze isikhundla, ibuyisele ngokuzenzekelayo i-drill bit kwaye ikhangele ububanzi (ithala leencwadi lingakwazi ukubamba amakhulu amaqhekeza), kwaye inokulawula ngokuzenzekelayo umgama oqhubekayo phakathi kwencam ye-drill kunye nesigqubuthelo. kunye nobunzulu be-drilling, ngoko imingxuma eyimfama inokugrunjwa , Ayiyi kulimaza i-countertop. Umphezulu wetafile womatshini wokugaya we-CNC wamkela i-cushion yomoya kunye nohlobo lwe-magnetic levitation, olunokuthi luhambe ngokukhawuleza, lube lula kwaye luchaneke ngakumbi ngaphandle kokukrwela itafile.
Oomatshini bokugrumba abanjalo bafunwa ngoku, njengeMega 4600 esuka ePrurite eItali, i-Excellon 2000 series eUnited States, kunye neemveliso zesizukulwana esitsha ezivela eSwitzerland naseJamani.
②Ukugrumba ngelaser
Kukho ngokwenene iingxaki ezininzi ngoomatshini bokomba be-CNC besiqhelo kunye namasuntswana okugrumba imingxuma emincinci. Ithintele inkqubela yeteknoloji ye-micro-hole, ngoko ukuchithwa kwelaser kuye kwatsala umdla, uphando kunye nokusetyenziswa.
Kodwa kukho ukusilela okubulalayo, oko kukuthi, ukubunjwa komngxuma wesigodlo, okuba nzima ngakumbi njengoko ubukhulu beplate bukhula. Idityaniswe nongcoliseko lobushushu obuphezulu (ingakumbi iibhodi ze-multilayer), ubomi kunye nokugcinwa komthombo wokukhanya, ukuphinda-phinda kwemingxuma enomhlwa, kunye neendleko, ukukhuthazwa kunye nokusetyenziswa kwemingxuma emincinci ekuveliseni iibhodi eziprintiweyo zithintelwe. . Nangona kunjalo, i-laser ablation isasetyenziswa kwiipleyiti ezincinci kunye noxinzelelo oluphezulu lwe-microporous, ngakumbi kwi-MCM-L ye-high-density interconnect (HDI) iteknoloji, efana ne-polyester film etching kunye ne-metal deposition kwi-MCMs. (I-teknoloji ye-Sputtering) isetyenziswe kwi-interconnection ye-high-density interconnection.
Ukubunjwa kwee-vias ezingcwatywe kwiibhodi ezidityanisiweyo zoqhagamshelwano ezininzi ezingcwatywe kwaye zingaboni ngezakhiwo nazo zingasetyenziswa. Nangona kunjalo, ngenxa yophuhliso kunye nokuphumelela kwezobuchwepheshe koomatshini bokwemba be-CNC kunye ne-micro-drills, bakhuthazwa ngokukhawuleza kwaye basetyenziswa. Ke ngoko, ukusetyenziswa kwe-laser yokubhola kwiibhodi zeesekethe zokunyuka komhlaba akukwazi ukwenza indawo ephezulu. Kodwa isenayo indawo kwindawo ethile.
③Ubuchwephesha bokungcwatywa, ukungaboni, kunye nomngxuma
Ukungcwatywa, ukungaboni, kunye netekhnoloji yokudibanisa emngxunyeni ikwayindlela ebalulekileyo yokwandisa ukuxinana kweesekethe eziprintiweyo. Ngokuqhelekileyo, imingxunya engcwatyiweyo neyimfama yimingxuma emincinci. Ukongeza ekunyuseni inani le-wiring ebhodini, imingxunya engcwatywayo kunye neemfama ziyadityaniswa ngumaleko "okufutshane" wangaphakathi, onciphisa kakhulu inani lemingxunya eyenziweyo, kunye nokubekwa kwediski yodwa kuya kuncitshiswa kakhulu, ngaloo ndlela kwandisa umbane. inani le-wiring esebenzayo kunye ne-inter-layer interconnection ebhodini, kunye nokuphucula ukuxinana koqhagamshelwano.
Ngoko ke, ibhodi ye-multi-layer kunye nendibaniselwano yokungcwatywa, imfama, kunye ne-thread-mingxuma ine-3 ubuncinane amaxesha aphezulu oxinaniso lwe-interconnection density kunesakhiwo sebhodi esiqhelekileyo esigcweleyo phantsi kobukhulu obufanayo kunye nenani leeleya. Ukuba ungcwatywe, uyimfama, Ubungakanani beebhodi eziprintiweyo ezidityaniswe ngemingxuma ziya kuncitshiswa kakhulu okanye inani leeleya liya kuncitshiswa kakhulu.
Ke ngoko, kwiibhodi eziprintiweyo ezikumgangatho ophezulu, ubuchwephesha obungcwatyiweyo kunye nemingxuma engaboniyo buye basetyenziswa kakhulu, kungekuphela nje kwiibhodi eziprintiweyo eziphezulu kwiikhompyuter ezinkulu, izixhobo zonxibelelwano, njl. Ikwasetyenziswa kakhulu ebaleni, nakwiibhodi ezibhityileyo, ezinje ngePCMCIA, Smard, IC amakhadi kunye nezinye iibhodi ezinomaleko ezintandathu.
Iibhodi zesekethe eziprintiweyo ezinezakhiwo ezingcwatyelwe kunye nezingaboniyo zigqitywe ngokubanzi ngeendlela zokuvelisa "ibhodi engaphantsi", nto leyo ethetha ukuba kufuneka zigqitywe ngokucofa kaninzi, ngokugrumba, kunye nokufakwa komngxuma, ngoko ke ukubeka ngokuchanekileyo kubaluleke kakhulu .