Ungayenza njani into ephezulu ye-PCB?

Ibhodi yesekethe ePhakamileyo yokuSebenzisa iBightion ibhekisa ekusetyenzisweni kobubanzi bemigangatho yelayini elungileyo / indawo, imingxunya emincinci, ububanzi be-ring, okanye akukho mingxunya ye-ring) kunye nemingxunya engaboniyo yokufezekisa uxinzelelo oluphezulu.

Imbonakalo ephezulu ithetha ukuba iziphumo ze "mncinci, ezincinci, ezincinci, kwaye zinqabile" ziya kuba zinokukhokelela kwimfuno eziphezulu. Thatha ububanzi bomgca njengomzekelo:

I-0.20mm ububanzi, 0.16 ~ 0.2mmm iveliswe ngokwemigaqo ifanelekile, kwaye impazamo yi (0.20) mm; Ngelixa ilayini yobubanzi be-0.10mm, impazamo yi (0.1 ± 0.02) mm, ngokuvakala ukuba ukuchaneka kwe-1, ngokuvakala kunyuke ngenxalenye ye-1, ngokunjalo akunzima ukuyiqonda, ke iimfuno eziphezulu zokuchazela aziyi kuxoxwa ngokwahlukeneyo. Kodwa yingxaki ebalaseleyo kwitekhnoloji yemveliso.

Itekhnoloji encinci neyamdaka

Kwixa elizayo, ububanzi bomgangatho ophezulu obanzi / ububanzi buya kuvela kwi-0.20mm-0.13mm-0mms-0.00mm-0mm-0mms-0.00mm-0mm-0mm-0mms-0,00mm-0.00mm yephakheji ye-SMT kunye ne-MCICICK, MCP). Ke ngoko, kufuneka le teknoloji ilandelayo.
①substrate

Sebenzisa i-chest okanye i-ultra-til yobhedu (<18um) itekhnoloji yonyango.
②upess

Sebenzisa ifilimu eyomileyo kunye nenkqubo yedlelo emanzi, ifilimu emnyama nefanelekileyo yefilimu inciphisa ububanzi obunamanzi kunye neziphene. Ifilimu emanzi inokugcwalisa izithuba zomoya ezincinci, i-stashes yokunyusa i-adhession, kunye nokuphucula ingqibelelo kunye nokuchaneka.
Ifilimu yefoto

I-electro-iffered (ed) isetyenzisiwe. Ubunzima bayo bunokulawulwa kuluhlu lwe-5-30 /m, kwaye inokuvelisa iingcingo ezintle ezigqibeleleyo. Ifanelekile ngakumbi kububanzi be-ring exineneyo, akukho nsisa yobubanzi kunye ne-elektronictroplaitha epheleleyo. Okwangoku, zininzi ngaphezu kweemveliso ezilishumi lendalo emhlabeni.
④ Itekhnoloji yokukhanya yokukhanya

Sebenzisa itekhnoloji yokukhanya yokukhanya. Kuba ukubonakaliswa kokukhanya okufanayo kunokuboyisa impembelelo yophawu lobubanzi bomgca obangelwe yimithombo yokukhanya kwe "Point", icingo elihle elinokufumaneka. Nangona kunjalo, izixhobo zokuveza ezifanayo ziyabiza, utyalomali luphezulu, kwaye kufuneka lusebenze kwindawo ecocekileyo.
Itekhnoloji yokuhlola eyaphesheyo

Sebenzisa itekhnoloji yokuhlola ngokuzenzekelayo. Le teknoloji iye yaba yindlela ebonakalayo yokufumanisa ukuveliswa kweengcingo ezilungileyo, kwaye ikhuthazwe ngokukhawuleza, isetyenziswe kwaye iphuhlisiwe.

Iforamu ye-EDA365 ye-elektroniki

 

Itekhnoloji ye-microporaule

 

 

Imingxunya esebenzayo yeebhodi eziprintiweyo ezisetyenziselwa ukuphakanyiswa kwetekhnoloji ye-microporaulrous ikakhulu isetyenziselwa ukudityaniswa kombane, nto leyo eyenza ukusetyenziswa kwetekhnoloji ye-microparough ibaluleke ngakumbi. Sebenzisa izixhobo zokuqhuba eziqhelekileyo kunye noomatshini bokuqhuba kwe-CNC ukuvelisa imingxunya encinci kuneentsilelo ezininzi kunye neendleko eziphezulu.

Ke ngoko, ukuxinana okuphezulu kweebhodi eziprintiweyo kugxile kakhulu ekuphuculeni iingcingo kunye neepads. Nangona iziphumo ezintle zifezekisiwe, amandla alo alinganiselwe. Ukuqhubela phambili ukuphucula ukuxinana (njengamacingo angaphantsi kwe-0.08mm), iindleko zinyuka. , Jikela ukuze usebenzise i-middores yokuphucula uxiniso.

Kwiminyaka yakutshanje, oomatshini bokuqhuba kwamanani kunye netekhnoloji ye-micro-drill yenze i-frietthrought, kwaye ke itekhnoloji ye-micro-hole iphuhlise ngokukhawuleza. Le yeyona nto ibalulekileyo kwimveliso yangoku yePCB.

Kwixesha elizayo, itekhnoloji yokwakha i-Micro-Hole iya kuthembela ikakhulu koomatshini bokuqhuba abaphumeleleyo kwi-CNC kunye neentloko ezincinci ezibalaseleyo, kwaye imingxunya emincinci eyenziwa yitekhnoloji ye-laser isayingaphantsi koomatshini be-CNC ngokubhekisele kwimbono yexabiso le-CNC kunye nomgangatho wexabiso.
Umatshini wokuqhuba kwe-①cnc

Okwangoku, itekhnoloji yomatshini we-CNC Dringing wenze impumelelo entsha kunye nenkqubela phambili. Kwaye yenze isizukulwana esitsha somatshini we-CNC obandakanyiweyo ngokuqhuba imingxunya encinci.

Ukusebenza kakuhle kwemingxunya encinci (ngaphantsi kwe-0.50mm) yomatshini wokugqobhoza ama-micro-Hole ngamaxesha am aphezulu kunelo yomatshini wokuqhuba okuqhelekileyo ye-CNC, kwaye isantya esimbalwa siyi-11-15r / i-5r / imiz. Inokuqhuba i-drill 0.1-0.2mm micro-imingxunya, usebenzisa umxholo omkhulu we-cobalt. Umgangatho ophezulu we-rill rill inokuthi idle iipleyiti ezintathu (i-1.6mm / ibhlokhi) ithethwe ngaphezulu kwenye. Xa i-Drill iqhekekile, inokuma ngokuzenzekelayo kwaye ixele isikhundla, ibeke ngokuzenzekelayo i-Drill Tit kwaye ijonge i-dialting (ilayibrari enobunzulu, ke yona ingayikhathazi, ayiyi konakalisa i-countertop. Itheyibhile ephezulu yoomatshini we-CNC yokuqhuba i-CAUCIIION kunye nohlobo lwe-Magneticication, enokuhamba ngokukhawuleza, ilula kwaye ingakumbi ngaphandle kokukrola itafile.

Olo machibi luqhutywa ngoku, njenge-mega 4600 ukusuka e-Itali, i-Excellon 2000 e-United States, kunye neemveliso zesizukulwana ezintsha eSwitzerland naseJamani.
I-②laser iqhuba

Kukho iingxaki ezininzi ngoomatshini bokumba oqhelekileyo we-CNC kwaye bamba ii-bits ukuya kwi-Drill Hales. Ithintele inkqubela phambili yetekhnoloji ye-Micro-Hole, ke i-laser ithathe inyameko, uphando kunye nesicelo.

Kodwa kukho isikroba esibulalayo, oko kukuthi, ukumiliselwa komngxunya wokuhonjiswa, okwenzeka kakhulu njengoko ukunyuka kweplate kunyuka. Ukudityaniswa nongcoliseko lobushushu obuphezulu (ngakumbi iBhodi yeZityalo eziZiqu eziZinto eziZigidi), ubomi kunye nokugcinwa komthombo wokukhanya, ukuphinda kwenziwe imingxunya yokukhanya, kunye neendleko, ukukhuthaza kunye nokusetyenziswa kweebhodi eziprintiweyo kuthintelwe. Nangona kunjalo, i-laser isetyenziswa kwimigca emincinci ye-microcrocrous ecekeceke kwaye ingakumbi kwi-MCM-L kwi-MCM-L i-Mcm-L icconter proteraguct (HDI) yeTekhnoloji, efana ne-polyester filsing kunye ne-Polyester Founting kunye ne-Polyester Founting kunye ne-Polyester Founting kunye ne-Polyster Founting kunye ne-Polyster Founting kunye ne-Pibection kwi-MCMS. .

Ukuqulunqwa kwe-Vias Rias eRias kwiBhodi ye-Mubneity ephezulu ye-Mulnilater kunye nokungcwaba kunye nemfama ngezakhiwo nako kunokusetyenziswa. Nangona kunjalo, ngenxa yophuhliso kunye nezono zetekhnoloji yoomatshini bokumbandela kwe-CNC kunye needrile ezincinci, zakhuthazwa ngokukhawuleza zaza zasetyenziswa. Ke ngoko, ukusetyenziswa kwe-irser drive kwi-Mountat Mountats zesekethe akunakuba sisikhundla esibalaseleyo. Kodwa isayindawo ethile kwintsimi ethile.

 

I-徽标 i-徽标 I-FORE, kunye neTekhnoloji yeHale

Ukungcwatywa, imfama, kwaye ngetekhnoloji yokudibanisa iHole yindlela ebalulekileyo yokwandisa ukuxinana kweziphaluka ezishicilelweyo. Ngokubanzi, imingxunya engcwatywe kwaye imfama ihamba imingxunya emincinci. Ukongeza ukwandisa inani le-wiring kwiBhodi, imingxunya engcwatywe kunye nemfama idityaniswe yi-Inter engaphakathi, kwaye inciphisa kakhulu i-diring yediski esebenzayo, kwaye iphucula inani le-wirion.

Ke ngoko, ibhodi yebhodi yamanzi amaninzi ngendibaniselwano yokufikelwa, eyimfama, kwaye kwimingxunya inamaxesha ama-3 ubuncinci ukungqubana okuphezulu kunobukhulu beBhodi eNgcwele eHight-Hoble-gong-Hible-gong-Hoble-gong-gost Ukuba ungcwatywe, ongaboniyo, ubungakanani beebhodi eziprintiweyo ezihlanganisene kwimingxunya ziya kuncitshiswa kakhulu okanye inani leendawo ziya kuncitshiswa kakhulu.

Ke ngoko, kwiBhodi ePhintelweyo ePriveded ePrive-ePrive-eRight, itekhnoloji ye-Hole ye-Hole iye yasetyenziswa, kungekuphela kwiBhodi ePript ePript kwiikhompyuter ezinkulu, izixhobo zonxibelelwano, njl njl. Isetyenziswe ngokubanzi ebaleni, nakwiibhodi ezithile ezincinci, ezinjenge-PCMCIA, i-smad, amakhadi e-IC kunye nezinye iibhodi ezinemigangatho emithandathu.

Iibhodi zesekethe eziprintiweyo kunye nezakhiwo zokungcwaba ezingcwatywayo kunye nemfama zigqityiwe ngeendlela "zeBhodi" yeBhodi, okuthetha ukuba kufuneka zigqitywe ngokucinezelwa ngamandla, ukuqhuba, ukubekwa kweHole kubaluleke kakhulu.