Uyophula njani ingxaki yefilimu ye-PCB ye-electroplating sandwich?

Ngophuhliso olukhawulezayo lweshishini le-PCB, i-PCB ihamba ngokuthe ngcembe ukuya kwicala lemigca echanekileyo ephezulu, imingxuma emincinci, kunye nemilinganiselo ephezulu (6: 1-10: 1). Iimfuno zobhedu lomngxuma ziyi-20-25Um, kwaye isithuba somgca we-DF singaphantsi kwe-4mil. Ngokubanzi, iinkampani zemveliso yePCB zineengxaki ngefilimu ye-electroplating. Ikliphu yefilimu iya kubangela isiphaluka esifutshane ngokuthe ngqo, esiya kuchaphazela izinga lesivuno sebhodi ye-PCB ngokuhlolwa kwe-AOI. Ikliphu yefilimu enzulu okanye amanqaku amaninzi awanakulungiseka ngokuthe ngqo akhokelela kwi-scrap.

 

 

Uhlalutyo lomgaqo wefilimu yesandwich ye-PCB
① Ubukhulu bobhedu besekethe yokubeka ipateni bukhulu kunobunzima befilimu eyomileyo, eya kubangela ukubamba ifilimu. (Ubukhulu befilimu eyomileyo esetyenziswa ngumzi-mveliso we-PCB jikelele yi-1.4mil)
② Ubukhulu bobhedu kunye ne-tin yesekethe yokubeka ipateni idlula ubukhulu befilimu eyomileyo, enokubangela ukuba ifilimu ibambe.

 

Uhlalutyo lwezizathu zokuxina
①Ipateni yokucwenga ingxinano yangoku inkulu, kwaye i-copper plating ingqingqwa kakhulu.
②Akukho mgca wecala kwiziphelo zombini zebhasi ye-fly, kwaye indawo ephezulu yangoku igqunywe ngefilimu eshinyeneyo.
③Iadaptha ye-AC inomsinga omkhulu kuneyona bhodi yemveliso iseti yangoku.
④Icala le-C/S kunye necala le-S/S libuyiselwe umva.
⑤I-pitch incinci kakhulu kwifilimu ebambayo yebhodi ene-2.5-3.5mil pitch.
⑥Usasazo lwangoku alulingani, kwaye i-cylinder yobhedu ayicocanga i-anode ixesha elide.
⑦ Igalelo elingalunganga langoku (faka imodeli engalunganga okanye faka indawo engalunganga yebhodi)
⑧Ixesha lokukhusela langoku lebhodi yePCB kwi-cylinder yethusi lide kakhulu.
⑨Uyilo loyilo lweprojekthi alunangqiqweni, kwaye indawo esebenzayo ye-electroplating yemizobo enikezelwe yiprojekthi ayilunganga.
⑩Isikhewu somgca webhodi yePCB sincinci kakhulu, kwaye ipateni yesekethe yebhodi enobunzima obuphezulu kulula ukuyicofa ifilimu.