Ukuhlelwa kwezinto eziphambili ze-PCB kubandakanya oku kulandelayo: i-bai isebenzisa i-FR-4 (isiseko selaphu leglasi yeglasi), i-CEM-1/3 (ifiber yeglasi kunye ne-substrate ehlanganisiweyo yephepha), i-FR-1 (i-laminate ye-copper esekelwe ephepheni), isiseko sesinyithi Iilaminates zeCopper (ikakhulukazi i-aluminiyam-based, ezimbalwa zisekelwe kwintsimbi) zezona ntlobo zixhaphakileyo zemathiriyeli ngoku, ngokubanzi zibizwa ngokuba ziiPCB eziqinileyo.

Ezokuqala ezintathu zifanelekile ngokubanzi kwiimveliso ezifuna ukusebenza okuphezulu kokugqunywa kwe-elektroniki, okufana neebhodi zokuqinisa i-FPC, iipadi zokomba ze-PCB, i-mesons yeglasi yefiber, i-potentiometer carbon film eprintwe iibhodi zegilasi zefiber, iigiya ezichanekileyo zinkwenkwezi (i-wafer grinding), amaPhepha ovavanyo oluchanekileyo, umbane. (zombane) izixhobo zokugquma izikhewu zokuhlala, iipleyiti zokufakelwa kwe-insulation, iipleyiti zokugquma i-transformer, iindawo zokugquma iimoto, iigiya zokugaya, iipleyiti zokugquma ze-elektroniki, njl.njl.

I-laminate yentsimbi esekwe kwintsimbi yimathiriyeli esisiseko kushishino lwe-elektroniki, ikakhulu esetyenziswa ekuqhubeni nasekuveliseni iibhodi zesekethe eziprintiweyo (PCB), ezisetyenziswa ngokubanzi kwiimveliso zombane ezinje ngoomabonakude, oonomathotholo, iikhompyutha, iikhompyutha, kunye neselula. unxibelelwano.