Ngenxa yenkqubo entsonkothileyo yokwenziwa kwePCB, kucwangciso nolwakhiwo lwemveliso ekrelekrele, kuyafuneka ukuba kuqwalaselwe umsebenzi onxulumeneyo wenkqubo kunye nolawulo, emva koko uphumeze ukuzenzela, ulwazi kunye noyilo olukrelekrele.
Ukuhlelwa kwenkqubo
Ngokwenani leeleya ze-PCB, yahlulwe yaba ngamacala-linye, amacala amabini, kunye neebhodi ezinomaleko amaninzi. Iinkqubo ezintathu zebhodi azifani.
Akukho nkqubo yangaphakathi yomaleko yeepaneli zecala elinye kunye necala eliphindwe kabini, ngokusisiseko ukusika-ukugaya-iinkqubo ezilandelayo.
Iibhodi ezininzi ziya kuba neenkqubo zangaphakathi
1) Ukuhamba kwenkqubo yephaneli enye
Ukusika kunye nokuhlelwa → ukugrumba → imizobo engaphandle yebhodi → (ibhodi epheleleyo yokutyabeka yegolide) → ukuhombisa → uhlolo → isigqubuthelo semaski sesilika → (umgangatho womoya oshushu) → abalinganiswa besikrini sesilika → ukusetyenzwa kwemilo → uvavanyo → ukuhlola
2) Inkqubo yokuhamba kwebhodi yokutshiza yetoti enamacala amabini
Ukusika umgca wokusila → ukugrumba → ukujiya kobhedu olunzima → umaleko wangaphandle wemizobo → ukucakwa kwenkcenkce, ukuqhotyoshwa kwenkcenkce, ukucholwa ukususwa kwenkcenkce → ukomba okwesibini → ukuhlola → imaski yesolder yoshicilelo lwesikrini → iplagi etyalwe ngegolide → umgangatho womoya oshushu → abalinganiswa besikrini sesilika → ukusetyenzwa kwemilo → uvavanyo → uvavanyo →
3) Inkqubo yokubeka i-nickel-gold enamacala amabini
Ukusika umgca wokusila → ukomba → ukujiya kobhedu olunzima → imizobo yangaphandle yenickel, ukususwa kwegolide kunye nokuthunga → ukomba okwesibini → uhlolo → isigqubuthelo soshicilelo semaski solder → abalinganiswa boshicilelo lwesikrini → ukusetyenzwa kwemilo → uvavanyo → ukuhlola
4) Inkqubo yokutshiza ngetoti yamacandelo amaninzi
Ukusika kunye nokusila → ukugrumba imingxuma yokubeka → imizobo yangaphakathi yomaleko → ukuhombisa umaleko wangaphakathi → ukuhlola → ukwenza mnyama → ukunyibilika → ukugrumba → ukujiya kobhedu olunzima → umzobo wangaphandle wemizobo → ukucakwa kwenkcenkce, ukugrumba ukususwa kwetoti → ukugrumba okwesibini → ukuhlola →Imaski yesilika yesikrini -Plated iplagi→Umgangatho womoya oshushu→Oonobumba besikrini sesilika→Ukusetyenzwa kwemilo→Uvavanyo→Ukuhlola
5) Inkqubo yokuhamba kwe-nickel kunye negolide yokubeka kwiibhodi ezininzi
Ukusika kunye nokusila → ukugrumba imingxuma yokubeka → imizobo yangaphakathi yomaleko → ukuhombisa umaleko wangaphakathi → ukuhlola → ukwenza mnyama → ukunyibilika → ukugrumba → ukujiya kobhedu olunzima → umaleko wangaphandle wemizobo → ukucakwa kwegolide, ukususwa kwefilimu kunye nokurhweba → ukomba okwesibini → ukuhlola → imaski yoshicilelo abasebenzi boshicilelo lwekhusi → ukusetyenzwa kwemilo → uvavanyo → uhlolo
I-6) Inkqubo yokuhamba kwepleyiti ye-nickel yegolide ye-multi-layer immersion plate yegolide
Ukusika kunye nokusila → ukugrumba imingxuma yokubeka → imizobo yangaphakathi yomaleko → ukuhombisa umaleko wangaphakathi → ukuhlola → ukwenza mnyama → ukunyibilika → ukugrumba → ukujiya kobhedu olunzima → umzobo wangaphandle wemizobo → ukucakwa kwenkcenkce, ukugrumba inkonkxa → ukomba wesibini → ukuhlola →Imaski yesilika yesikrini IGolide yeNikel yokuntywiliselwa→abalinganiswa besikrini sesilika→Ukusetyenzwa kwemilo→Uvavanyo→Ukuhlola
Imveliso yangaphakathi (ugqithiselo lwegraphic)
Uluhlu lwangaphakathi: ibhodi yokusika, i-inner layer pre-processing, i-laminating, i-exposure, uxhumano lwe-DES
Ukusika (Ukusikwa kwebhodi)
1) Ibhodi yokusika
Injongo: Sika izinto ezinkulu kubukhulu obuchazwe yi-MI ngokweemfuno zomyalelo (unqumle i-substrate impahla kubungakanani obufunwa ngumsebenzi ngokweemfuno zokucwangciswa koyilo lwangaphambi kokuveliswa)
Iimathiriyeli ekrwada eziphambili: iplate yesiseko, iblade yesarha
I-substrate yenziwe kwiphepha lobhedu kunye ne-insulating laminate. Kukho imilinganiselo yobukhulu obahlukeneyo ngokweemfuno. Ngokobunzima bobhedu, bunokwahlulwa ibe yi-H / H, 1OZ/1OZ, 2OZ/2OZ, njl.
Ukulumkela:
a. Ukuze ugweme impembelelo yebhodi yomgca webhodi kumgangatho, emva kokusika, umphetho uya kuphononongwa kwaye ujikelezwe.
b. Ukuqwalasela impembelelo yokwandiswa kunye nokunciphisa, ibhodi yokusika iyabhaka ngaphambi kokuba ithunyelwe kwinkqubo
c. Ukusika kufuneka kuhlawule ingqalelo kumgaqo wolwalathiso oluhambelanayo lomatshini
I-Edging / rounding: i-polish polishing isetyenziselwa ukususa iifayili zeglasi ezishiywe ngama-angles afanelekileyo emacaleni amane ebhodi ngexesha lokusika, ukwenzela ukunciphisa imikrwelo / imikrwelo kwindawo yebhodi kwinkqubo yokuvelisa elandelayo, kubangela iingxaki ezifihliweyo zekhwalithi.
Ipleyiti yokubhaka: susa umphunga wamanzi kunye nokuguquguquka kwezinto eziphilayo ngokubhaka, ukukhulula uxinzelelo lwangaphakathi, ukukhuthaza ukusabela kwe-cross-linking, kunye nokwandisa ukuzinza kwe-dimensional, ukuzinza kweekhemikhali kunye namandla omatshini wepleyiti.
Amanqaku olawulo:
Iphepha lezinto eziphathekayo: ubungakanani bepaneli, ubukhulu, uhlobo lweshiti, ubukhulu bobhedu
Ukusebenza: ixesha lokubhaka / ubushushu, ukuphakama kokupakisha
(2) Ukuveliswa komgangatho wangaphakathi emva kwebhodi yokusika
Umsebenzi kunye nomgaqo:
Icwecwe elingaphakathi lobhedu elihlanjululweyo yiplate yokugaya yomiswa yiplate yokugaya, kwaye emva kokuba ifilimu eyomileyo i-IW iqhotyoshelweyo, ifakwe ukukhanya kwe-UV (imitha ye-ultraviolet), kwaye ifilimu eyomileyo evezwayo iba nzima. Ayinakunyibilika kwi-alkali ebuthathaka, kodwa inokunyibilika kwi-alkali eyomeleleyo. Inxalenye engabonakaliyo inokuchithwa kwi-alkali ebuthakathaka, kwaye isiphaluka sangaphakathi kukusebenzisa iimpawu zezinto eziphathekayo ukudlulisa imizobo kwindawo yobhedu, oko kukuthi, ukuhanjiswa komfanekiso.
Iinkcukacha
Umqalisi we-photosensitive ekuchaseni kwindawo evezwayo ithatha iifotoni kwaye ibole ibe yi-radicals yamahhala. I-radicals yamahhala iqala ukusabela okunqamlezileyo kwe-monomers ukwenza i-spatial network macromolecular structure engenakunyibilika kwi-alkali edibeneyo. Iyanyibilika kwi-alkali exutywe emva kokusabela.
Sebenzisa ezi zimbini zibe neepropati ezahlukeneyo ze-solubility kwisisombululo esifanayo ukudlulisa ipateni eyilwe kwi-negative kwi-substrate ukugqiba ukuhanjiswa komfanekiso).
Ipateni yesekethe idinga ubushushu obuphezulu kunye neemeko zokufuma, ngokuqhelekileyo zifuna ukushisa kwe-22 +/-3 ℃ kunye nomswakama we-55 +/-10% ukukhusela ifilimu ekukhubazekeni. Uthuli olusemoyeni lufuneka ukuba lube phezulu. Njengoko ubuninzi bemigca bukhula kwaye imigca iba yincinci, umxholo wothuli ungaphantsi okanye ulingana ne-10,000 okanye ngaphezulu.
Intshayelelo yezinto:
Ifilimu eyomileyo: I-photoresist yefilimu eyomileyo ixesha elifutshane yifilimu yokumelana ne-soluble yamanzi. Ubukhulu ngokuqhelekileyo yi-1.2mil, 1.5mil kunye ne-2mil. Ikwahlulahlulwe ibe ngamacandelo amathathu: ifilimu ekhuselayo ye-polyester, i-polyethylene diaphragm kunye nefilimu ye-photosensitive. Indima ye-polyethylene diaphragm kukuthintela i-agent ye-soft barrier agent ukuba ibambelele kumphezulu wefilimu yokukhusela i-polyethylene ngexesha lokuthutha kunye nokugcinwa kwexesha lefilimu eyomileyo. Ifilimu ekhuselayo inokuthintela i-oksijini ekungeneni kwi-barrier layer kwaye iphendule ngengozi kunye ne-radicals yamahhala kuyo ukuze ibangele i-photopolymerization. Ifilimu eyomileyo engazange yenziwe i-polymerized ihlanjululwa lula ngesisombululo se-sodium carbonate.
Ifilimu emanzi: Ifilimu emanzi licandelo elinye lefilimu ye-photosensitive yolwelo, ikakhulu eyenziwe nge-resin ephezulu-sensitivity, i-sensitizer, i-pigment, i-filler kunye nexabiso elincinci le-solvent. I-viscosity yemveliso yi-10-15dpa.s, kwaye inokumelana ne-corrosion kunye nokumelana ne-electroplating. , Iindlela zokugquma ifilimu ezimanzi ziquka ukuprintwa kwesikrini kunye nokutshiza.
Intshayelelo yenkqubo:
Indlela yokulinganisa ifilimu eyomileyo, inkqubo yokuvelisa imi ngolu hlobo lulandelayo:
Ukususwa kwangaphambili konyango-lamination-exposure-development-etching-film
Pretreat
Injongo: Susa ungcoliseko kumphezulu wobhedu, ezifana umaleko grease oxide kunye nezinye ukungcola, kwaye wandise ukurhabaxa komhlaba wobhedu ukwenza lula inkqubo yokulatyuza elandelayo.
Main ekrwada: ivili brush
Indlela yokulungisa kwangaphambili:
(1) Ukuqhunyiswa kwesanti kunye nendlela yokusila
(2) Indlela yonyango lweMichiza
(3) Indlela yokugaya oomatshini
Umgaqo osisiseko wendlela yokunyanga imichiza: Sebenzisa imichiza efana ne-SPS kunye nezinye izinto ezine-asidi ukuluma ngokufanayo umphezulu wobhedu ukususa ukungcola okunje ngegrisi kunye neeoksidi kumphezulu wobhedu.
Ukucoca ngemichiza:
Sebenzisa isisombululo sealkaline ukususa amabala e-oyile, iminwe kunye nolunye ukungcola okuphilayo kumhlaba wobhedu, emva koko sebenzisa isisombululo se-asidi ukususa umaleko we-oxide kunye nokhuso olukhuselayo kwi-substrate yobhedu yoqobo engathinteli ubhedu ukuba lufakwe kwi-oxidized, kwaye ekugqibeleni yenze i-micro- etching unyango ukufumana ifilimu eyomileyo Umphezulu orhabaxa ngokupheleleyo kunye neempawu zokuncamathela ezigqwesileyo.
Amanqaku olawulo:
a. Isantya sokugaya (2.5-3.2mm/min)
b. Nxiba isiva ububanzi (500 # inaliti ibrashi banxibe isiva ububanzi: 8-14mm, 800 # ilaphu non-elukiweyo banxibe isiva ububanzi: 8-16mm), uvavanyo lokusila amanzi, ubushushu ukomisa (80-90 ℃)
Lamination
Injongo: Ncamathisela ifilimu eyomileyo echasene nomhlwa kumphezulu wobhedu wesubstrate esetyenzisiweyo ngokucinezela okushushu.
Izinto eziphambili zekrwada: ifilimu eyomileyo, uhlobo lokucinga lwesisombululo, uhlobo lokucinga olunamanzi angama-aqueous, ifilimu eyomileyo enyibilikayo ngamanzi iqulunqwe ikakhulu ngama-radicals e-organic acid, eya kusabela ngealkali eyomeleleyo ukuyenza i-organic acid radicals. Yinyibilike.
Umgaqo: Roll ifilimu eyomileyo (ifilimu): kuqala uxobule ifilimu ekhuselayo ye-polyethylene kwifilimu eyomileyo, uze unamathisele ifilimu eyomileyo yokumelana nebhodi yobhedu phantsi kweemeko zokufudumeza kunye noxinzelelo, ukuxhathisa kwifilimu eyomileyo. ubushushu kunye nokumanzi kwayo kuyanda. Ifilimu igqitywe ngoxinzelelo lwe-roller yokucoca okushushu kunye nesenzo sokubambelela kwi-resistance.
Izinto ezintathu zefilimu eyomileyo ye-reel: uxinzelelo, ubushushu, isantya sothumelo
Amanqaku olawulo:
a. Isantya sokufota (1.5+/-0.5m/min), uxinzelelo lokufota (5+/-1kg/cm2), ubushushu bokufota (110+/——10℃), ubushushu bokuphuma (40-60℃)
b. Ukugquma ifilimu emanzi: i-viscosity ye-inki, isantya sokugquma, ubukhulu bengubo, ixesha lokubhaka kwangaphambili / ubushushu (imizuzu eyi-5-10 kwicala lokuqala, imizuzu eyi-10-20 kwicala lesibini)
Ukungakhuseleki
Injongo: Sebenzisa umthombo wokukhanya ukudlulisa umfanekiso kwifilimu yokuqala kwi-photosensitive substrate.
Izinto eziphambili zezinto ezibonakalayo: Ifilimu esetyenziswe kwinqanaba elingaphakathi lefilimu yifilimu engalunganga, oko kukuthi, inxalenye emhlophe yokuhambisa ukukhanya i-polymerized, kwaye inxalenye emnyama i-opaque kwaye ayiphenduli. Ifilimu esetyenziswe kwinqanaba elingaphandle yifilimu ekhangayo, echasene nefilimu esetyenziswe kwinqanaba elingaphakathi.
Umgaqo wokuvezwa kwefilimu eyomileyo: I-photosensitive initiator kwi-resistance kwindawo evulekileyo ithatha iifotoni kwaye ibole ibe yi-radicals yamahhala. Iiradicals zasimahla ziqalisa ukusabela okunqamlezileyo kweemonomers ukwenza uthungelwano lwesithuba semacromolecular isakhiwo esinganyibilikiyo kwialkali edibeneyo.
Amanqaku okulawula: ulungelelwaniso oluchanekileyo, amandla okuvezwa, irula yokukhanya yokukhanya (ifilimu ye-6-8 yebakala le-cover), ixesha lokuhlala.
Ukuphuhlisa
Injongo: Sebenzisa i-lye ukuze uhlambe indawo yefilimu eyomileyo engakhange isebenze kwikhemikhali.
Izinto eziphambili ekrwada: Na2CO3
Ifilimu eyomileyo engazange iqhube i-polymerization iyahlanjululwa, kwaye ifilimu eyomileyo eye yafumana i-polymerization igcinwe phezu kwebhodi njengoluhlu lokukhusela oluchasayo ngexesha lokubetha.
Umgaqo wophuhliso: Amaqela asebenzayo kwindawo engabonakaliyo yefilimu ye-photosensitive isabela kunye nesisombululo se-alkali se-dilute ukuvelisa izinto ezinyibilikayo kunye nokunyibilika, ngaloo ndlela kuchithwa inxalenye engabonakaliyo, ngelixa ifilimu eyomileyo yecandelo elibonakalayo lingachithwa.