High frequency PCB uyilo ingxaki

1. Ukujongana njani nongquzulwano lwethiyori kwi-wiring yangempela?
Ngokwenene, kulungile ukwahlula kunye nokuhlukanisa umhlaba we-analog / digital. Kufuneka kuqatshelwe ukuba umkhondo wesignali akufanele uwele i-moat kangangoko kunokwenzeka, kwaye indlela yokubuya yangoku yokunikezelwa kwamandla kunye nomqondiso akufanele ube mkhulu kakhulu.
I-crystal oscillator yi-analog positive feedback oscillation circuit. Ukuze ube nesignali ye-oscillation ezinzileyo, kufuneka ihlangabezane nenzuzo ye-loop kunye neenkcukacha zesigaba. Iimpawu ze-oscillation zalo mqondiso we-analog ziphazamiseka lula. Nangona imikhondo yokugada umhlaba yongezwa, ukuphazamiseka kusenokungabi yodwa ngokupheleleyo. Ngaphezu koko, ingxolo kwinqwelomoya ephantsi iya kuchaphazela kwakhona i-feedback oscillation circuit ukuba ikude kakhulu. Ngoko ke, umgama phakathi kwe-crystal oscillator kunye ne-chip kufuneka ube kufutshane ngokusemandleni.
Ngokwenene, kukho iingxabano ezininzi phakathi kwe-high-speed wiring kunye neemfuno ze-EMI. Kodwa umgaqo osisiseko kukuba ukuxhathisa kunye ne-capacitance okanye i-ferrite bead yongezwa yi-EMI ayinakubangela ukuba ezinye iimpawu zombane zomqondiso zingaphumeleli ukuhlangabezana neenkcukacha. Ngoko ke, kungcono ukusebenzisa izakhono zokucwangcisa umkhondo kunye ne-PCB stacking ukusombulula okanye ukunciphisa iingxaki ze-EMI, ezifana neempawu zesantya esiphezulu ukuya kumaleko angaphakathi. Ekugqibeleni, i-resistance capacitors okanye i-ferrite bead isetyenziselwa ukunciphisa umonakalo kwisignali.

2. Indlela yokusombulula ukuchasana phakathi kwe-wiring ye-manual kunye ne-wiring ngokuzenzekelayo yeempawu zesantya esiphezulu?
Uninzi lweendlela ezizenzekelayo zesoftware yocingo oluluqilima lubeke imiqobo yokulawula indlela yokujija kunye nenani le-vias. Ubunakho be-injini ejikajikayo kunye nezinto zokumisela umqobo kwiinkampani ezahlukeneyo ze-EDA ngamanye amaxesha zahluka kakhulu.
Umzekelo, ingaba kukho imiqobo eyaneleyo yokulawula indlela yokujija kwenyoka, ukuba kuyenzeka na ukulawula isithuba somkhondo wesibini esahlukileyo, njl. njl.
Ukongeza, ubunzima bokulungelelanisa ngesandla i-wiring bukwanxulumene ngokupheleleyo nekhono le-injini yokucima. Umzekelo, ukutyhala isakhono somkhondo, ukutyhala isakhono se-via, kunye nokukwazi ukutyhala umkhondo ukuya kwi-copper coating, njl.

3. Malunga nekhuphoni yovavanyo.
Ikhuphoni yokuvavanya isetyenziselwa ukulinganisa ukuba i-impedance yeempawu zebhodi ye-PCB eveliswayo ihlangabezana neemfuno zoyilo kunye ne-TDR (i-Time Domain Reflectometer). Ngokuqhelekileyo, i-impedance ekufuneka ilawulwe ineemeko ezimbini: ucingo olulodwa kunye nokwahlukana kwesibini.
Ngoko ke, ububanzi bomgca kunye nesithuba somgca kwikhuphoni yokuvavanya (xa kukho isibini esihlukeneyo) kufuneka sifane nomgca wokulawulwa. Into ebaluleke kakhulu yindawo yendawo yokumisa ngexesha lokulinganisa.
Ukuze kuncitshiswe ixabiso le-inductance ye-lead yomhlaba, indawo yokumisa i-TDR probe idla ngokusondeleyo kwi-tip probe. Ngoko ke, umgama kunye nendlela phakathi kwendawo yokulinganisa umqondiso kunye nendawo yomhlaba kwikhuphoni yokuvavanya Kufuneka ihambelane neprobe esetyenzisiweyo.

4. Kuyilo lwePCB olunesantya esiphezulu, indawo engenanto yoluhlu lwesiginali inokugqunywa ngobhedu, kwaye kufanele ukuba ukufakwa kobhedu kolweleko lweempawu ezininzi kuhanjiswe njani emhlabeni kunye nombane?
Ngokuqhelekileyo, i-copper plating kwindawo engenanto ininzi isekelwe. Mane ubeke ingqalelo kumgama phakathi kobhedu kunye nomgca wesignali xa usebenzisa ubhedu ecaleni komgca wesignali yesantya esiphezulu, kuba ubhedu olusetyenzisiweyo luya kunciphisa i-impedance yeempawu zomkhondo omncinci. Kananjalo lumka ungachaphazeli i-impedance yezinye iileyile, umzekelo kwisakhiwo somgca wemigca emibini.

5. Ngaba kunokwenzeka ukusebenzisa imodeli yomgca we-microstrip ukubala i-impedance yeempawu zomgca wesignali kwindiza yamandla? Ngaba umqondiso phakathi konikezelo lwamandla kunye nenqwelomoya ephantsi ingabalwa kusetyenziswa imodeli ye-stripline?
Ewe, inqwelomoya yamandla kunye nenqwelomoya ephantsi komhlaba kufuneka ithathwe njengeenqwelo-moya zesalathiso xa kubalwa i-impedance yeempawu. Umzekelo, ibhodi enemigangatho emine: umaleko ophezulu-umgangatho ophezulu-umhlaba umaleko-ophantsi. Ngeli xesha, imodeli ye-impedance yeempawu zomgangatho ophezulu yimodeli yomgca we-microstrip kunye nendiza yamandla njengendiza yereferensi.

6. Ngaba amanqaku okuvavanya angenziwa ngokuzenzekelayo ngesofthiwe kwiibhodi eziprintiweyo eziphezulu phantsi kweemeko eziqhelekileyo ukuhlangabezana neemfuno zovavanyo lwemveliso yobuninzi?
Ngokubanzi, ukuba isoftware ivelisa ngokuzenzekelayo amanqaku ovavanyo ukuhlangabezana neemfuno zovavanyo kuxhomekeke ekubeni iinkcukacha zokongeza amanqaku ovavanyo ziyahlangabezana neemfuno zezixhobo zovavanyo. Ukongeza, ukuba i-wiring ixinene kakhulu kwaye imigaqo yokongeza amanqaku okuvavanya ingqongqo, akunakubakho ndlela yokongeza ngokuzenzekelayo amanqaku ovavanyo kumgca ngamnye. Ewe kunjalo, kufuneka ugcwalise ngesandla kwiindawo eziza kuvavanywa.

7. Ngaba ukongezwa kwamanqaku okuvavanya kuya kuchaphazela umgangatho weempawu zesantya esiphezulu?
Ingaba iya kuchaphazela umgangatho wesignali ixhomekeke kwindlela yokongeza amanqaku okuvavanya kunye nokukhawuleza kwesibonakaliso. Ngokwenene, amanqaku ovavanyo olongezelelweyo (ungasebenzisi i-pin ekhoyo okanye i-DIP njengamanqaku okuvavanya) anokongezwa kumgca okanye utsalwe umgca omfutshane ukusuka kumgca.
I-yangaphambili ilingana nokongeza i-capacitor encinci kumgca, ngelixa lo mva isebe elongezelelweyo. Zomibini le miqathango iya kuchaphazela umqondiso wesantya esiphezulu ngaphezulu okanye ngaphantsi, kwaye ubungakanani besiphumo buhambelana nesantya sesantya somqondiso kunye nesantya somda wesignali. Ubungakanani bempembelelo bukwaziwa ngokulinganisa. Ngokomgaqo, incinci inqaku lokuvavanya, ngcono (ngokuqinisekileyo, kufuneka ihlangabezane neemfuno zesixhobo sokuvavanya) imfutshane isebe, ingcono.