Ibhodi yeSekethe eprintiweyo (PCB) licandelo le-elektroniki elisisiseko elisetyenziswa ngokubanzi kwiimveliso ezahlukeneyo ze-elektroniki kunye nezinxulumeneyo. I-PCB ngamanye amaxesha ibizwa ngokuba yi-PWB (iBhodi yocingo eShicileleyo). Yayikade ingaphezulu eHong Kong naseJapan ngaphambili, kodwa ngoku incinci (enyanisweni, iPCB kunye nePWB zahlukile). Kumazwe aseNtshona nakwimimandla, ibizwa ngokuba yiPCB. EMpuma, inamagama ahlukeneyo ngenxa yamazwe ahlukeneyo kunye nemimandla. Umzekelo, ngokuqhelekileyo ibizwa ngokuba yibhodi yesekethe eprintiweyo kwilizwe laseTshayina (ngaphambili ibibizwa ngokuba yibhodi yesekethe eprintiweyo), kwaye ibizwa ngokuba yiPCB eTaiwan. Iibhodi zeesekethe zibizwa ngokuba yi-electronic (circuit) substrates eJapan kunye ne-substrates eMzantsi Korea.

I-PCB yinkxaso yamacandelo e-elektroniki kunye nomthwali woqhagamshelo lombane lwamacandelo e-elektroniki, ngokukodwa ukuxhasa kunye nokudibanisa. Ngokucacileyo ukusuka ngaphandle, umaleko wangaphandle webhodi yesekethe ubukhulu becala unemibala emithathu: igolide, isilivere, kunye nokukhanya okubomvu. Ihlelwa ngokwexabiso: igolide yeyona ibiza kakhulu, isilivere yeyesibini, kwaye ibomvu ekhanyayo yeyona inexabiso eliphantsi. Nangona kunjalo, i-wiring ngaphakathi kwebhodi yesiphaluka ubukhulu becala ibhedu ecocekileyo, engenanto yobhedu.

Kuthiwa kusekho iintsimbi ezininzi ezixabisekileyo kwiPCB. Kuxelwe ukuba, ngokomyinge, ifowuni nganye ehlakaniphile iqulethe i-0.05g yegolide, i-0.26g yesilivere, kunye ne-12.6g yobhedu. Isiqulatho segolide selaptop siphindwe kayi-10 kunesefowuni ephathwayo!

Njengenkxaso yamacandelo e-elektroniki, ii-PCBs zifuna amacandelo e-soldering phezu komhlaba, kwaye inxalenye yomaleko wobhedu kufuneka ibonakaliswe kwi-soldering. Ezi maleko zobhedu eziveziweyo zibizwa ngokuba ziipads. Iipads ngokubanzi zixande okanye zingqukuva kunye nendawo encinci. Ngoko ke, emva kokuba imaski ye-solder ipeyintiwe, ubhedu kuphela kwiipads lubonakaliswe emoyeni.

Ubhedu olusetyenziswa kwi-PCB lula oxidized. Ukuba i-copper kwi-pad i-oxidized, ayiyi kuba nzima nje ukuyithengisa, kodwa kunye nokuxhatshazwa kuya kwanda kakhulu, okuya kuchaphazela kakhulu ukusebenza kwemveliso yokugqibela. Ngoko ke, i-pad ifakwe ngegolide yensimbi ye-inert, okanye i-surface ihlanganiswe ngoluhlu lwesilivere ngokusebenzisa inkqubo yeekhemikhali, okanye ifilimu ekhethekileyo yeekhemikhali isetyenziselwa ukugubungela ubhedu ubhedu ukukhusela i-pad ukuba idibane nomoya. Ukuthintela i-oxidation kwaye ukhusele i-pad, ukwenzela ukuba ikwazi ukuqinisekisa isivuno kwinkqubo ye-solder elandelayo.

1. PCB copper clad laminate
I-Copper clad laminate yimathiriyeli eyenziwe ngepleyiti eyenziwe ngokufaka ilaphu lefiber yeglasi okanye ezinye izinto zokuqinisa nge-resin kwelinye icala okanye macala omabini ngefoyile yobhedu kunye noxinzelelo olushushu.
Thatha ingilazi yeglasi eyenziwe ngelaphu lobhedu elisekwe ngelaphu njengomzekelo. Izixhobo zayo eziphambili ziyi-foil yobhedu, ilaphu lefiber yeglasi, kunye ne-epoxy resin, ethatha malunga ne-32%, i-29% kunye ne-26% yeendleko zemveliso, ngokulandelanayo.

Umzi-mveliso webhodi yesekethe

I-Copper clad laminate yimathiriyeli esisiseko yeebhodi zesekethe eziprintiweyo, kwaye iibhodi zesekethe eziprintiweyo zezona zinto zibalulekileyo kwiimveliso ezininzi ze-elektroniki ukuphumeza unxibelelwano lwesekethe. Ngokuphuculwa okuqhubekayo kobugcisa, ezinye iilaminates ezikhethekileyo ze-copper ze-elektroniki zingasetyenziswa kwiminyaka yamuva. Yenza ngokuthe ngqo amacandelo e-elektroniki ashicilelweyo. Ii-conductor ezisetyenziswa kwiibhodi zeesekethe eziprintiweyo ngokuqhelekileyo zenziwe nge-foil ebhityileyo efana nobhedu olusulungekileyo, oko kukuthi, i-foil yobhedu ngendlela emxinwa.

2. IBhodi yeSekethe yeGolide yePCB

Ukuba igolide kunye nobhedu zinxibelelana ngokuthe ngqo, kuya kubakho ukusabela ngokomzimba kokufuduka kunye nokusasazwa kwe-electron (ubudlelwane phakathi komahluko onokwenzeka), ngoko ke umaleko "we-nickel" kufuneka ufakwe i-electroplated njengomaleko wesithintelo, emva koko igolide ifakwe kwi-electroplated. umphezulu we-nickel, ngoko ngokuqhelekileyo siyibiza ngokuba yigolide ye-Electroplated, igama layo lokwenyani kufuneka libizwe ngokuthi "igolide ye-nickel ene-electroplated".
Umahluko phakathi kwegolide eqinileyo kunye negolide ethambileyo kukubunjwa koqweqwe lokugqibela lwegolide etyatyekwe kulo. Xa kufakwa igolide, unokukhetha i-electroplate yegolide esulungekileyo okanye ialloy. Ngenxa yokuba ukuqina kwegolide esulungekileyo kuthambile, ikwabizwa ngokuba “yigolide ethambileyo”. Ngenxa yokuba "igolide" inokwenza i-alloy efanelekileyo kunye ne "aluminium", i-COB iya kufuna ngokukodwa ubukhulu balo maleko wegolide ecocekileyo xa kusenziwa iingcingo ze-aluminiyam. Ukongezelela, ukuba ukhetha i-electroplated gold-nickel alloy okanye i-cobalt alloy yegolide, kuba i-alloy iya kuba nzima kunegolide ecocekileyo, ikwabizwa ngokuba "igolide elukhuni".

Umzi-mveliso webhodi yesekethe

Umaleko owenziwe ngegolide usetyenziswa ngokubanzi kwiipads zecandelo, iminwe yegolide, kunye ne-srapnel yokudibanisa yebhodi yesekethe. Iibhodi zemotherboard zezona bhodi zesekethe zesetyhula zisetyenziswa kakhulu ziibhodi ezityalwe ngegolide, iibhodi zegolide ezintywilisiweyo, iibhodi zoomama zekhompyuter, iibhodi zeaudio kunye neebhodi zesekethe ezincinci zedijithali azizobhodi zegolide.

Igolide yigolide yokwenene. Nangona kuphela umaleko obhityileyo kakhulu, sele ubala malunga ne-10% yeendleko zebhodi yesekethe. Ukusetyenziswa kwegolide njengomaleko weplating yenye yokuncedisa ukuwelda kunye nenye yokuthintela ukubola. Nkqu nomnwe wegolide we memory stick oye wasetyenziswa iminyaka eliqela usasebenza njengakuqala. Ukuba usebenzisa ubhedu, i-aluminiyam, okanye intsimbi, iya kuba ngumhlwa ngokukhawuleza ibe yimfumba yezinto ezilahliweyo. Ukongeza, ixabiso leplate yegolide liphezulu kakhulu, kwaye amandla e-welding ampofu. Ngenxa yokuba inkqubo yokubeka i-nickel e-electroless isetyenziswa, ingxaki yeediski ezimnyama kungenzeka ukuba yenzeke. I-nickel layer iya ku-oxidize ngokuhamba kwexesha, kwaye ukuthembeka kwexesha elide kuyingxaki.

3. Ibhodi yeSekethe yeSilivere yePCB
Ukuntywiliselwa kwesilivere kunexabiso eliphantsi kuneGolide yokuntywila. Ukuba iPCB ineemfuno zokusebenza zoqhagamshelo kwaye ifuna ukunciphisa iindleko, iSilivere yokuntywila lukhetho oluhle; idityaniswe nokutyeba okuhle kweSilver kunye nokuntywila, emva koko inkqubo yeSilver yokuntywiliselwa kufuneka ikhethwe.

I-Immersion yeSilivere inezicelo ezininzi kwiimveliso zonxibelelwano, iimoto, kunye neeperipherals zekhompyuter, kwaye inezicelo kuyilo lwesignali olukwisantya esiphezulu. Kuba iSilivere yokuntywiliselwa ineempawu ezilungileyo zombane ezingakwaziyo ukudityaniswa nolunye unyango lwangaphezulu, isenokusetyenziswa kwimiqondiso yomoya omninzi. I-EMS incoma ukusebenzisa inkqubo yesilivere yokuntywiliselwa kuba kulula ukudibanisa kwaye inokukhangela okungcono. Nangona kunjalo, ngenxa yeziphene ezifana nokungcoliswa kunye ne-solder joint voids, ukukhula kwesilivere yokuntywila kuye kwacotha (kodwa akunciphisi).

andisa
Ibhodi yesekethe eprintiweyo isetyenziswa njengomphathi woqhagamshelo lwamacandelo e-elektroniki adibeneyo, kwaye umgangatho webhodi yesekethe uya kuchaphazela ngokuthe ngqo ukusebenza kwezixhobo zombane ezikrelekrele. Phakathi kwabo, umgangatho wokubeka iibhodi zeesekethe eziprintiweyo kubaluleke kakhulu. I-Electroplating inokuphucula ukukhuselwa, i-solderability, i-conductivity kunye nokuxhatshazwa kokugqoka kwebhodi yesiphaluka. Kwinkqubo yokuvelisa iibhodi zeesekethe eziprintiweyo, i-electroplating yinyathelo elibalulekileyo. Umgangatho we-electroplating unxulumene nempumelelo okanye ukungaphumeleli kwayo yonke inkqubo kunye nokusebenza kwebhodi yesiphaluka.

Iinkqubo eziphambili ze-electroplating ze-pcb kukufakwa kwe-copper, i-tin plating, i-nickel plating, i-gold plating njalo njalo. I-electroplating yobhedu yinto esisiseko yokudibanisa umbane kwiibhodi zeesekethe; i-tin electroplating yimeko efunekayo yokuveliswa kweesekethe eziphezulu ezichanekileyo njenge-anti-corrosion layer ekuqhubeni ipateni; nickel electroplating kukuba electroplate umaleko nickel umqobo kwibhodi yesekethe ukuthintela ubhedu negolide Dialysis Mutual; Igolide ye-electroplating ikhusela ukugqithiswa kwendawo ye-nickel ukuhlangabezana nokusebenza kwe-soldering kunye nokumelana nokubola kwebhodi yesekethe.