I-FPC hole metallization kunye nenkqubo yokucoca i-foil yobhedu

Inkqubo yokuvelisa i-FPC yomngxuma-macala amabini

I-metallization yomngxuma yeebhodi eziprintiweyo eziguquguqukayo ngokusisiseko iyafana naleyo yeebhodi eziqinileyo eziprintiweyo.

Kwiminyaka yakutshanje, kukho inkqubo ye-electroplating ethe ngqo ethatha indawo ye-electroless plating kwaye yamkele itekhnoloji yokwenza i-carbon conductive layer.Umngxuma metallization of bhetyebhetye eprintiweyo ibhodi yesekethe kwakhona wazisa obu buchwepheshe.
Ngenxa yokuthamba kwayo, iibhodi eziprintiweyo eziguquguqukayo zifuna izixhobo ezikhethekileyo zokulungisa.Izixhobo azikwazi ukulungisa kuphela iibhodi eziprintiweyo eziguquguqukayo, kodwa kwakhona kufuneka zizinzile kwisisombululo se-plating, ngaphandle koko ubukhulu besitya sobhedu buya kungalingani, okuya kubangela ukuqhawulwa ngexesha lenkqubo yokubhala.Kwaye isizathu esibalulekileyo sokudibanisa.Ukuze ufumane i-copper plating layer, ibhodi eprintiweyo eguquguqukayo kufuneka iqiniswe kwi-fixture, kwaye umsebenzi kufuneka wenziwe kwindawo kunye nokuma kwe-electrode.

Ukukhutshwa kwemveliso ye-metalization yomngxuma, kuyimfuneko ukuphepha ukuthunyelwa kweefektri ezingenawo amava kwi-holeization yeebhodi eziprintiweyo eziguquguqukayo.Ukuba akukho mgca wokucwenga okhethekileyo kwiibhodi eziprintiweyo eziguquguqukayo, umgangatho womgodi awunakuqinisekiswa.

Ukucoca umphezulu wefoyile yobhedu-FPC inkqubo yokuvelisa

Ukuze kuphuculwe ukunamathela kwe-mask yokuxhathisa, umphezulu we-foil yobhedu kufuneka ucocwe ngaphambi kokubamba imaski yokumelana.Nangona inkqubo enjalo elula idinga ingqalelo ekhethekileyo kwiibhodi eziprintiweyo eziguquguqukayo.

Ngokuqhelekileyo, kukho inkqubo yokucoca iikhemikhali kunye nenkqubo yokupolisha ngomatshini yokucoca.Ukwenza imizobo echanekileyo, amaxesha amaninzi adityaniswe neentlobo ezimbini zeenkqubo zokucoca kunyango lwangaphezulu.Ukupholisha ngoomatshini kusebenzisa indlela yokupholisha.Ukuba i-polish material inzima kakhulu, iya kuyonakalisa i-foil yobhedu, kwaye ukuba ithambile kakhulu, iya kuba yinto engafanelekanga ngokwaneleyo.Ngokuqhelekileyo, iibrashi zenayiloni zisetyenziswa, kwaye ubude kunye nokuqina kweebrashi kufuneka kufundwe ngononophelo.Sebenzisa iirola ezimbini zokupolisha, ezibekwe kwibhanti yokuhambisa, isalathiso sokujikeleza sichasene nolwalathiso lokuhambisa ibhanti, kodwa ngeli xesha, ukuba uxinzelelo lwee-roller zokupholisha lukhulu kakhulu, i-substrate iya kolulwa phantsi koxinzelelo olukhulu, oluya kuthi ga ngoku. iya kubangela utshintsho oluphakathi.Esinye sezizathu ezibalulekileyo.

Ukuba unyango oluphezulu lwe-foil yobhedu alucocekanga, ukunamathela kwi-mask yokuxhathisa kuya kuba yintlupheko, eya kunciphisa izinga lokupasa kwenkqubo ye-etching.Kungekudala, ngenxa yokuphuculwa komgangatho weebhodi ze-foil zobhedu, inkqubo yokucoca umphezulu ingaphinda ishiywe kwimeko yeesekethe ezisecaleni.Nangona kunjalo, ukucocwa komphezulu yinkqubo eyimfuneko kwiipateni ezichanekileyo ezingaphantsi kwe-100μm.