Uvavanyo lophando olubhabhayo

Umvavanyi wenaliti ephaphazelayo ayixhomekeke kwipatheni yephini efakwe kwi-fixture okanye isibiyeli.Ngokusekelwe kule nkqubo, iiprobes ezimbini okanye ngaphezulu zifakwe kwiintloko ezincinci, ezihamba ngokukhululekileyo kwi-xy plane, kwaye amanqaku ovavanyo alawulwa ngokuthe ngqo yi-CADI. Idatha yeGerber.Iiprobe ezimbini ziyakwazi ukuhamba ngaphakathi kwe-4 mil enye kwenye.Iiprobes ziyakwazi ukuhamba ngokuzenzekelayo, kwaye akukho mda wangempela wokuba bangasondelana kangakanani. ibhodi yesiphaluka ibekwe ngokuqinileyo kwi-insulating layer kwi-plate yensimbi ethi I-ACTS njengenye iplate yentsimbi ye-capacitor.Ukuba kukho isiphaluka esifutshane phakathi kwemigca, i-capacitance iya kuba nkulu kunendawo ethile.Ukuba kukho ikhefu, amandla aya kuba mncinci.

Isantya sovavanyo yikhrayitheriya ebalulekileyo yokukhetha umvavanyi.Ngelixa umvavanyi webhedi yenaliti unokuvavanya ngokuchanekileyo amawaka amanqaku ovavanyo ngexesha, umhloli wenaliti ephaphazelayo unokuvavanya amanqaku amabini okanye amane ngexesha elinye.Ukongezelela, uvavanyo olunye kunye inaliti yokuvavanya ibhedi inokubiza kuphela i-20-305, ngokuxhomekeke kubunzima bebhodi, kanti umhloli weenaliti ophaphazelayo ufuna i-Ih okanye ngaphezulu ukugqiba uvavanyo olufanayo. Shipley (1991) wachaza ukuba le ndlela lukhetho olufanelekileyo kubavelisi beebhodi zesekethe ezintsonkothileyo kunye nezivuno ezisezantsi, nokuba abavelisi beebhodi zesekethe eziprintiweyo eziphezulu bajonga ubuchule bovavanyo lwephini lokubhabha ukuba lucothe.

Ukuvavanya ipleyiti engenanto, kukho izixhobo zokuvavanya ezinikezelweyo (Lea, 1990) .Indlela eneendleko ezingaphezulu iya kuba kukusebenzisa isixhobo sendalo yonke, nangona ekuqaleni kubiza ngaphezu kwesixhobo esizinikezeleyo, iindleko zayo zokuqala eziphezulu ziya kulungiswa ngokunciphisa iindleko zokucwangciswa komntu ngamnye.Kwiigridi zenjongo jikelele, igridi esemgangathweni yeebhodi kunye nezixhobo zokunyuka kwendawo kunye nezixhobo ze-pin yi-2.5 mm.Kule nqanaba i-pad yokuvavanya kufuneka ibe mkhulu okanye ilingane ne-1.3mm.

Kwigridi ye-Imm, i-pad yokuvavanya yenzelwe ukuba ibe mkhulu kune-0.7mm.Ukuba igridi incinci, i-pin yokuvavanya incinci, i-brittle, kwaye inomonakalo.Ngoko ke, kungcono ukusebenzisa iigridi ezinkulu kune-2.5mm.Crum (1994b) uthe udibaniso lomvavanyi wendalo yonke (umvavanyi wegridi oqhelekileyo) kunye nomvavanyi wenaliti ophaphazelayo unokwenza ubhaqo lwebhodi yesekethe yoxinaniso oluphezulu luchaneke kwaye lube noqoqosho.Enye indlela ayicebisayo kukusebenzisa umvavanyi werabha oqhubayo, ongasetyenziselwa ukubhaqa. iingongoma eziphambukayo kwigridi.Nangona kunjalo, ubude obuhlukeneyo beepads eziphathwe ngokulingana komoya oshushu ziya kuthintela ukudityaniswa kwamanqaku ovavanyo.
La manqanaba mathathu alandelayo okufunyaniswa adla ngokuqhutywa:
1) ukubonwa kwepleyiti enqunu;
2) ukufunyanwa kwi-intanethi;
3) ukufumanisa ukusebenza.
Umvavanyi wohlobo oluqhelekileyo unokusetyenziselwa ukufumanisa uhlobo lwesimbo kunye nohlobo lwebhodi yesekethe kunye nezicelo ezikhethekileyo.
Iingubo zentsimbi eziqhelekileyo zezi:
Ubhedu
Itoti

Ubukhulu buhlala buphakathi kwe-5 kunye ne-15 cm
Ingxubevange ye-lead-tin (okanye ialloyi yobhedu)
Oko kukuthi, i-solder, ngokuqhelekileyo i-5 ukuya kwi-25 m ubukhulu, kunye nomxholo we-tin malunga ne-63%

igolide: Ngokubanzi iya kucandwa kuphela kujongano

isilivere: Ngokubanzi iya kucolwa kuphela kwi-interface, okanye iyonke ikwayi-alloy yesilivere