I-Flexible Printed Circuit

I-Flexible Printed Circuit，Inokugotshwa, inxeba kwaye isongwe ngokukhululekileyo. Ibhodi yesekethe eguquguqukayo icutshungulwa ngokusebenzisa ifilimu ye-polyimide njengento esisiseko. Ikwabizwa ngokuba yibhodi ethambileyo okanye iFPC kushishino. Inkqubo yokuhamba kwebhodi yesekethe eguquguqukayo yahlulwe ibe yinkqubo yebhodi yesekethe eguquguqukayo kabini, inkqubo yebhodi yesekethe eguquguqukayo. Ibhodi ethambileyo ye-FPC inokumelana nezigidi zokugoba okuguquguqukayo ngaphandle kokonakalisa iingcingo. Iyakwazi ukulungelelaniswa ngokusemthethweni ngokweemfuno zendlela yokubeka indawo, kwaye inokushukunyiswa kwaye yolulwe ngokungqongqo kwisithuba esine-dimensional-dimensional, ukwenzela ukuba kufezekiswe ukudibanisa kwecandelo kunye nokudibanisa ucingo; ibhodi yesekethe eguquguqukayo ingaba Ubungakanani kunye nobunzima beemveliso ze-elektroniki ziyancipha kakhulu, kwaye zifanelekile kuphuhliso lweemveliso ze-elektroniki kwicala lobuninzi obuphezulu, i-miniaturization kunye nokuthembeka okuphezulu.

Ukwakhiwa kweebhodi eziguquguqukayo: ngokwenani leengqimba ze-copper conductive foil, zinokuhlulwa zibe ngamabhodi ahlukeneyo, iibhodi eziphindwe kabini, iibhodi ezininzi, iibhodi ezinamacala amabini, njl.

Iipropati zezinto kunye neendlela zokukhetha:

1 Iyakwazi ukumelana nobushushu be-400 degrees Celsius imizuzwana eyi-10, kwaye amandla okuqina yi-15,000-30,000PSI. Ii-25μm ezityebileyo zesubstrates zezona zinexabiso eliphantsi kwaye zisetyenziswa kakhulu. Ukuba ibhodi yesiphaluka kufuneka ibe nzima, i-substrate ye-50 μm kufuneka isetyenziswe. Ngokwahlukileyo, ukuba ibhodi yesiphaluka kufuneka ibe thambileyo, sebenzisa i-substrate ye-13μm

2 Amandla e-polyethylene aphantsi. Ukuba ufuna ukuba ibhodi yesekethe ithambile, khetha i-polyethylene. Ubuninzi be-substrate kunye neglue ecacileyo kuyo, ibhodi yokuqina. Ukuba ibhodi yesekethe inendawo enkulu yokugoba, kufuneka uzame ukusebenzisa i-substrate encinci kunye neglue ecacileyo ukunciphisa uxinzelelo phezu kwe-foil yobhedu, ukuze ithuba lokuqhekeka kwe-micro-cracks kwi-foil yobhedu lincinci. Ngokuqinisekileyo, kwiindawo ezinjalo, iibhodi ezinoluhlu olulodwa kufuneka zisetyenziswe kangangoko kunokwenzeka.

(3) Ifoyile yobhedu: yahlulahlulwe yaba lubhedu oluqengqelekayo kunye nobhedu lwe-electrolytic. Ubhedu oluqengqelekayo lunamandla aphezulu kwaye alukwazi ukugoba, kodwa lubiza kakhulu. I-Electrolytic copper inexabiso eliphantsi kakhulu, kodwa amandla ayo abi kwaye kulula ukuwaphula. Ngokuqhelekileyo isetyenziswa kwiimeko apho kukho ukugoba okuncinci. Ukukhethwa kobunzima befoyile yobhedu kuxhomekeke kububanzi obuncinci kunye nesithuba esincinci sesikhokelo. I-copper foil encinci, encinci ububanzi obufikelelekayo kunye nesithuba. Xa ukhetha ubhedu olugobileyo, qwalasela ulwalathiso olujikelezayo lwe-foil yobhedu. Ulwalathiso olujikelezayo lwe-foil yobhedu kufuneka luhambelane nesikhokelo sokugoba esiphambili sebhodi yesiphaluka.

(4) Ifilimu ekhuselayo kunye neglue yayo ebonakalayo: Ifilimu ekhuselayo ye-25 μm iya kwenza ibhodi yesekethe ibe nzima, kodwa ixabiso lincinci. Kwiibhodi zeesekethe ezinamagophe amakhulu, kungcono ukusebenzisa ifilimu ekhuselayo ye-13μm. I-glue ecacileyo nayo yohlulwe ibe ziindidi ezimbini: i-epoxy resin kunye ne-polyethylene. Ibhodi yesiphaluka usebenzisa i-epoxy resin inzima. Emva kokuba ukucofa okutshisa kugqityiwe, enye iglue ebonakalayo iya kukhutshwa kumda wefilimu ekhuselayo. Ukuba ubungakanani bepadi bukhulu kunobukhulu bokuvula ifilimu ekhuselayo, iglue ekhutshiweyo iya kunciphisa ubungakanani bepadi kwaye ibangele ukuba umphetho wayo ungabikho. Ngeli xesha, zama ukusebenzisa iglue ecacileyo kunye nobukhulu be-13 μm.

5 .