1. Ngaphambi kwe-welding, sebenzisa i-flux kwi-pad kwaye uyiphathe ngentsimbi ye-soldering ukukhusela i-pad ukuba ifakwe kakubi okanye i-oxidized, ibangela ubunzima ekuthengiseni.Ngokuqhelekileyo, i-chip ayifuni ukuphathwa.
2. Sebenzisa i-tweezers ukubeka ngokucophelela i-chip ye-PQFP kwibhodi ye-PCB, uqaphele ukuba ungonakalisi izikhonkwane.Ukulungelelanisa kunye neepads kwaye uqinisekise ukuba i-chip ibekwe ngendlela echanekileyo.Lungisa iqondo lobushushu lentsimbi ukuya kutsho ngaphezu kwama-300 degrees celcius, diphu incam yentsimbi yokuthambisa ngexabiso elincinane le-solder, sebenzisa isixhobo ukucinezela i-chip elungelelanisiweyo, kwaye wongeze umlinganiselo omncinci wokuguquguquka kwi-diagonal emibini. Izikhonkwane, nangoku Cinezela ezantsi kwitshiphu kwaye uthengise izikhonkwane ezibini ezibekwe ngokwediagonally ukuze itshiphu imiswe kwaye ingakwazi ukuhamba.Emva kokuthengisela iikona ezichaseneyo, phinda ujonge indawo yechip ukuze ulungelelanise.Ukuba kuyimfuneko, inokulungiswa okanye isuswe kwaye ilungelelaniswe kwakhona kwibhodi yePCB.
3. Xa uqala ukuthengisa zonke izikhonkwane, yongeza i-solder kwi-tip ye-soldering iron kwaye ugqoke zonke izikhonkwane nge-flux ukugcina izikhonkwane ezinomswakama.Chukumisa incam yentsimbi ukuya esiphelweni sesikhonkwane ngasinye kwitshiphu ude ubone i-solder ingena kwiphini.Xa i-welding, gcina incam ye-soldering iron ihambelana nepini ethengiswayo ukuze uthintele ukugqithelana ngenxa ye-solder eninzi.
4.Emva kwe-soldering zonke izikhonkwane, cwina zonke izikhonkwane nge-flux ukucoca i-solder.Sula i-solder engaphezulu apho ifuneka khona ukuphelisa naziphi na iibhulukhwe ezimfutshane kunye nokugqithelana.Okokugqibela, sebenzisa i-tweezers ukujonga ukuba kukho nayiphi na i-solder yobuxoki.Emva kokuba ukuhlolwa kugqityiwe, susa i-flux kwibhodi yesiphaluka.Gxuma ibrashi enzima e-alcohol kwaye uyisule ngononophelo kunye nolwalathiso lwezikhonkwane kuze kube yilapho i-flux iphela.
5. Amacandelo e-SMD resistor-capacitor alula ukuthengisa.Unokuqala ukubeka i-tin kwi-joint ye-solder, emva koko ubeke enye isiphelo secandelo, sebenzisa i-tweezers ukunyanzelisa icandelo, kwaye emva kwe-soldering enye isiphelo, khangela ukuba ibekwe ngokuchanekileyo;Ukuba ihambelana, weld enye isiphelo.
Ngokubhekiselele kwisakhiwo, xa ubukhulu bebhodi yesiphaluka bukhulu kakhulu, nangona i-welding ilula ukulawula, imigca eprintiweyo iya kuba yinde, i-impedance iya kwanda, amandla okulwa ingxolo aya kuncipha, kwaye iindleko ziya kwanda;ukuba incinci kakhulu, ukutshatyalaliswa kobushushu kuya kuncipha, i-welding iya kuba nzima ukuyilawula, kwaye imigca ekufutshane iya kubonakala ngokulula.Ukuphazamiseka okufanayo, okufana nokuphazamiseka kwe-electromagnetic kwiibhodi zeesekethe.Ke ngoko, uyilo lwebhodi yePCB kufuneka luphuculwe:
(1) Ukunciphisa uxhulumaniso phakathi kwamacandelo aphezulu-frequency kunye nokunciphisa ukuphazamiseka kwe-EMI.
(2) Izixhobo ezinobunzima obunzima (ezinje ngaphezu kwe-20g) kufuneka zilungiswe kunye nezibiyeli kwaye zidibanise.
(3) Imiba yokutshatyalaliswa kobushushu kufuneka ithathelwe ingqalelo kwizinto zokufudumeza ukukhusela iziphene kunye nokusebenza kwakhona ngenxa ye-ΔT enkulu kumphezulu wecandelo.Amalungu anobuntununtunu bobushushu kufuneka agcinwe kude nemithombo yobushushu.
4Ibhodi yesekethe yenzelwe ukuba i-4: 3 ixande (ekhethwayo).Musa ukuba notshintsho olukhawulezileyo kububanzi bocingo ukunqanda ukungaqhubeki kweengcingo.Xa ibhodi yesiphaluka ifudumala ixesha elide, i-foil yobhedu kulula ukwandisa kwaye iwa.Ngoko ke, ukusetyenziswa kweendawo ezinkulu zefoyile yobhedu kufuneka kugwenywe.