Ibhodi yesekethe iya kubonakalisa i-tinning engalunganga ngexesha lemveliso ye-SMT. Ngokubanzi, i-tinning engalunganga inxulumene nokucoceka komphezulu we-PCB ongenanto. Ukuba akukho kungcola, ngokuqinisekileyo akuyi kubakho i-tinning embi. Okwesibini, i-tinning Xa i-flux ngokwayo imbi, ubushushu kunye nokunye. Ngoko ke zeziphi izibonakaliso eziphambili zeziphene eziqhelekileyo zetoti zombane kwimveliso yebhodi yesekethe kunye nokucubungula? Indlela yokusombulula le ngxaki emva kokuyibonisa?
1. Umphezulu we-tin we-substrate okanye iinxalenye ze-oxidized kunye ne-copper surface iyancipha.
2. Kukho ama-flakes phezu kwebhodi yesekethe ngaphandle kwe-tin, kwaye i-plating layer kwi-board surface inokungcola okucacileyo.
3. I-coating-high-potency i-rough, kukho into evuthayo, kwaye kukho iiflakes phezu kwebhodi ngaphandle kwe-tin.
4. Umphezulu webhodi yesekethe ifakwe ngegrisi, ukungcola kunye nezinye ii-sundries, okanye kukho ioli ye-silicone eseleyo.
5. Kukho imiphetho ecacileyo ecacileyo emaphethelweni emingxuma ephantsi, kwaye i-coat-high-potency i-rough and burn.
6. Ukugquma kwelinye icala kugqityiwe, kwaye ukugquma kwelinye icala kuhlwempuzekile, kwaye kukho umphetho ocacileyo oqaqambileyo emdeni womngxuma onokuthi uphantsi.
7. Ibhodi ye-PCB ayiqinisekiswanga ukuba ihlangabezane neqondo lokushisa okanye ixesha ngexesha lenkqubo ye-soldering, okanye i-flux ayisetyenziswanga ngokuchanekileyo.
8. Kukho ukungcola okucacileyo kwi-plating ebusweni bebhodi yesekethe, okanye iinqununu zokugaya zishiywe ebusweni besiphaluka ngexesha lenkqubo yokuvelisa i-substrate.
9. Ummandla omkhulu wezinto eziphantsi awukwazi ukufakwa nge-tin, kwaye umphezulu webhodi yesekethe unombala obomvu obomvu okanye obomvu, kunye nengubo epheleleyo kwelinye icala kunye nengubo embi kwelinye.