Ukutywinwa komngxunya ocoliweyo yinkqubo yebhodi yeBhodi yeBhodi yeBhodi yeBhodi yeBhodi ePhakanyisiweyo esetyenziselwa ukuzalisa kunye nokutywina ngemingxunya (ngokusebenzisa-imingxunya) ukuphucula ukwenziwa kombane nokukhusela. Kwinkqubo yokuphumeza iBhodi yeBhodi yeBhodi, i-Pass-ngokusebenzisa umjelo osetyenziselwa ukudibanisa abeki ngeendlela zesekethe. Injongo ye-electroplay yokutywina kukwenza udonga olungaphakathi lwendlela egcwele izinto ezisebenzayo ngokwenza ubume bentsimbi okanye ukwenza ukuba kubekho ukwenza umbane ngokutywina.
1.I-elektroni yebhodi yesekethe ye-elektrone yenkqubo yokutywina izise izibonelelo ezininzi kwinkqubo yemveliso yemveliso:
a)Improve circuit reliability: circuit board electroplating sealing process can effectively close holes and prevent electrical short circuit between metal layers on the circuit board. Oku kunceda ekuphuculeni ukuthembeka kunye nokuzinza kweBhodi kwaye kunciphisa umngcipheko wokungaphumeleli kwesekethe kunye nomonakalo
b) Ukomeleza intsebenzo yesekethe: ngokusebenzisa inkqubo yokutywina kwe-elektroniki, uqhagamshelo olungcono lwesekethe kunye nokuqhutywa kombane kunokufezekiswa. I-elektroplate yokugcwalisa i-elektropring inokubonelela ngoqhagamshelo oluzinzileyo kunye oluthembekileyo, ukunciphisa ingxaki yokulahleka kwesiginali kunye nokuyinyanzela amandla, kwaye ke kuphucule ubuchule bentsebenzo yesekethe kunye nemveliso.
c) Ukuphuculwa komgangatho we-welding: Ibhodi yebhodi yesekethe ye-elektropla yenkqubo yokutywina inokuphucula umgangatho welding. Inkqubo yokutywina inokwenza indawo efihlakeleyo, egudileyo ngaphakathi komngxunya, ukubonelela ngesiseko esingcono se-welding. Oku kunokuphucula ukuthembeka kunye namandla elding kwaye kuncitshiswe ukuvela kweziphene ze-welding kunye neengxaki ezibandayo zelding.
d) Ukomeleza amandla oomatshini: Inkqubo yokutywina kweywimi yokutywina inokuphucula amandla obuchwephesha kunye nokuqina kweBhodi yeSiphaluka. Ukuzalisa imingxunya kunokwandisa ubukhulu kunye neqhina kweBhodi yeSiphaluka, ukuphucula ukumelana nokugqobhoza kunye nokucutha umngcipheko womonakalo woomatshini kunye nokuqhawuka ngexesha lokusetyenziswa.
e) Indibano elula kunye nofakelo: Ibhodi yebhodi ye-elektrone yenkqubo yokutywina inokwenza indibano kunye nenkqubo yokufaka impumelelo. Ukuzalisa imingxunya kubonelela ngamanqaku okuzinza komhlaba ngakumbi, ukwenza ufakelo lweNdibano kulula kwaye luchaneke ngakumbi. Ukongeza, ukutywinwa kwe-eleklikiweyo ngombane kunika ukhuseleko olungcono kunye nokunciphisa umonakalo kunye nokulahleka kwamacandelo ngexesha lofakelo.
Ngokubanzi, iBhodi yeBhodi yeSoftwaft yokutywina inokuphucula ukuthembeka kwesekethe, ukuphucula ukusebenza kwesekethe, ukuphucula umgangatho we-welding, ukomeleza amandla e-PAPICATION, kunye nokwenza lula i-CORD kunye nofakelo. Ezi zibonelelo zinokuphucula kakhulu umgangatho wemveliso kunye nokuthembeka, ngelixa kuncitshiswa umngcipheko kunye neendleko kwinkqubo yokwenziwa
2.Kunokwenzeka ukuba iBhodi yeBhodi yeSectoproplay yokutywina inezibonelelo ezininzi, kukho iingozi ezinokubakho okanye iintsilelo ezinokubandakanya oku kulandelayo:
f) Ukunyuswa kweendleko: Ibhodi yokubetha yeHole yokutywina ifuna iinkqubo nezixhobo, ezinjengezixhobo zokugcwalisa kunye neekhemikhali ezisetyenziswa kwinkqubo yokubeka. Oku kunganyusa iindleko zokuvelisa kwaye zibe nefuthe kwi-Economics iyonke yeMveliso
g) Ukuthembeka kwexesha elide: Nangona inkqubo yokulungisa itywina inokuphucula ukuthembeka kweBhodi yeSiphaluka, kwimeko yokusetyenziswa kwexesha elide kunye nokuhamba kwendalo, kwaye ukungcungcutheka kwezendalo kunye nokudityaniswa okubandayo, ukubonakala kwe-sunodion, njalo njalo. Oku kunokukhokelela ekuthinteleni umbandela wefilitha, ukuwela, okanye ukonakaliswa kokubekwa, ukunciphisa ukuthembeka kweBhodi
h) Ubunzima obu-3 Kubandakanya ukulawulwa kwamanyathelo amaninzi kunye neeparamitha ezinjengokulungiselela umngxunya, ukugcwalisa ukhetho lwezinto ezibonakalayo kunye nokwakha, ukulawulwa kwenkqubo yokulawulwa, njl njl. Oku kunokufuna ubuchule benkqubo kunye nezixhobo zokuqinisekisa ukuchaneka kwenkqubo kunye nozinzo.
i) Yandisa le nkqubo: Nyusa inkqubo yokutywina, kwaye unyuse ifilimu yokuthintela imingxunya emikhulu yokuqinisekisa ukutywina. Emva kokutywina umngxunya, kuyimfuneko kwifosholo yobhedu, ukugaya, ukupolika kunye namanye amanyathelo okuqinisekisa ukuba umhlaba wokutywina.
j) Impembelelo yokusingqongileyo: Iichemicals ezisetyenziswa kwinkqubo yokutywina ye-elektroniki zinokuba nefuthe elithile kwindalo esingqongileyo. Umzekelo, amanzi amdaka kunye nenkunkuma engamanzi inokuveliswa ngexesha lokufakwa kwe-elektroniki, efuna unyango olufanelekileyo kunye nonyango. Ukongeza, kunokubakho izinto eziyingozi kwindalo esingqongileyo kwizinto zokugcwalisa kwaye zilahlwe.
Xa ujonga i-elektroplapla yenkqubo yokutywina yokutywina, kubalulekile ukuba uqaphele ezi zengozi ezinokubakho okanye iintsilelo ezinokubakho, kwaye ulinganise iindleko kunye neemeko zesicelo. Xa kumiliselwa inkqubo, ulawulo olufanelekileyo lolawulo kunye nolawulo lokusingqongileyo lubalulekile ukuqinisekisa ukuba eyona nkqubo ilungileyo yenkqubo kunye nokuthenjwa kwemveliso.
Imigangatho ye-3.Acceance
Ngokutsho komgangatho: IPC-600-J3.2.20: I-ElectroFeted Plper Plug (I-FIRT)
I-SAG kunye ne-bulge: Iimfuno zebhugi (ibhombu) kunye nokudakumba (umngxunya) we-micro-emngxunyeni kunye nokunyanzelwa komngxunya kunye noxinzelelo lwe-calper exakekileyo. Amaxwebhu okuthengwa kwabathengi okanye imigangatho yabathengi njengesiseko somgwebo.
