[VW PCBworld] Abayili banokuyila iibhodi zesekethe eziprintiweyo ezinamanani angaqhelekanga (PCBs).Ukuba i-wiring ayifuni umaleko owongezelelweyo, kutheni uyisebenzise?Ngaba ukunciphisa iileya bekungayi kwenza ibhodi yesekethe ibe bhityileyo?Ukuba kukho ibhodi yesekethe enye, ngaba iindleko aziyi kuba ngaphantsi?Nangona kunjalo, kwezinye iimeko, ukongeza umaleko kuya kunciphisa iindleko.

Ubume bebhodi yesekethe

Iibhodi zeesekethe zinezakhiwo ezibini ezahlukeneyo: isakhiwo esingundoqo kunye nesakhiwo se-foil.

Kwisakhiwo esisisiseko, zonke iileyile zokuqhuba kwibhodi yesiphaluka zifakwe kwizinto eziphambili;kwisakhiwo se-foil-clad, kuphela umgca we-conductive wangaphakathi webhodi yesekethe ufakwe kwizinto ezingundoqo, kwaye i-transportive layer yangaphandle yibhodi ye-dielectric efakwe kwi-foil.Zonke iileyile zokuqhuba ziboshwe kunye ngokusebenzisa i-dielectric usebenzisa inkqubo ye-multilayer lamination.

Isixhobo senyukliya yibhodi enefoyile enamacala amabini kumzi-mveliso.Ngenxa yokuba umbindi ngamnye unamacala amabini, xa usetyenziswa ngokupheleleyo, inani leeleya ze-PCB linani elilinganayo.Kutheni ungasebenzisi i-foil kwelinye icala kunye nesakhiwo esingundoqo kwabanye?Ezona zizathu ziphambili zezi: iindleko zePCB kunye neqondo lokugoba lePCB.

Inzuzo yeendleko zeebhodi zeesekethe ezinamanani alinganayo

Ngenxa yokunqongophala komaleko we-dielectric kunye ne-foil, iindleko zemathiriyeli ekrwada yee-PCB ezinamanani angaqhelekanga zingaphantsi kancinci kunezo zePCB ezinamanani.Nangona kunjalo, iindleko zokusetyenzwa kwee-PCB zomaleko ongaqhelekanga ziphezulu kakhulu kunezo ze-PCB ezilinganayo.Iindleko zokucubungula umaleko wangaphakathi ziyafana;kodwa i-foil / i-core structure ngokucacileyo yandisa iindleko zokucubungula umaleko wangaphandle.

Odd-numbered-layer PCBs kufuneka ukongeza non-standard laminated core bonding inkqubo bonding esekelwe kwinkqubo yesakhiwo core.Xa kuthelekiswa nolwakhiwo lwenyukliya, ukusebenza kakuhle kwemveliso yeefektri ezongeza ifoyile kwisakhiwo senyukliya kuya kuncipha.Ngaphambi kokuba i-lamination kunye ne-bonding, i-core yangaphandle idinga ukuqhutyelwa okongeziweyo, okwandisa umngcipheko wokukrazula kunye neempazamo ze-etch kumaleko angaphandle.

Isakhiwo sokulinganisela ukuphepha ukugoba

Esona sizathu silungileyo sokungayila i-PCB enenani elingaqhelekanga leeleya kukuba inani elingaqhelekanga leebhodi zesekethe zomaleko kulula ukugoba.Xa i-PCB ipholile emva kwenkqubo yokudibanisa i-multi-layer circuit bonding, i-lamination eyahlukeneyo ye-lamination ye-core structure kunye ne-foil-clad structure iya kubangela ukuba i-PCB igobe.Njengoko ubukhulu bebhodi yesekethe bukhula, umngcipheko wokugoba we-PCB edibeneyo enezakhiwo ezibini ezahlukeneyo uyanda.Isitshixo sokuphelisa ukugoba kwebhodi yesekethe kukwamkela isitaki esilungeleleneyo.

Nangona i-PCB enomlinganiselo othile wokugoba ihlangabezana neemfuno ezibaluliweyo, ukusebenza kakuhle okulandelayo kuya kuncitshiswa, okukhokelela ekonyukeni kweendleko.Ngenxa yokuba izixhobo ezikhethekileyo kunye nobugcisa bufunekayo ngexesha lokuhlanganisana, ukuchaneka kokubekwa kwecandelo kuyancitshiswa, okuya kulimaza umgangatho.

Sebenzisa iPCB enamanani alinganayo

Xa iPCB enamanani angaqhelekanga ibonakala kuyilo, ezi ndlela zilandelayo zingasetyenziswa ukuphumeza ukupakishwa okulinganayo, ukunciphisa iindleko zokwenziwa kwePCB, kwaye kuthintelwe ukugoba kwePCB.Ezi ndlela zilandelayo zicwangciswe ngokulandelelana kokukhethwa.

Umaleko wesiginali kwaye uyisebenzise.Le ndlela ingasetyenziswa ukuba umaleko wamandla woyilo lwePCB ulinganayo kwaye umaleko wesiginali awuqhelekanga.Uluhlu olongezelelweyo alunyusi iindleko, kodwa lunokunciphisa ixesha lokuhambisa kunye nokuphucula umgangatho we-PCB.

Yongeza umaleko wamandla ongezelelweyo.Le ndlela ingasetyenziswa ukuba umaleko wamandla woyilo lwePCB awuqhelekanga kwaye umaleko wesiginali ulinganayo.Indlela elula kukongeza umaleko phakathi kwesitaki ngaphandle kokutshintsha ezinye izicwangciso.Okokuqala, hambisa iingcingo kumaleko angama-odd-numbered PCB, emva koko ukope umaleko womhlaba embindini, kwaye umakishe umaleko oseleyo.Oku kuyafana neempawu zombane zomaleko otyebileyo wefoyile.

Yongeza umaleko wesignali ongenanto kufutshane nombindi wesitaki sePCB.Le ndlela inciphisa ukungalingani kwaye iphucula umgangatho we-PCB.Okokuqala, landela iileya ezinamanani angaqhelekanga kwindlela, emva koko wongeza umaleko wesignali ongenanto, kwaye uphawule izaleko eziseleyo.Isetyenziswa kwiisekethe ze-microwave kunye nemidiya edibeneyo (ii-dielectric constants ezahlukeneyo) iisekethe.

Izinto eziluncedo kwi-PCB ye-laminated elinganayo

Iindleko eziphantsi, akulula ukugoba, ukunciphisa ixesha lokuhambisa kunye nokuqinisekisa umgangatho.