-Ukusuka kwihlabathi lePCB,
Ukutsha kwezinto, okukwaziwa ngokuba yi-flame retardancy, ukuzicima, ukumelana nomlilo, ukumelana nomlilo, ukumelana nomlilo, ukutsha kunye nokunye ukutsha, kukuvavanya amandla ezinto eziphathekayo ukuxhathisa ukutsha.
Isampuli yezinto ezinokutsha zivutha ngumlilo ohlangabezana neemfuno, kwaye ilangatye liyasuswa emva kwexesha elichaziweyo.Inqanaba lokutsha livavanywa ngokweqondo lokutsha kwesampulu.Kukho amanqanaba amathathu.Indlela yokuvavanya ethe tye yesampulu ihlulwe kwi-FH1, FH2, i-FH3 inqanaba lesithathu, indlela yokuvavanya ngokuthe nkqo ihlukaniswe kwi-FV0, FV1, VF2.
Ibhodi PCB eqinileyo yahlulwe ibhodi HB kunye V0 ibhodi.
Iphepha le-HB linedangatye eliphantsi kwaye lisetyenziswa kakhulu kwiibhodi ezicalanye.
Ibhodi ye-VO inokudityaniswa kwedangatye eliphezulu kwaye isetyenziswa kakhulu kwiibhodi ezinamacala aphindwe kabini kunye neebhodi ezininzi.
Olu hlobo lwebhodi ye-PCB ehlangabezana neemfuno zokulinganisa umlilo we-V-1 iba yibhodi ye-FR-4.
I-V-0, i-V-1, kunye ne-V-2 ngamabakala angangeni emlilweni.
Ibhodi yesekethe kufuneka ikwazi ukumelana nomlilo, ayikwazi ukutshisa kwiqondo lokushisa elithile, kodwa inokuthamba kuphela.Iqondo lobushushu ngeli xesha libizwa ngokuba yi-glass transition yeqondo lobushushu (i-Tg point), kwaye eli xabiso linxulumene nozinzo lwe-dimensional yebhodi ye-PCB.
Yintoni ibhodi yesekethe yeTg PCB ephezulu kunye neenzuzo zokusebenzisa i-Tg PCB ephezulu?
Xa ubushushu bebhodi eprintiweyo ye-Tg ephakamileyo iphakama kwindawo ethile, i-substrate iya kutshintsha ukusuka "kwi-glass state" ukuya kwi "rubber state".Iqondo lobushushu ngeli xesha libizwa ngokuba yi-glass transition temperature (Tg) yebhodi.Ngamanye amazwi, i-Tg lelona qondo lobushushu liphezulu apho i-substrate igcina ukuqina.
Zeziphi iintlobo ezithile iibhodi PCB?
Yahlulwe ngokwenqanaba ukusuka ezantsi ukuya phezulu ngolu hlobo lulandelayo:
94HB - 94VO - 22F - CEM-1 - CEM-3 - FR-4
Iinkcukacha zezi zilandelayo:
94HB: ikhadibhodi eqhelekileyo, hayi umlilo (esona bakala lisezantsi imathiriyeli, die punching, ayikwazi ukusetyenziswa njengebhodi unikezelo lwamandla)
94V0: IKhadibhodi eBuyiselwa lidangatye (Die Punching)
I-22F: Ibhodi yefayibha yeglasi enecala elinye (i-die punching)
I-CEM-1: Ibhodi ye-fiberglass enecala elinye (ukubhola kwekhompyuter kuyafuneka, ungafi ukubethelwa)
I-CEM-3: Ibhodi yefayibha yeglasi enamacala amabini (ngaphandle kwekhadibhodi enamacala amabini, yeyona nto isezantsi isiphelo sebhodi enamacala amabini, elula
Esi sixhobo singasetyenziselwa iiphaneli eziphindwe kabini, ezixabisa i-5 ~ 10 yuan/square meter kune-FR-4)
I-FR-4: Ibhodi ye-fiberglass enamacala amabini
Ibhodi yesekethe kufuneka ikwazi ukumelana nomlilo, ayikwazi ukutshisa kwiqondo lokushisa elithile, kodwa inokuthamba kuphela.Iqondo lobushushu ngeli xesha libizwa ngokuba yi-glass transition yeqondo lobushushu (i-Tg point), kwaye eli xabiso linxulumene nozinzo lwe-dimensional yebhodi ye-PCB.
Yintoni ibhodi yesekethe yeTg PCB ephezulu kunye neenzuzo zokusebenzisa i-Tg PCB ephezulu.Xa iqondo lokushisa liphakama kwindawo ethile, i-substrate iya kutshintsha ukusuka "kwi-glass state" ukuya kwi "rubber state".
Iqondo lobushushu ngelo xesha libizwa ngokuba yi-glass transition temperature (Tg) yepleyiti.Ngamanye amazwi, i-Tg lelona qondo lobushushu liphezulu (°C) apho i-substrate igcina ukuqina.Oko kukuthi, izinto eziqhelekileyo ze-substrate ze-PCB azivelisi kuphela ukuthambisa, ukuguqulwa, ukunyibilika kunye nezinye izinto kumaqondo aphezulu, kodwa zibonisa ukwehla okubukhali kwimpawu zoomatshini kunye nombane (ndicinga ukuba awufuni ukubona ukuhlelwa kweebhodi zePCB. kwaye ubone le meko kwiimveliso zakho.
Ipleyiti ye-Tg ngokubanzi ingaphezulu kwe-130 degrees, i-Tg ephakamileyo idla ngokungaphezulu kwe-170 degrees, kwaye i-Tg ephakathi imalunga ne-150 degrees.
Ngokuqhelekileyo iibhodi eziprintiweyo ze-PCB ezine-Tg ≥ 170 ° C zibizwa ngokuba ziibhodi eziprintiweyo eziphezulu zeTg.
Njengoko i-Tg ye-substrate iyanda, ukuchasana nokushisa, ukunyanzeliswa komswakama, ukuchasana kweekhemikhali, ukuzinza kunye nezinye iimpawu zebhodi eprintiweyo ziya kuphuculwa kwaye ziphuculwe.Ukuphakama kwexabiso le-TG, bhetele ukumelana nokushisa kwebhodi, ngokukodwa kwinkqubo yokukhokela, apho izicelo eziphezulu ze-Tg zixhaphake kakhulu.
I-Tg ephezulu ibhekisela ekuxhathiseni ukushisa okuphezulu.Ngophuhliso olukhawulezayo lweshishini lombane, ngakumbi iimveliso ze-elektroniki ezimelwe ziikhompyuter, uphuhliso lwentsebenzo ephezulu kunye ne-multilayers ephezulu ifuna ukuxhathisa ubushushu obuphezulu bezinto ezincinci ze-PCB njengesiqinisekiso esibalulekileyo.Ukuvela kunye nophuhliso lobuchwepheshe obuphezulu obuphezulu obumelwe yi-SMT kunye ne-CMT buye benza ii-PCBs ngakumbi kwaye zahluke kakhulu kwinkxaso yokumelana nobushushu obuphezulu be-substrates ngokubhekiselele kwi-aperture encinci, i-wiring emihle, kunye nokunciphisa.
Ngoko ke, umahluko phakathi kwe-FR-4 jikelele kunye ne-Tg FR-4 ephezulu: ikwimeko eshushu, ngakumbi emva kokufunxa umswakama.
Ngaphantsi kobushushu, kukho ukungafani kumandla omatshini, ukuzinza kwe-dimensional, i-adhesion, i-absorption yamanzi, ukuchithwa kwe-thermal, kunye nokwandiswa kwe-thermal yezinto.Iimveliso ze-Tg eziphakamileyo ngokucacileyo zingcono kunezixhobo eziqhelekileyo ze-PCB substrate.
Kwiminyaka yakutshanje, inani labathengi abafuna ukuveliswa kweebhodi eziphezulu zeTg eziprintiweyo liye landa unyaka nonyaka.
Ngophuhliso kunye nenkqubela phambili yobuchwepheshe be-elektroniki, iimfuno ezintsha zihlala zibekwe phambili kwizinto eziprintiweyo zebhodi yesekethe ye-substrate, ngaloo ndlela kukhuthazwa uphuhliso oluqhubekayo lwemigangatho yobhedu ye-laminate.Okwangoku, imigangatho ephambili yezinto ze-substrate zilandelayo.
① Imigangatho yeSizwe Okwangoku, imigangatho yelizwe lam yokuhlelwa kwezixhobo zePCB kwiisubstrates ziquka iGB/
I-T4721-47221992 kunye ne-GB4723-4725-1992, imigangatho ye-laminate ye-copper clad e-Taiwan, i-China yimigangatho ye-CNS, esekelwe kumgangatho we-JIs yaseJapan kwaye yakhutshwa kwi-1983.
②Eminye imigangatho yesizwe ibandakanya: imigangatho ye-JIS yaseJapan, i-ASTM yaseMelika, i-NEMA, i-MIL, i-IPc, i-ANSI, imigangatho ye-UL, imigangatho ye-Bs yaseBritani, imigangatho ye-DIN yaseJamani kunye ne-VDE, imigangatho ye-NFC yaseFransi kunye ne-UTE, kunye neMigangatho ye-CSA yaseCanada, i-AS standard yase-Australia, yangaphambili Umgangatho we-FOCT weSoviet Union, umgangatho we-IEC wamazwe ngamazwe, njl.
Ababoneleli bezinto zokuqala zoyilo lwePCB ziqhelekileyo kwaye zisetyenziswa ngokuqhelekileyo: Shengyi \ Jiantao \ International, njl.
● Yamkela amaxwebhu: i-protel autocad powerpcb orcad gerber okanye ibhodi yokwenene yekopi yebhodi, njl.
● Iintlobo zephepha: CEM-1, CEM-3 FR4, izinto eziphezulu zeTG;
● Ubungakanani bebhodi enkulu: 600mm * 700mm (24000mil * 27500mil)
● Ubukhulu bebhodi yokulungisa: 0.4mm-4.0mm (15.75mil-157.5mil)
● Elona nani liphezulu leeleya zokusetyenzwa: 16Layers
● Ubukhulu befoyile yobhedu: 0.5-4.0(oz)
● Ukunyamezela ubukhulu bebhodi egqityiweyo: +/-0.1mm(4mil)
● Ukunyamezela ubungakanani bokubumba: ukugaya ikhompyutha: 0.15mm (6mil) ipleyiti yokubethelela ukufa: 0.10mm (4mil)
● Ubuncinci bobubanzi bomgca / isithuba: 0.1mm (4mil) Isakhono sokulawula ububanzi bomgca: <+-20%
● Ubuncinane bomngxuma wedayamitha yemveliso egqityiweyo: 0.25mm (10mil)
Ubuncinci bomngxuma wokugqobhoza ubukhulu bemveliso egqityiweyo: 0.9mm (35mil)
Ukunyamezela umngxuma ogqityiweyo: PTH: +-0.075mm(3mil)
NPTH: +-0.05mm(2mil)
● Umngxuma ogqitywe ukutyeba kobhedu: 18-25um (0.71-0.99mil)
● Ubuncinane besithuba sesithuba se-SMT: 0.15mm (6mil)
● Ukwaleka komphezulu: igolide yokuntywiliselwa ngekhemikhali, isitshizi senkcenkce, igolide efakwe i-nickel (amanzi/igolide ethambileyo), i-silika screen blue glue, njl.
● Ubukhulu bemaski ye-solder ebhodini: 10-30μm (0.4-1.2mil)
● Amandla okuxobula: 1.5N/mm (59N/mil)
● Ukuqina kwemaski yesoda: >5H
● Iplagi yemaski yeSolder umthamo womngxuma: 0.3-0.8mm (12mil-30mil)
● I-Dielectric engatshintshiyo: ε = 2.1-10.0
● Ukuxhatshazwa kwe-insulation: 10KΩ-20MΩ
● Ukuphazamiseka kophawu: 60 ohm±10%
● Ukothuka kweThermal: 288℃, 10 sec
● I-Warpage yebhodi egqityiweyo: <0.7%
● Ukusetyenziswa kwemveliso: izixhobo zokunxibelelana, i-automotive electronics, i-instrumentation, inkqubo yokumisa i-globaal, ikhompyutha, i-MP4, ukunikezelwa kwamandla, izixhobo zasekhaya, njl.